EPF10K100EQI208-2
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 147 49152 4992 208-BFQFP |
|---|---|
| Quantity | 459 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 147 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 624 | Number of Logic Elements/Cells | 4992 | ||
| Number of Gates | 257000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49152 |
Overview of EPF10K100EQI208-2 – FLEX-10KE FPGA, 208-BFQFP, Industrial Grade
The EPF10K100EQI208-2 is a FLEX-10KE field programmable gate array (FPGA) in a 208-BFQFP surface-mount package designed for industrial applications. It combines an embedded array for implementing megafunctions (such as efficient memory and specialized logic) with a logic array for general-purpose logic functions, enabling system-on-a-programmable-chip (SOPC) integration.
With mid-range logic capacity, abundant on-chip RAM, and flexible I/O, this device targets embedded systems and industrial designs that require integration of memory-intensive and I/O-heavy functions in a single programmable device.
Key Features
- Core Architecture Embedded array plus logic array architecture supports implementation of megafunctions and general logic functions for SOPC-style integration.
- Logic Capacity 4,992 logic elements and 624 LABs, supporting a device gate count of 257,000 as specified for this part.
- On-chip Memory Approximately 49,152 bits of total embedded RAM for buffering, temporary storage, and memory-based megafunctions.
- I/O 147 user I/Os to support a broad range of external interfaces and board-level integration.
- Supply Voltage Operates from 2.375 V to 2.625 V, enabling compatibility with designs that use this supply domain.
- Package & Mounting 208-BFQFP (208-PQFP, 28×28) surface-mount package for dense board integration and mechanical stability.
- Industrial Temperature Range Rated for operation from −40 °C to 85 °C, suitable for industrial environments.
- Configuration & Clocking Supports in-circuit reconfigurability and includes ClockLock and ClockBoost options plus low-skew clock distribution as part of the FLEX 10K family feature set.
- Testability Built-in JTAG boundary-scan test (BST) compliant with IEEE Std. 1149.1-1990, available without consuming device logic.
- Standards & Compliance RoHS compliant, aligning with common environmental requirements.
Typical Applications
- SOPC and System Integration Consolidate memory and specialized logic functions alongside general logic to reduce component count and simplify system architecture.
- Industrial Control Industrial temperature rating and flexible I/O make the device suitable for control logic, motor drives, and automation interfaces.
- Memory-Intensive Functions Embedded RAM supports buffering, FIFOs, and other on-chip memory needs for data-path and signal-processing tasks.
- Prototyping and Board-Level Integration Mid-range logic density, abundant I/O, and a compact PQFP package support rapid prototyping and compact productions designs.
Unique Advantages
- Balanced Logic and Memory The combination of roughly 4,992 logic elements and ~49,152 bits of RAM lets you implement complex logic alongside embedded memory without external RAM in many use cases.
- Flexible I/O Count 147 user I/Os provide the connectivity needed for multi-interface designs and high pin-count external peripherals.
- Industrial Reliability Specified operation from −40 °C to 85 °C and surface-mount packaging support deployment in industrial environments.
- In-System Reconfigurability Support for in-circuit reconfiguration and JTAG boundary-scan facilitates iterative development and field updates without removing the device from the board.
- Family-Level Integration As part of the FLEX 10K family, the device benefits from family features such as low-skew clocks, clock multiplication options, and pin-compatibility across devices in the same package.
- Regulatory and Environmental Compliance RoHS compliance simplifies regulatory acceptance for many end products.
Why Choose EPF10K100EQI208-2?
The EPF10K100EQI208-2 delivers a practical balance of logic density, embedded memory, and I/O capacity in a compact 208-BFQFP package rated for industrial temperatures. It is well suited to engineers who need to consolidate memory and specialized logic with general-purpose programmable logic for embedded and industrial systems.
Choosing this FLEX-10KE device lets you leverage family-level features—such as in-circuit reconfigurability, configurable clocking options, and JTAG boundary-scan—while maintaining a stable BOM footprint and a pathway to other FLEX 10K devices with compatible packages.
Request a quote or submit an inquiry for pricing and availability of the EPF10K100EQI208-2 to evaluate fit for your next embedded or industrial design.

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