EPF10K10ATC144-1N

IC FPGA 102 I/O 144TQFP
Part Description

FLEX-10KA® Field Programmable Gate Array (FPGA) IC 102 6144 576 144-LQFP

Quantity 837 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 70°C
Package / Case144-LQFPNumber of I/O102Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs72Number of Logic Elements/Cells576
Number of Gates31000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits6144

Overview of EPF10K10ATC144-1N – FLEX-10KA® Field Programmable Gate Array (FPGA) IC 102 6144 576 144-LQFP

The EPF10K10ATC144-1N is an Intel FLEX-10KA family field programmable gate array designed for embedded, system-level programmable logic. It combines a logic array and embedded memory to enable System-on-a-Programmable-Chip (SOPC) integration for custom logic, glue logic, and memory-centric megafunctions.

With 576 logic elements, 72 logic array blocks, approximately 6,144 bits of embedded RAM and 102 user I/Os in a 144-LQFP package, this commercial-grade device targets mid-density embedded applications that require flexible I/O and in-circuit reconfigurability while operating from a 3.0 V to 3.6 V supply at 0 °C to 70 °C.

Key Features

  • Core logic and density — 576 logic elements and 72 logic array blocks (LABs) providing a mid-density programmable fabric suitable for custom control, glue logic and SOPC designs.
  • Embedded memory — Total RAM bits: 6,144, enabling on-chip storage for FIFOs, small buffers, and megafunctions without consuming external memory.
  • IO count and flexibility — 102 user I/O pins with individual tri-state control, open-drain option, and programmable slew-rate control for adaptable board-level interfacing.
  • Packaging and mounting — 144-LQFP surface-mount package (supplier device package: 144-TQFP 20×20) for compact PCB integration.
  • Power and thermal — Operates from 3.0 V to 3.6 V and rated for commercial operating temperatures from 0 °C to 70 °C.
  • System-level features — In-circuit reconfigurability via external configuration device, intelligent controller, or JTAG; built-in JTAG boundary-scan test circuitry compliant with IEEE Std. 1149.1-1990.
  • Advanced interconnect and arithmetic support — Dedicated carry and cascade chains plus FastTrack® continuous routing structure for predictable interconnect delays and efficient implementation of arithmetic and high-fan-in logic functions.
  • Clocking and timing — Built-in low-skew clock distribution with options such as ClockLock™ and ClockBoost™ to reduce clock delay and skew where required by the design.
  • Compliance and environmental — RoHS compliant.

Typical Applications

  • Embedded control and SOPC integration — Implement controllers, protocol adapters, and on-chip megafunctions using the combination of logic elements and embedded RAM.
  • Peripheral and I/O interfacing — 102 I/Os with programmable drive and tri-state options make the device suitable for sensor interfaces, board-level buffering, and custom bus bridges.
  • PCI and legacy bus support — FLEX 10KA family features such as 5.0‑V tolerant inputs and selectable pull-up diodes support designs that must interface with a range of peripheral buses and legacy signaling.
  • Prototyping and low-to-mid density FPGA designs — Mid-range logic density and in-circuit reconfigurability enable rapid design iteration and field updates during development cycles.

Unique Advantages

  • Balanced mid-density integration: 576 logic elements and ~6,144 bits of embedded RAM deliver a compact platform for designs that need both logic and on-chip memory.
  • Flexible I/O options: 102 user I/Os with per-pin control over output enable, slew rate and open-drain behavior reduce external buffering and simplify mixed-signal interfacing.
  • In-circuit reconfigurability and test: Support for ICR and built-in JTAG boundary-scan simplifies board bring-up, programming and production test flows.
  • Predictable timing infrastructure: Dedicated carry/cascade chains, low-skew clock trees, and FastTrack routing help deliver repeatable timing for arithmetic and high-fan-in logic functions.
  • Compact package for space-constrained designs: 144-LQFP (20×20) surface-mount package combines a modest pin count with a small PCB footprint.
  • RoHS compliant: Meets environmental requirements for lead-free assembly and regulatory compliance.

Why Choose EPF10K10ATC144-1N?

The EPF10K10ATC144-1N delivers a practical balance of programmable logic, embedded memory and flexible I/O in a compact 144-LQFP footprint. Its combination of 576 logic elements, 72 LABs, approximately 6,144 bits of on-chip RAM and 102 I/Os makes it well suited for mid-density embedded systems, peripheral bridging, and SOPC-style integration where on-board reconfigurability and testability are valuable.

Designed for commercial applications, the device operates from a 3.0 V to 3.6 V supply and across a 0 °C to 70 °C range, providing predictable behavior for production designs that require in-field configurability, JTAG-based test, and established FPGA routing and clocking features.

Request a quote or submit an inquiry to receive pricing and availability for EPF10K10ATC144-1N and support for integrating this FLEX-10KA device into your design.

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