EPF10K10ATC144-3
| Part Description |
FLEX-10KA® Field Programmable Gate Array (FPGA) IC 102 6144 576 144-LQFP |
|---|---|
| Quantity | 763 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 102 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 72 | Number of Logic Elements/Cells | 576 | ||
| Number of Gates | 31000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 6144 |
Overview of EPF10K10ATC144-3 – FLEX-10KA Field Programmable Gate Array, 102 I/O, 6,144 bits RAM, 576 LEs, 144-LQFP
The EPF10K10ATC144-3 is a FLEX-10KA family FPGA offering mid-range programmable logic and embedded memory in a 144‑pin LQFP package. Built for commercial embedded designs, it combines 576 logic elements and approximately 6,144 bits of on-chip RAM with 102 user I/O pins to implement custom control, interface, and system-in-a-chip (SOPC) functions.
With a 3.0–3.6 V supply range, surface-mount 144-LQFP package, and JTAG boundary-scan support, this device targets applications that require compact, reconfigurable logic and moderate memory and I/O capacity inside the commercial temperature window.
Key Features
- Logic Capacity — 576 logic elements and 72 logic array blocks provide the mid-range gate count needed for custom control, glue logic, and protocol bridging.
- Embedded Memory — Approximately 6,144 bits of on-chip RAM (embedded array blocks) for small buffers, FIFOs, and megafunction implementation.
- I/O and Interfaces — 102 user I/O pins in a 144-LQFP package enable multiple external interfaces and board-level connectivity while retaining a compact footprint.
- Supply and Temperature — Operates from 3.0 V to 3.6 V and rated for commercial operation from 0 °C to 70 °C, suitable for consumer and business-class embedded systems.
- Packaging and Mounting — Surface-mount 144-LQFP (supplier package listed as 144-TQFP, 20 × 20) supports standard PCB assembly and compact board layouts.
- System & Test Features — Built-in JTAG boundary-scan (IEEE 1149.1) for board-level test and in-circuit reconfigurability via external configuration device or JTAG port.
- Architecture Enhancements — FastTrack interconnect, dedicated carry and cascade chains, and multiple global clock/clear signals (as described for the FLEX 10K family) provide predictable routing and efficient implementation of arithmetic and high‑fan‑in functions.
- RoHS Compliant — Device meets RoHS environmental requirements for lead-free assembly.
Typical Applications
- Embedded Control — Implement motor control logic, state machines, and custom timing functions that benefit from reprogrammable logic and on-chip RAM.
- Interface Bridging — Perform protocol translation and glue logic between peripherals using the device’s 102 I/O pins and dedicated interconnect resources.
- Consumer & Commercial Electronics — Integrate custom user-interface controllers, signal conditioning logic, or feature-rich modules within the commercial temperature range.
- Prototyping and Low-Volume Production — Use the FLEX-10KA architecture to prototype SOPC-style integration and migrate designs that require in-circuit reconfigurability and boundary-scan test access.
Unique Advantages
- Compact, Mid-Range Integration: 576 logic elements and ~6,144 bits of RAM deliver the right balance of logic and memory for medium-complexity designs without excessive board area.
- Flexible I/O Count: 102 user I/O pins in a 144-LQFP package maximize connectivity for multi‑signal interfaces while maintaining a small package footprint.
- In-Circuit Reconfigurability: Support for configuration via external devices or JTAG lets you update logic in-system for field upgrades and design iteration.
- Built-In Testability: IEEE 1149.1 JTAG boundary-scan facilitates board-level testing and manufacturing diagnostics without consuming user logic.
- Predictable Interconnect and Arithmetic Support: FastTrack routing plus dedicated carry and cascade chains simplify implementation of adders, counters, and high‑fan‑in logic for deterministic timing.
- Commercial-Grade, RoHS Compliant: Designed for commercial applications with RoHS compliance for lead-free assembly requirements.
Why Choose EPF10K10ATC144-3?
The EPF10K10ATC144-3 delivers a balanced combination of logic, embedded memory, and I/O in a compact 144‑pin LQFP package, making it well suited for commercial embedded designs that need reconfigurable logic and moderate on-chip RAM. Its architecture features—such as dedicated carry/cascade chains, predictable FastTrack interconnect, and JTAG-based testability—help reduce design complexity and shorten development cycles.
Choose this device for mid-range SOPC implementations, interface bridging, and control applications where commercial temperature operation and a small form factor are primary considerations. The FLEX 10K family’s ecosystem provides architecture-level features and development tool support that help scale designs within the same package family.
Request a quote or submit a pricing and availability inquiry to receive lead-time and ordering information for the EPF10K10ATC144-3.

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