EP4SGX290KF43I4G

IC FPGA 880 I/O 1760FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 1,538 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O880Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells291200
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits17661952

Overview of EP4SGX290KF43I4G – Field Programmable Gate Array (FPGA) IC

The EP4SGX290KF43I4G is a high-capacity FPGA from Intel, based on the Stratix IV device family as documented in the Stratix IV Device Handbook. It combines a large programmable fabric, substantial embedded memory, and extensive I/O to support high-throughput, system-level designs.

Designed for industrial-grade applications, this device targets designs that require high logic density, robust clocking and PLL resources, and advanced I/O and transceiver capabilities for demanding communications and signal-processing tasks.

Key Features

  • Programmable logic — Approximately 291,200 logic elements to implement complex custom logic and state machines.
  • Embedded memory — Approximately 17.66 Mbits of on-chip RAM for buffers, FIFOs, and memory-mapped functions.
  • I/O capacity — 880 I/O pins to support wide external interfacing and multi-channel connectivity.
  • High-speed transceiver and I/O features — Device handbook references high-speed differential I/O with features such as DPA and Soft-CDR and support for a wide range of protocol implementations.
  • Clocking and synchronization — Integrated clock networks and PLL resources documented in the Stratix IV handbook for flexible clock management.
  • Device packaging — 1760-FCBGA package (42.5 × 42.5 mm) in a 1760-BBGA/FCBGA footprint for high-density board integration.
  • Power and supply — Core voltage supply specified from 870 mV to 930 mV for defined power planning.
  • Industrial temperature range — Rated for -40 °C to 100 °C operating temperature for industrial environments.
  • System-level features — Stratix IV family documentation highlights external memory interfaces, DSP blocks, diagnostic features, and signal-integrity tools for advanced system integration.

Typical Applications

  • High-speed communications — Use the device’s high-speed I/O and transceiver features to implement protocol handling and aggregate data transport.
  • Signal processing — Leverage the large logic capacity and embedded memory for DSP pipelines and real-time processing tasks.
  • External memory interface controllers — Implement controllers and interfaces that take advantage of the device’s documented external memory interface capabilities.
  • System integration and prototyping — Combine abundant I/O and clocking resources to integrate multiple subsystems on a single FPGA platform.

Unique Advantages

  • High logic capacity: Approximately 291,200 logic elements enable complex, large-scale designs without partitioning across multiple devices.
  • Substantial on-chip memory: Approximately 17.66 Mbits of embedded RAM reduce external memory dependence for buffering and caching.
  • Extensive I/O: 880 I/O pins provide flexibility for multi-interface systems and dense peripheral connectivity.
  • Industrial-rated thermal range: -40 °C to 100 °C operating range supports deployment in industrial environments.
  • Defined power envelope: Core voltage 870–930 mV simplifies power-supply design and validation.
  • Comprehensive device documentation: Supported by the Stratix IV Device Handbook, which details transceiver, clocking, DSP, and system-integration features.

Why Choose EP4SGX290KF43I4G?

The EP4SGX290KF43I4G positions itself as a high-capacity, industrial-grade FPGA choice for engineers who need significant logic resources, on-chip memory, and extensive I/O in a single package. Its specifications—large logic element count, substantial embedded RAM, and support for advanced I/O and transceiver features—make it suitable for demanding communications, signal processing, and system-integration applications.

Backed by the Stratix IV device documentation from Intel, this device provides the technical foundation engineers need for complex implementations while offering predictable power and thermal characteristics for industrial deployments.

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