EP4SGX290NF45C4G

IC FPGA 920 I/O 1932FCBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 1,095 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O920Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells291200
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits17661952

Overview of EP4SGX290NF45C4G – Field Programmable Gate Array (FPGA) IC

The EP4SGX290NF45C4G is an Intel Stratix IV family field-programmable gate array (FPGA) IC engineered for designs that require high logic density, large embedded memory, and extensive I/O capability. The device leverages the Stratix IV architecture to provide infrastructure for high-bandwidth, DSP-oriented, and system-integration applications.

With 291,200 logic elements, approximately 17.66 Mbits of embedded memory, and 920 I/O pins, this commercial-grade, surface-mount FCBGA device is targeted at applications needing substantial on-chip resources while operating within a commercial temperature range (0 °C to 85 °C) and a core supply range of 870 mV to 930 mV.

Key Features

  • Stratix IV architecture Includes architecture-level features such as DSP blocks, PLLs, and advanced clock networks that support high-performance digital processing (as described in the Stratix IV device handbook).
  • Logic capacity 291,200 logic elements provide a high-density fabric for complex logic integration and large-scale state machines.
  • Embedded memory Approximately 17.66 Mbits of on-chip RAM to support buffers, packet queues, and DSP data storage.
  • Extensive I/O 920 user I/O pins to support broad peripheral connectivity and multiple external memory or interface channels.
  • High-speed transceiver and I/O features Stratix IV family documentation highlights high-speed differential I/O and transceiver features suited for high aggregate data bandwidth and protocol support.
  • Power and supply Core voltage supply range specified at 870 mV to 930 mV for the device’s internal power domains.
  • Package and mounting 1932-ball FCBGA package (1932-BBGA / 1932-FBGA, FC 45×45) in a surface-mount form factor for board-level integration.
  • Commercial temperature grade Rated for 0 °C to 85 °C operation and RoHS compliant for regulatory and manufacturing considerations.

Typical Applications

  • High-speed networking and switching Large logic capacity and high aggregate data bandwidth capabilities make the device suitable for packet processing, switching fabrics, and network interface applications.
  • Digital signal processing (DSP) On-chip memory and Stratix IV DSP-friendly architecture support FIR/IIR filtering, FFTs, and other real-time signal-processing workloads.
  • High-throughput data acquisition Abundant I/O and embedded RAM enable buffering and preprocessing of high-rate sensor or sampling data streams.
  • System integration and prototyping Dense logic fabric and rich I/O allow consolidation of multiple functions onto a single FPGA for proof-of-concept and production systems.

Unique Advantages

  • High logic density: 291,200 logic elements allow complex algorithms and large state machines to be implemented on one device, reducing system BOM.
  • Significant on-chip memory: Approximately 17.66 Mbits of embedded RAM supports deep buffering and data-path storage without relying solely on external memory.
  • Large I/O count: 920 I/O pins provide flexibility for multi-channel interfaces, external memory buses, and parallel peripherals.
  • Architectural building blocks: Stratix IV family features such as DSP blocks, PLLs, and advanced clock networks simplify design of high-performance signal-processing and timing-critical systems.
  • Board-level integration: 1932-ball FCBGA surface-mount package enables compact board layouts and high-density system designs.
  • Commercial-grade compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Why Choose EP4SGX290NF45C4G?

The EP4SGX290NF45C4G combines a high count of logic elements, substantial embedded memory, and a very large I/O complement within the Stratix IV architectural framework. It is positioned for designs that demand integrated DSP capabilities, extensive interfacing, and high data throughput while maintaining a commercial operating profile.

This device is well suited to engineering teams building high-bandwidth networking equipment, real-time signal-processing systems, and complex system-on-FPGA implementations that benefit from the Stratix IV feature set and Intel device documentation support.

Request a quote or submit an inquiry to receive pricing, availability, and further technical assistance for EP4SGX290NF45C4G.

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