EPF10K100EQC208-3

The EPF10K100EQC208-3 is a FLEX-10KE field programmable gate array (FPGA) in a 208-pin BFQFP surface-mount package. It provides 4,992 logic elements and 49,152 bits of embedded RAM together with 147 user I/O pins for reconfigurable digital designs.

Targeted at commercial embedded applications, this device is suitable for designs that require on-chip memory, flexible I/O count, and system-level programmable logic. It operates from a 2.375 V to 2.625 V supply and is specified for 0 °C to 70 °C operation with RoHS compliance.

Key Features

• Core Logic  624 LABs delivering approximately 4,992 logic elements for implementing combinational and sequential logic functions.
• Embedded Memory  Approximately 49,152 bits of on-chip RAM to support local data storage, buffering, and small memory-mapped functions.
• I/O Capacity  Up to 147 user I/O pins for flexible interfacing to peripherals, buses, and external devices.
• Package & Mounting  208-BFQFP package (supplier package listed as 208-PQFP, 28×28), surface-mount mounting type for use on standard PCBs.
• Power & Temperature  Voltage supply range 2.375 V to 2.625 V; commercial operating temperature range 0 °C to 70 °C.
• System Features (FLEX 10K family)  Series-level capabilities include in-circuit reconfigurability via external configuration or JTAG boundary-scan, low-skew clock distribution, and dedicated carry/cascade chains for arithmetic and high-fan-in logic.
• Regulatory  RoHS compliant.

Typical Applications

• Embedded Systems  Use on-board programmable logic and embedded RAM to implement custom control, state machines, and protocol bridging within commercial devices.
• Prototyping & Development  Ideal for hardware prototyping and evaluation where reconfigurability and moderate logic density are required.
• Interface & Glue Logic  Deploy as a flexible interface engine to combine or translate signals between different subsystems, taking advantage of the device's I/O count and programmable logic.
• Memory and Buffering  On-chip RAM can be used for small FIFOs, buffering, and fast local storage to reduce external memory requirements.

Unique Advantages

• Balanced logic and memory  Combines nearly 5,000 logic elements with 49,152 bits of embedded RAM, enabling both logic-intensive and memory-backed functions on a single device.
• High I/O density  147 user I/O pins provide flexibility to interface multiple peripherals or bus segments without external multiplexing components.
• Surface-mount, compact package  208-BFQFP (28×28) helps integrate the FPGA into standard PCB layouts while maintaining a high pin count.
• Commercial-grade thermal and voltage specs  Defined operating range (0 °C to 70 °C and 2.375 V–2.625 V supply) simplifies component selection for commercial designs.
• RoHS compliant  Meets lead-free and hazardous-substance reduction requirements for commercial manufacturing.
• Family-level system features  Benefits from FLEX 10K family capabilities such as JTAG boundary-scan, clock distribution features, and dedicated arithmetic routing structures.

Why Choose EPF10K100EQC208-3?

The EPF10K100EQC208-3 positions itself as a practical, reconfigurable logic device for commercial embedded designs that need a balance of logic density, embedded RAM, and I/O capacity in a BFQFP surface-mount package. Its supply voltage and temperature specifications make it suitable for standard commercial boards, while FLEX 10K family system features add design flexibility through reconfiguration and clock/logic primitives.

This part is well suited for engineers and procurement teams seeking a configurable, RoHS-compliant FPGA with clear, verifiable specifications for logic elements, on-chip memory, I/O count, and package details. It delivers a scalable solution within the FLEX 10K family for designs that require integrated programmable logic and embedded memory resources.

Request a quote or submit an inquiry for pricing and availability for the EPF10K100EQC208-3 to begin integrating this FLEX-10KE FPGA into your next commercial design.