EPF10K100EQC240-1X

The EPF10K100EQC240-1X is a FLEX-10KE family FPGA manufactured by Intel. It combines a logic array and embedded memory resources to support System-on-a-Programmable-Chip (SOPC) integration and implementation of megafunctions such as efficient on-chip memory and specialized logic.

Designed for commercial embedded applications, this surface-mount device provides a balance of logic capacity, embedded RAM, and I/O density for interface-heavy and integration-focused designs.

Key Features

• Core Logic — 4,992 logic elements and 624 LABs provide the programmable logic fabric required for custom control, glue logic, and hardware accelerators.
• Embedded Memory — 49,152 bits of on-chip RAM to implement data buffers, FIFOs, and small memory-mapped resources without external RAM.
• I/O Density — 189 user I/O pins support multiple parallel interfaces and high pin-count connectivity for complex systems.
• Gate Capacity — Specified with 257,000 gates to describe device capacity for combined logic and memory implementations.
• Package & Mounting — 240-BFQFP (supplier package: 240-PQFP, 32×32) in a surface-mount form factor for standard PCB assembly.
• Power — Operates from a 2.375 V to 2.625 V supply range as specified for this device.
• Temperature & Grade — Commercial grade with an operating range of 0 °C to 70 °C, suitable for general-purpose embedded equipment.
• Standards & Series Features — Series-level features include embedded arrays for megafunctions, JTAG boundary-scan (IEEE 1149.1) support, low-skew clock distribution, and support for in-circuit reconfigurability.
• Compliance — RoHS compliant.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic, protocol translation, and peripheral glue logic in space-constrained commercial products.
• Interface-Intensive Designs — Use the 189 I/O pins to aggregate multiple serial and parallel interfaces or to drive complex front-end I/O requirements.
• On-Chip Memory Utilization — Leverage approximately 49 kbits of embedded RAM for buffering, FIFOs, and small data stores without external memory.
• Prototyping and Evaluation — Rapidly iterate hardware functions and megafunction prototypes using the device’s programmable logic and embedded resources.

Unique Advantages

• Balanced Logic and Memory: 4,992 logic elements paired with 49,152 bits of embedded RAM allow mixed logic-and-memory designs without adding external components.
• High I/O Count: 189 user I/Os reduce the need for external I/O expanders and simplify board-level connectivity for complex interfaces.
• Surface-Mount 240-BFQFP Package: A compact, industry-standard package that supports automated PCB assembly and dense board layouts.
• Commercial Temperature Suitability: Rated 0 °C to 70 °C for deployment in general-purpose commercial environments.
• Series-Level Tool Support: FLEX 10K series documentation indicates available software design support and automatic place-and-route tools for development productivity.
• RoHS Compliant: Supports environmental and regulatory requirements for lead-free assemblies.

Why Choose EPF10K100EQC240-1X?

The EPF10K100EQC240-1X delivers a practical combination of logic density, embedded RAM, and high I/O count in a commercial-grade, surface-mount 240-BFQFP package. It is well suited to designers seeking a FLEX-10KE family FPGA for SOPC-style integration, on-chip memory use, and interface-rich applications where PCB area and component count are considerations.

This device fits applications that require a balance of programmable logic, embedded memory, and I/O flexibility while leveraging series-level features such as JTAG boundary-scan and support from established development tool flows.

If you need pricing, availability, or a formal quotation for EPF10K100EQC240-1X, request a quote or submit a pricing inquiry today.