EPF10K10ATI144-3

IC FPGA 102 I/O 144TQFP
Part Description

FLEX-10KA® Field Programmable Gate Array (FPGA) IC 102 6144 576 144-LQFP

Quantity 191 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case144-LQFPNumber of I/O102Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs72Number of Logic Elements/Cells576
Number of Gates31000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits6144

Overview of EPF10K10ATI144-3 – FLEX-10KA® Field Programmable Gate Array (FPGA) IC 102 6144 576 144-LQFP

The EPF10K10ATI144-3 is a FLEX 10KA family FPGA offering embedded programmable logic and memory resources in a 144-LQFP package. Built for embedded system integration, it combines a logic array and embedded array blocks to implement custom logic, on-chip memory functions and system glue logic for industrial applications.

With support for in-circuit reconfigurability and boundary-scan test, this device targets designs that require configurable logic, compact memory megafunctions and reliable operation across an industrial temperature range.

Key Features

  • Logic Capacity — 576 logic elements organized into 72 logic array blocks, enabling medium-density custom logic implementations.
  • Embedded Memory — Total of 6,144 RAM bits across embedded array blocks (EABs) for implementing on-chip buffers, FIFOs or small memory megafunctions.
  • System Gates — Device supports up to approximately 31,000 system gates for combined logic and memory functions.
  • I/O — 102 user I/O pins provided in the 144-LQFP package for peripheral interfacing and board-level connectivity.
  • Configuration & Test — In-circuit reconfigurability via external configuration device or JTAG; built-in IEEE 1149.1 boundary-scan test circuitry.
  • Power — Designed for operation from 3.0 V to 3.6 V supply range as specified for this part.
  • Package & Mounting — 144-lead LQFP (supplier package 144-TQFP, 20 × 20 mm) with surface-mount mounting type for compact PCB designs.
  • Industrial Temperature — Rated for operation from −40°C to 85°C for industrial environments.
  • Standards & Family-Level Features — FLEX 10K family features cited in the data include FastTrack interconnect, dedicated carry and cascade chains, low-skew clock distribution, and multi-volt I/O interface support.
  • Compliance — RoHS compliant.

Typical Applications

  • Embedded Control — Implement control logic, state machines and interface glue for industrial controllers and automation modules using on-chip logic and memory.
  • Custom I/O and Protocol Bridging — Use the 102 I/O pins and flexible I/O options to implement protocol converters, bus bridging and custom peripheral interfaces.
  • Memory Megafunctions — Leverage the device’s embedded array blocks and 6,144 bits of RAM for small on-chip buffers, FIFOs and lookup tables.
  • Prototyping and Small-System SOPC — Suitable for system-on-a-programmable-chip development where in-circuit reconfiguration and JTAG debugging are required.

Unique Advantages

  • Balanced Logic and Memory — A combination of 576 logic elements and embedded RAM enables mixed logic-plus-memory designs without external resources.
  • Compact, Surface-Mount Package — 144-LQFP (20 × 20 mm) minimizes board area while providing ample I/O for typical embedded designs.
  • Industrial Reliability — −40°C to 85°C operating temperature and industrial grade designation support deployment in demanding environments.
  • Reconfiguration and Testability — In-circuit reconfigurability and IEEE 1149.1-compliant JTAG boundary-scan simplify development, programming and board-level testing.
  • Family-Level Interconnect and Arithmetic Support — FLEX 10K family features such as FastTrack routing and dedicated carry/cascade chains accelerate implementation of arithmetic and high-fan-in functions.
  • Regulatory and Environmental Compliance — RoHS compliant for environmentally conscious manufacturing and supply chains.

Why Choose EPF10K10ATI144-3?

The EPF10K10ATI144-3 provides a practical balance of logic resources, embedded memory and I/O density in a compact 144-LQFP package suited for industrial embedded designs. Its support for in-circuit reconfiguration, boundary-scan test and family-level routing and arithmetic features make it well suited for designs that require configurable logic, on-chip memory megafunctions and robust board-level testability.

This device is a fit for engineering teams designing medium-density programmable logic solutions who need an industrial temperature grade part, surface-mount packaging, and established family-level features for predictable implementation and integration.

Request a quote or submit an inquiry to discuss availability, pricing and lead time for the EPF10K10ATI144-3.

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