EPF10K100EQI208-2

IC FPGA 147 I/O 208QFP
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 147 49152 4992 208-BFQFP

Quantity 459 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case208-BFQFPNumber of I/O147Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs624Number of Logic Elements/Cells4992
Number of Gates257000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits49152

Overview of EPF10K100EQI208-2 – FLEX-10KE FPGA, 208-BFQFP, Industrial Grade

The EPF10K100EQI208-2 is a FLEX-10KE field programmable gate array (FPGA) in a 208-BFQFP surface-mount package designed for industrial applications. It combines an embedded array for implementing megafunctions (such as efficient memory and specialized logic) with a logic array for general-purpose logic functions, enabling system-on-a-programmable-chip (SOPC) integration.

With mid-range logic capacity, abundant on-chip RAM, and flexible I/O, this device targets embedded systems and industrial designs that require integration of memory-intensive and I/O-heavy functions in a single programmable device.

Key Features

  • Core Architecture Embedded array plus logic array architecture supports implementation of megafunctions and general logic functions for SOPC-style integration.
  • Logic Capacity 4,992 logic elements and 624 LABs, supporting a device gate count of 257,000 as specified for this part.
  • On-chip Memory Approximately 49,152 bits of total embedded RAM for buffering, temporary storage, and memory-based megafunctions.
  • I/O 147 user I/Os to support a broad range of external interfaces and board-level integration.
  • Supply Voltage Operates from 2.375 V to 2.625 V, enabling compatibility with designs that use this supply domain.
  • Package & Mounting 208-BFQFP (208-PQFP, 28×28) surface-mount package for dense board integration and mechanical stability.
  • Industrial Temperature Range Rated for operation from −40 °C to 85 °C, suitable for industrial environments.
  • Configuration & Clocking Supports in-circuit reconfigurability and includes ClockLock and ClockBoost options plus low-skew clock distribution as part of the FLEX 10K family feature set.
  • Testability Built-in JTAG boundary-scan test (BST) compliant with IEEE Std. 1149.1-1990, available without consuming device logic.
  • Standards & Compliance RoHS compliant, aligning with common environmental requirements.

Typical Applications

  • SOPC and System Integration Consolidate memory and specialized logic functions alongside general logic to reduce component count and simplify system architecture.
  • Industrial Control Industrial temperature rating and flexible I/O make the device suitable for control logic, motor drives, and automation interfaces.
  • Memory-Intensive Functions Embedded RAM supports buffering, FIFOs, and other on-chip memory needs for data-path and signal-processing tasks.
  • Prototyping and Board-Level Integration Mid-range logic density, abundant I/O, and a compact PQFP package support rapid prototyping and compact productions designs.

Unique Advantages

  • Balanced Logic and Memory The combination of roughly 4,992 logic elements and ~49,152 bits of RAM lets you implement complex logic alongside embedded memory without external RAM in many use cases.
  • Flexible I/O Count 147 user I/Os provide the connectivity needed for multi-interface designs and high pin-count external peripherals.
  • Industrial Reliability Specified operation from −40 °C to 85 °C and surface-mount packaging support deployment in industrial environments.
  • In-System Reconfigurability Support for in-circuit reconfiguration and JTAG boundary-scan facilitates iterative development and field updates without removing the device from the board.
  • Family-Level Integration As part of the FLEX 10K family, the device benefits from family features such as low-skew clocks, clock multiplication options, and pin-compatibility across devices in the same package.
  • Regulatory and Environmental Compliance RoHS compliance simplifies regulatory acceptance for many end products.

Why Choose EPF10K100EQI208-2?

The EPF10K100EQI208-2 delivers a practical balance of logic density, embedded memory, and I/O capacity in a compact 208-BFQFP package rated for industrial temperatures. It is well suited to engineers who need to consolidate memory and specialized logic with general-purpose programmable logic for embedded and industrial systems.

Choosing this FLEX-10KE device lets you leverage family-level features—such as in-circuit reconfigurability, configurable clocking options, and JTAG boundary-scan—while maintaining a stable BOM footprint and a pathway to other FLEX 10K devices with compatible packages.

Request a quote or submit an inquiry for pricing and availability of the EPF10K100EQI208-2 to evaluate fit for your next embedded or industrial design.

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