EP4SGX290NF45C2G

The EP4SGX290NF45C2G is an Intel FPGA from the Stratix IV device family, delivered in a high-density FCBGA package for surface-mount applications. Its architecture provides a large fabric of logic elements, substantial on-chip RAM, and a high pin count to support complex digital designs in commercial-temperature systems.

Designed for applications that require dense programmable logic and extensive I/O, this device targets high-bandwidth processing, system integration, and complex control or protocol implementation where high logic capacity and plentiful I/O are required.

Key Features

• Core Logic Capacity  291,200 logic elements and 11,648 logic blocks provide significant programmable fabric for complex designs and deep logic implementation.
• Embedded Memory  Approximately 17.66 Mbits of on-chip RAM (17,661,952 total RAM bits) to support large buffers, FIFOs, and memory-intensive functions.
• I/O Density  Up to 920 user I/O pins enable broad peripheral and interface connectivity for multi-channel systems and parallel interfaces.
• Package & Mounting  1932-ball FCBGA (1932-FBGA / 1932-BBGA) supplier package, 45×45 footprint, optimized for surface-mount assembly.
• Power Supply  Core voltage specified from 870 mV to 930 mV for device core power domains.
• Operating Conditions  Commercial temperature grade with an operating range of 0 °C to 85 °C suitable for standard commercial environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-Bandwidth Networking  Leverage the large logic count and high I/O count to implement packet processing, protocol bridging, and interface aggregation.
• Digital Signal Processing  Use the substantial on-chip RAM and dense logic fabric for DSP pipelines, buffering, and custom acceleration blocks.
• System Integration & Prototyping  Combine many I/Os and programmable logic to integrate multiple subsystems, validate designs, or create complex prototypes.
• Custom Control & Automation  Implement multi-channel control logic, timing-critical state machines, and user-defined interfaces within the commercial temperature range.

Unique Advantages

• High Logic Density: 291,200 logic elements enable implementation of large-scale custom logic and complex finite-state systems without offloading to external devices.
• Substantial Embedded Memory: Approximately 17.66 Mbits of on-chip RAM reduces dependency on external memory for buffering and temporary storage, simplifying board design.
• Extensive I/O Count: 920 I/O pins provide flexibility to connect multiple peripherals, parallel buses, or multi-lane interfaces directly to the FPGA fabric.
• Compact BGA Packaging: The 1932-ball FCBGA package delivers a high pin-density solution in a surface-mount form factor for space-constrained PCBs.
• Commercial-Grade Temperature: Rated 0 °C to 85 °C for deployments in standard commercial environments where that range is required.
• Regulatory Compliance: RoHS compliance supports environmentally conscious product development and global electronics requirements.

Why Choose EP4SGX290NF45C2G?

The EP4SGX290NF45C2G offers a combination of high logic capacity, substantial on-chip RAM, and a very large I/O complement in a 1932-ball FCBGA package, making it well suited to complex commercial applications that demand integration and flexibility. As a member of the Stratix IV family, it aligns with design flows targeting high-density programmable logic and system integration.

This part is ideal for engineering teams building high-bandwidth processing, custom acceleration, or multi-interface control systems that require scalable logic resources, significant embedded memory, and extensive connectivity while operating in commercial temperature environments.

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