EPF10K10ATC100-3

IC FPGA 66 I/O 100TQFP
Part Description

FLEX-10KA® Field Programmable Gate Array (FPGA) IC 66 6144 576 100-TQFP

Quantity 400 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 70°C
Package / Case100-TQFPNumber of I/O66Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs72Number of Logic Elements/Cells576
Number of Gates31000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits6144

Overview of EPF10K10ATC100-3 – FLEX-10KA Field Programmable Gate Array (FPGA), 576 Logic Elements, 6,144-bit RAM, 100‑TQFP

The EPF10K10ATC100-3 is a member of the FLEX 10K embedded programmable logic family delivering medium-density programmable logic and embedded memory in a 100‑pin TQFP package. It combines 576 logic elements and approximately 6,144 bits of embedded RAM with 66 user I/O pins, targeting embedded control, peripheral integration, and prototype FPGA applications where 3.3 V-class operation and commercial-temperature operation are required.

As a FLEX 10K family device, it supports system-level features such as in-circuit reconfigurability and JTAG boundary-scan, enabling flexible integration and board-level testability for a broad range of commercial designs.

Key Features

  • Core Logic 
    576 logic elements and 72 logic array blocks provide medium-density programmable logic suitable for glue logic, control state machines, and custom peripherals.
  • Embedded Memory 
    Approximately 6,144 bits of embedded RAM support local storage, FIFOs, and small on‑chip data buffering without external memory.
  • Gate Count 
    Device-level listing shows up to 31,000 system gates, enabling the implementation of combined logic and memory functions on a single device.
  • I/O and Packaging 
    66 user I/O pins in a 100‑TQFP (14×14 mm) surface-mount package provide a compact footprint and straightforward board routing for through-interface peripherals.
  • Power 
    Rated for a 3.0 V to 3.6 V supply voltage, matching 3.3 V system rails used in many commercial embedded designs.
  • Temperature & Grade 
    Commercial grade operation from 0 °C to 70 °C for typical commercial electronics applications.
  • System Features (FLEX 10K family) 
    Supports in-circuit reconfigurability (ICR) via external configuration device, intelligent controller, or JTAG port; built-in JTAG boundary-scan (IEEE 1149.1) for board test without consuming device logic.
  • Interconnect & Arithmetic Support 
    Series-level FastTrack interconnect and dedicated carry/cascade chains simplify implementation of adders, counters, and high-fan-in logic functions (as provided by FLEX 10K family architecture).
  • Regulatory 
    RoHS compliant.

Typical Applications

  • Embedded Control 
    Implement control state machines, protocol translators, and peripheral timing logic where medium-density programmable logic and modest embedded RAM are sufficient.
  • Interface & Glue Logic 
    Replace discrete glue components for bus bridging, signal conditioning, and I/O aggregation using the device’s 66 I/O pins and on-chip logic.
  • Prototype & Development 
    Use in early-stage hardware prototypes and small-scale product runs that require reconfigurability and board-level test via JTAG.
  • Custom Peripherals 
    Implement small custom accelerators, UARTs, timers, or peripheral controllers leveraging the embedded memory and dedicated interconnect features of the FLEX 10K family.

Unique Advantages

  • Medium-density, integrated logic and RAM: 576 logic elements paired with ~6,144 bits of embedded RAM reduce external component count and simplify PCB design for moderate-complexity functions.
  • 3.3 V-class compatibility: 3.0 V to 3.6 V supply rating aligns with common commercial system rails for straightforward integration.
  • Compact, surface-mount package: 100‑TQFP (14×14) provides a balance of pin count and board-space efficiency for space-conscious designs.
  • Built-in testability: IEEE‑1149.1 JTAG boundary-scan enables board-level testing without consuming programmable logic resources.
  • In-circuit reconfigurability: Supports multiple configuration methods (external device, intelligent controller, JTAG) for flexible update and field modifications.
  • RoHS compliant: Meets common environmental requirements for commercial electronic products.

Why Choose EPF10K10ATC100-3?

The EPF10K10ATC100-3 is positioned for designers who need a compact, medium-density programmable logic device with on-chip RAM and flexible configuration options. Its combination of 576 logic elements, embedded memory, and 66 I/O pins in a 100‑TQFP package offers a practical balance of integration and board-level simplicity for commercial embedded and prototype projects.

Choosing this FLEX 10K family member provides access to series-level capabilities—such as JTAG boundary-scan, FastTrack interconnect, and carry/cascade chains—that help accelerate implementation of arithmetic and high-fan-in logic while supporting in-circuit reconfigurability for iterative development and updates.

Request a quote or submit a purchase inquiry to receive pricing, lead-time information, and availability for EPF10K10ATC100-3.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up