EPF10K10AFC256-3
| Part Description |
FLEX-10KA® Field Programmable Gate Array (FPGA) IC 150 6144 576 256-BGA |
|---|---|
| Quantity | 51 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Altera |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 150 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 72 | Number of Logic Elements/Cells | 576 | ||
| Number of Gates | 31000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 6144 |
Overview of EPF10K10AFC256-3 – FLEX-10KA® Field Programmable Gate Array (FPGA) IC 150 6144 576 256-BGA
The EPF10K10AFC256-3 is a FLEX-10KA family Field Programmable Gate Array from Altera, offered in a 256-ball BGA package. It provides a compact, surface-mount FPGA option with on-chip memory, a moderate logic element count and a broad set of I/O suitable for commercial embedded designs.
Key Features
- Core Logic 72 CLBs and 576 logic elements provide the programmable fabric for implementing custom digital functions and glue logic.
- Embedded Memory 6,144 bits of on-chip RAM for small buffers, state storage and local data handling within the FPGA.
- I/O Capacity 150 I/O pins support a variety of board-level interfaces and parallel/serial connections to external devices.
- Gate Count Approximately 31,000 gates of equivalent logic capacity for mid-density logic integration.
- Power Device operates from a 3 V to 3.6 V supply range to match common commercial power rails.
- Package & Mounting 256-FBGA (17×17) package, surface-mount mounting for compact PCB layouts and reliable solder attach.
- Operating Range & Grade Commercial grade device rated for 0 °C to 70 °C operation, suitable for standard-temperature embedded applications.
- Environmental Compliance RoHS compliant to support lead-free assembly processes.
Typical Applications
- Commercial Embedded Systems Fits board-level programmable logic needs where a commercial temperature range and a moderate logic and I/O budget are required.
- Prototyping and Development Useful for developing and validating custom digital functions before committing to fixed silicon or larger FPGAs.
- Interface and Glue Logic 150 I/O pins and on-chip RAM make the device suitable for consolidating interface translation, protocol bridging and timing control on a single FPGA.
Unique Advantages
- Balanced Logic and I/O Mix Combines 576 logic elements with 150 I/O pins to support moderate-complexity designs that require significant external connectivity.
- Compact BGA Footprint The 256-FBGA (17×17) package reduces PCB area compared with larger packages while enabling robust surface-mount assembly.
- On-chip Memory 6,144 bits of embedded RAM enable local buffering and state storage without additional external memory components.
- Standard Commercial Rating Rated for 0 °C to 70 °C operation and commercial grade use, matching typical production environments for consumer and business equipment.
- RoHS Compliant Supports lead-free manufacturing flows and environmental compliance requirements.
- Voltage Compatibility 3 V to 3.6 V supply range aligns with widely used commercial power rails for simplified power-system design.
Why Choose EPF10K10AFC256-3?
The EPF10K10AFC256-3 delivers a practical balance of logic capacity, I/O density and on-chip RAM in a compact 256-FBGA package, making it well suited to commercial embedded designs, interface consolidation and prototyping tasks. Its electrical and thermal specifications—3 V to 3.6 V supply and 0 °C to 70 °C operating range—match common commercial production environments.
For teams seeking a mid-density, RoHS-compliant FPGA from Altera, this device provides a reliable option for consolidating glue logic and small custom functions while reducing board-level component count and preserving PCB space.
Request a quote or submit an inquiry to obtain pricing, availability and ordering information for the EPF10K10AFC256-3.

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