EPF10K10AQC208-3N
| Part Description |
FLEX-10KA® Field Programmable Gate Array (FPGA) IC 134 6144 576 208-BFQFP |
|---|---|
| Quantity | 620 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 134 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 72 | Number of Logic Elements/Cells | 576 | ||
| Number of Gates | 31000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 6144 |
Overview of EPF10K10AQC208-3N – FLEX-10KA FPGA, 576 Logic Elements, 208-BFQFP
The EPF10K10AQC208-3N is a FLEX-10KA Field Programmable Gate Array (FPGA) designed for embedded programmable logic applications. It combines a logic array and embedded memory resources to implement megafunctions and specialized logic within a single programmable device.
Targeted at commercial embedded systems, the device supports system-level integration use cases such as SOPC (System-on-a-Programmable-Chip) integration, interface adaptation, and custom logic acceleration, delivering reconfigurable hardware capacity in a 208-pin surface-mount package.
Key Features
- Logic Capacity — 576 logic elements and approximately 31,000 gates provide the programmable logic needed for moderate-complexity designs.
- Embedded Memory — Total RAM bits: 6,144 (approximately 6 Kbits) to support on-chip data buffering, FIFOs, and small lookup tables.
- I/O and Pin Control — 134 user I/O pins with per-pin features available in the FLEX 10K family such as individual tri-state output enable and programmable output slew-rate control for flexible interfacing and signal integrity management.
- Configuration and Test — In-circuit reconfigurability via external configuration device, intelligent controller, or JTAG port; built-in JTAG boundary-scan test (IEEE Std. 1149.1-1990) for board-level test and debug without consuming device logic.
- Clocking and Arithmetic Support — Family features include dedicated carry and cascade chains for efficient arithmetic, built-in low-skew clock distribution, and options for ClockLock and ClockBoost to manage clock delay/skew and multiplication.
- Power and Operating Range — Voltage supply: 3 V to 3.6 V; commercial operating temperature range: 0 °C to 70 °C.
- Package and Mounting — 208-BFQFP package (supplier device package: 208-PQFP, 28 × 28 mm); surface-mount mounting type suited for standard PCB assembly.
- Environmental Compliance — RoHS compliant.
Typical Applications
- System Integration (SOPC) — Implement megafunctions and combine on-chip logic and memory to consolidate functions and reduce external components in embedded systems.
- Interface Bridging and Protocol Adaptation — Use the device’s flexible I/O and programmable logic to implement custom interface logic and protocol conversion between subsystems.
- Control and Timing Logic — Deploy for motor control, timing generation, and custom peripheral control where moderate logic density and on-chip memory are required.
- Prototyping and Custom Logic — Reconfigurable fabric and JTAG-enabled debug make the device suitable for prototype development and iterative hardware design.
Unique Advantages
- Integrated Logic and Memory: Combined logic elements and embedded RAM (6,144 bits) let you implement compact megafunctions and reduce external memory dependency.
- Flexible Configuration: In-circuit reconfigurability and JTAG support streamline development, deployment, and field updates without consuming user logic.
- Deterministic Arithmetic Support: Dedicated carry and cascade chains accelerate adders, counters, and high-fan-in logic, improving implementation efficiency for arithmetic-heavy designs.
- Controlled I/O Behavior: Per-pin control features in the FLEX 10K family (tri-state enable, open-drain option, slew-rate control) simplify board-level signal integrity and interfacing decisions.
- Package Density for Compact Designs: 208-BFQFP surface-mount package provides a balance of I/O count and board-area efficiency for commercial embedded products.
- Vendor Toolchain Support: The FLEX 10K family is supported by development systems that provide automatic place-and-route and design entry options to accelerate project schedules.
Why Choose EPF10K10AQC208-3N?
The EPF10K10AQC208-3N positions itself as a programmable, mid-density solution for commercial embedded applications requiring a balance of logic capacity, on-chip memory, and flexible I/O. Its combination of 576 logic elements, approximately 6 Kbits of embedded RAM, and in-circuit reconfigurability makes it suitable for designs that benefit from hardware-level customization and iterative updates.
Engineers and procurement teams seeking a reconfigurable device with JTAG test support, family-level clocking and arithmetic features, and RoHS compliance will find this device well suited to compact, reprogrammable system designs where commercial temperature range and a 3.0–3.6 V supply are appropriate.
Request a quote or submit a procurement inquiry to check availability and pricing for the EPF10K10AQC208-3N.

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