EPF10K100EQC240-3

The EPF10K100EQC240-3 is a FLEX-10KE field programmable gate array (FPGA) IC designed for mid-density programmable-logic applications. It combines a logic array and embedded memory resources to implement custom digital functions and on-chip megafunctions for system integration.

With 4,992 logic elements, approximately 49,152 bits of embedded RAM, 189 user I/O pins and a 240-pin BFQFP package, this commercial-grade device is targeted at embedded designs, I/O-dense interfaces and custom peripheral integration where configurable logic and moderate on-chip memory are required.

Key Features

• Core Logic  4,992 logic elements provide the capacity for medium-density custom logic and control functions.
• Embedded Memory  Approximately 49,152 bits of on-chip RAM (≈0.049 Mbits) for buffering, small FIFOs and lookup tables.
• I/O Density  189 user I/O pins support complex interfacing and multiple peripheral connections in a single device.
• Gate Count  257,000 reported gates for representing overall device capacity in system-level estimations.
• Supply Voltage  Operates from 2.375 V to 2.625 V to match target board power rails and system constraints.
• Package & Mounting  240-BFQFP (supplier device package: 240-PQFP, 32×32) surface-mount package for compact board integration.
• Operating Range & Grade  Commercial grade operation from 0 °C to 70 °C for typical commercial environments.
• Standards & Test  RoHS compliant; FLEX 10K family documentation describes built-in JTAG boundary-scan (IEEE 1149.1) and family-level test features.

Typical Applications

• Embedded systems  Use the FPGA to implement custom control logic, protocol handling or peripheral interfaces where moderate logic and embedded memory are required.
• Interface bridging  Leverage the device’s 189 I/O pins to consolidate multiple serial/paralell interfaces or perform protocol translation on a single IC.
• Prototyping and development  Apply the device in board-level prototypes and evaluation platforms that need reconfigurable logic and moderate on-chip RAM.
• Custom peripheral integration  Integrate glue logic, timing control and small packet buffering close to system peripherals to reduce external component count.

Unique Advantages

• High I/O capacity: 189 user I/O pins enable dense front-end connectivity and simplify board-level routing for multi-interface designs.
• Balanced logic and memory: 4,992 logic elements paired with approximately 49,152 bits of embedded RAM support mixed compute and buffering tasks without heavy external memory reliance.
• Compact package: 240-pin BFQFP (240-PQFP 32×32) offers a space-efficient surface-mount option for designs where board area is at a premium.
• Commercial operating range: Rated for 0 °C to 70 °C, suitable for a wide range of commercial electronics and controlled-environment applications.
• Regulatory readiness: RoHS compliant to meet common environmental and manufacturing requirements.

Why Choose EPF10K100EQC240-3?

The EPF10K100EQC240-3 positions itself as a mid-density, highly configurable FPGA option that brings together a substantial logic element count, meaningful on-chip RAM and a large number of I/O in a compact 240-pin BFQFP package. It is well suited for designers who need to consolidate custom logic, implement protocol or interface functions, and reduce external component count within commercial-temperature systems.

As part of the FLEX 10K family, the device benefits from family-level documentation and design-tool support described in the FLEX 10K datasheet, helping accelerate integration and bring-up for board and system designs that require reconfigurable logic and flexible I/O.

Request a quote or submit an inquiry to check pricing and availability for EPF10K100EQC240-3 and to discuss lead times and volume options.