EP4SGX290NF45C3

The EP4SGX290NF45C3 is a Stratix IV GX field programmable gate array (FPGA) from Intel, supplied in a 1932-ball BGA (FCBGA) package. It combines high logic density, substantial on-chip embedded memory and a large I/O count to support complex digital designs that require dense logic, on-chip storage, and extensive external connectivity.

Device documentation for the Stratix IV family includes specifications for transceivers, PLLs, DSP blocks, TriMatrix memory and configuration/JTAG functionality, making this device suited to applications that leverage dedicated signal-processing and high-speed I/O resources.

Key Features

• High Logic Density — 291,200 logic elements suitable for large, complex designs.
• Embedded Memory — Approximately 17.66 Mbits of on-chip RAM to support buffering, lookup tables and local data storage.
• Extensive I/O — 920 user I/O pins to interface with multiple high-pin-count peripherals and subsystems.
• Dedicated On-Chip Blocks — Device handbook and datasheet sections cover DSP block specifications, TriMatrix memory blocks, and PLLs for timing and signal-processing tasks.
• High-Speed Serial Support — Datasheet includes Transceiver Performance Specifications for designs requiring high-speed serial connectivity.
• Configuration and Debug — Configuration and JTAG specifications are provided in device documentation for programming and boundary-scan debug.
• Package & Mounting — 1932-ball BGA (FCBGA) package, supplier package listed as 1932-FBGA (45 × 45 mm); surface-mount mounting type.
• Core Voltage — Core supply range of 870 mV to 930 mV.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature.
• Manufacturer — Intel (Stratix IV device family documentation and device datasheet available).

Typical Applications

• High-speed communications — Use on-chip transceivers and large I/O count for board-level networking, PHY interfacing and serial links.
• Signal processing and imaging — Leverage integrated DSP blocks and substantial embedded memory for filtering, transforms and real-time data paths.
• High-density logic consolidation — Replace multi-chip glue logic by implementing complex control, protocol handling and state machines within the FPGA’s 291,200 logic elements.

Unique Advantages

• High integration density: 291,200 logic elements reduce the need for multiple discrete logic devices and simplify board-level design.
• Significant on-chip memory: Approximately 17.66 Mbits of embedded RAM provides local storage for buffering and intermediate data processing.
• Large external connectivity: 920 I/O pins enable broad peripheral and interface support without external expanders.
• Platform features documented in device handbook: Dedicated sections for transceivers, PLLs, DSP blocks, TriMatrix memory and configuration/JTAG provide designers with detailed implementation guidance.
• Compact, surface-mount BGA packaging: 1932-ball FCBGA (45 × 45 mm) provides a high pin count in a board-friendly surface-mount form factor.
• Commercial-grade availability: Specified operating range of 0 °C to 85 °C for typical commercial deployments.

Why Choose EP4SGX290NF45C3?

The EP4SGX290NF45C3 positions itself as a high-density Stratix IV GX FPGA well suited for designs that demand a combination of large logic capacity, extensive I/O and on-chip RAM. The device is supported by Stratix IV family documentation that details high-speed transceiver behavior, DSP resources, clocking (PLLs) and configuration options—providing engineers with the technical reference material needed for complex implementations.

This device is ideal for engineers and system designers targeting commercial applications such as communications boards, signal-processing appliances and high-density logic consolidation. Its combination of resources and documented features delivers a scalable platform for sophisticated digital systems while relying on Intel’s Stratix IV device handbook and datasheet for design guidance.

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