EPF10K100EQC208-2

IC FPGA 147 I/O 208QFP
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 147 49152 4992 208-BFQFP

Quantity 785 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O147Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs624Number of Logic Elements/Cells4992
Number of Gates257000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits49152

Overview of EPF10K100EQC208-2 – FLEX-10KE® Field Programmable Gate Array (FPGA) IC 147 49152 4992 208-BFQFP

The EPF10K100EQC208-2 is a FLEX-10KE family field programmable gate array (FPGA) packaged in a 208-pin BFQFP surface-mount package. It combines a programmable logic array with embedded memory resources and a substantial I/O count to support system-level integration and custom logic functions.

Designed for commercial-grade applications, this device provides 4,992 logic elements, 49,152 bits of on-chip RAM, and 147 user I/O pins, offering a balance of logic capacity, embedded memory and I/O density for mid-range FPGA designs.

Key Features

  • Logic Capacity — 4,992 logic elements and 624 logic array blocks (LABs) for implementing custom logic and control functions.
  • Embedded Memory — 49,152 bits of on-chip RAM to support data buffering, small lookup tables, and megafunction implementations.
  • I/O and System Integration — 147 user I/O pins enabling broad peripheral connectivity and board-level interfacing.
  • Gate Count — Listed device gate count of 257,000 for planning system resource requirements.
  • Power and Voltage — Operates from a 2.375 V to 2.625 V supply, suitable for designs targeting that supply rail.
  • Package and Mounting — 208-BFQFP (supplier package: 208-PQFP 28×28), surface-mount for standard PCB assembly processes.
  • Operating Range — Commercial temperature grade with specified operating temperature 0 °C to 70 °C.
  • Design & Test Support (FLEX 10K family) — Family-level features include embedded arrays for megafunctions, in-circuit reconfigurability options, built-in JTAG boundary-scan, dedicated carry and cascade chains, and low-skew clock distribution for predictable timing.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • System-on-a-Programmable-Chip (SOPC) integration — Use the device’s embedded memory and logic resources to implement megafunctions and integrate multiple system functions into a single programmable device.
  • Embedded memory and buffering — On-chip RAM supports local data storage for controllers, protocol buffers, and small data-path implementations.
  • Peripheral interfacing and custom I/O — High I/O count and programmable I/O functionality enable custom peripheral interfaces and board-level glue logic.

Unique Advantages

  • Balanced logic and memory — 4,992 logic elements paired with 49,152 bits of embedded RAM provide a practical mix of resources for mid-range programmable designs.
  • Generous I/O count — 147 user I/O pins support multiple peripheral interfaces and flexible board integration without external expander logic.
  • Configurable system integration — Family-level support for embedded megafunctions and in-circuit reconfigurability helps consolidate functions and reduce overall BOM.
  • Testability — Built-in JTAG boundary-scan improves device test and debug without consuming user logic resources.
  • Standard commercial thermal range — Specified 0 °C to 70 °C operation for commercial electronic products and prototypes.
  • RoHS compliant — Meets environmental regulations for lead-free assembly processes.

Why Choose EPF10K100EQC208-2?

The EPF10K100EQC208-2 positions itself as a mid-range FLEX-10KE FPGA option that delivers a practical combination of logic elements, embedded RAM, and I/O density in a 208-pin BFQFP package. It is suited to designs that require on-chip memory, programmable logic and extensive I/O without moving to higher pin-count packages.

With family-level features such as embedded megafunction support, in-circuit reconfigurability and JTAG boundary-scan, this device is appropriate for engineering teams seeking a programmable, testable platform that can consolidate multiple functions and accelerate system development.

Request a quote or submit an inquiry to obtain pricing, availability, and lifecycle information for EPF10K100EQC208-2. Provide your project requirements and quantity to receive a tailored response.

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