EPF10K10ATC144-3

IC FPGA 102 I/O 144TQFP
Part Description

FLEX-10KA® Field Programmable Gate Array (FPGA) IC 102 6144 576 144-LQFP

Quantity 763 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 70°C
Package / Case144-LQFPNumber of I/O102Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs72Number of Logic Elements/Cells576
Number of Gates31000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits6144

Overview of EPF10K10ATC144-3 – FLEX-10KA Field Programmable Gate Array, 102 I/O, 6,144 bits RAM, 576 LEs, 144-LQFP

The EPF10K10ATC144-3 is a FLEX-10KA family FPGA offering mid-range programmable logic and embedded memory in a 144‑pin LQFP package. Built for commercial embedded designs, it combines 576 logic elements and approximately 6,144 bits of on-chip RAM with 102 user I/O pins to implement custom control, interface, and system-in-a-chip (SOPC) functions.

With a 3.0–3.6 V supply range, surface-mount 144-LQFP package, and JTAG boundary-scan support, this device targets applications that require compact, reconfigurable logic and moderate memory and I/O capacity inside the commercial temperature window.

Key Features

  • Logic Capacity — 576 logic elements and 72 logic array blocks provide the mid-range gate count needed for custom control, glue logic, and protocol bridging.
  • Embedded Memory — Approximately 6,144 bits of on-chip RAM (embedded array blocks) for small buffers, FIFOs, and megafunction implementation.
  • I/O and Interfaces — 102 user I/O pins in a 144-LQFP package enable multiple external interfaces and board-level connectivity while retaining a compact footprint.
  • Supply and Temperature — Operates from 3.0 V to 3.6 V and rated for commercial operation from 0 °C to 70 °C, suitable for consumer and business-class embedded systems.
  • Packaging and Mounting — Surface-mount 144-LQFP (supplier package listed as 144-TQFP, 20 × 20) supports standard PCB assembly and compact board layouts.
  • System & Test Features — Built-in JTAG boundary-scan (IEEE 1149.1) for board-level test and in-circuit reconfigurability via external configuration device or JTAG port.
  • Architecture Enhancements — FastTrack interconnect, dedicated carry and cascade chains, and multiple global clock/clear signals (as described for the FLEX 10K family) provide predictable routing and efficient implementation of arithmetic and high‑fan‑in functions.
  • RoHS Compliant — Device meets RoHS environmental requirements for lead-free assembly.

Typical Applications

  • Embedded Control — Implement motor control logic, state machines, and custom timing functions that benefit from reprogrammable logic and on-chip RAM.
  • Interface Bridging — Perform protocol translation and glue logic between peripherals using the device’s 102 I/O pins and dedicated interconnect resources.
  • Consumer & Commercial Electronics — Integrate custom user-interface controllers, signal conditioning logic, or feature-rich modules within the commercial temperature range.
  • Prototyping and Low-Volume Production — Use the FLEX-10KA architecture to prototype SOPC-style integration and migrate designs that require in-circuit reconfigurability and boundary-scan test access.

Unique Advantages

  • Compact, Mid-Range Integration: 576 logic elements and ~6,144 bits of RAM deliver the right balance of logic and memory for medium-complexity designs without excessive board area.
  • Flexible I/O Count: 102 user I/O pins in a 144-LQFP package maximize connectivity for multi‑signal interfaces while maintaining a small package footprint.
  • In-Circuit Reconfigurability: Support for configuration via external devices or JTAG lets you update logic in-system for field upgrades and design iteration.
  • Built-In Testability: IEEE 1149.1 JTAG boundary-scan facilitates board-level testing and manufacturing diagnostics without consuming user logic.
  • Predictable Interconnect and Arithmetic Support: FastTrack routing plus dedicated carry and cascade chains simplify implementation of adders, counters, and high‑fan‑in logic for deterministic timing.
  • Commercial-Grade, RoHS Compliant: Designed for commercial applications with RoHS compliance for lead-free assembly requirements.

Why Choose EPF10K10ATC144-3?

The EPF10K10ATC144-3 delivers a balanced combination of logic, embedded memory, and I/O in a compact 144‑pin LQFP package, making it well suited for commercial embedded designs that need reconfigurable logic and moderate on-chip RAM. Its architecture features—such as dedicated carry/cascade chains, predictable FastTrack interconnect, and JTAG-based testability—help reduce design complexity and shorten development cycles.

Choose this device for mid-range SOPC implementations, interface bridging, and control applications where commercial temperature operation and a small form factor are primary considerations. The FLEX 10K family’s ecosystem provides architecture-level features and development tool support that help scale designs within the same package family.

Request a quote or submit a pricing and availability inquiry to receive lead-time and ordering information for the EPF10K10ATC144-3.

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