EPF10K100EQC208-1N

IC FPGA 147 I/O 208QFP
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 147 49152 4992 208-BFQFP

Quantity 451 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O147Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs624Number of Logic Elements/Cells4992
Number of Gates257000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits49152

Overview of EPF10K100EQC208-1N – FLEX-10KE Field Programmable Gate Array (FPGA), 4992 Logic Elements, 49152 bits RAM, 208-BFQFP

The EPF10K100EQC208-1N is a FLEX-10KE series field programmable gate array (FPGA) supplied in a 208-BFQFP package for surface-mount applications. It combines a programmable logic array with embedded memory resources and system-level features suitable for mid-density custom logic, prototyping, and subsystem integration.

Designed for commercial-temperature use, this device targets applications that require a balance of logic density, on-chip memory, and flexible I/O in a compact 208-pin footprint.

Key Features

  • Core Logic — 4,992 logic elements (LEs) organized across 624 logic array blocks (LABs) to implement combinational and sequential logic functions.
  • Embedded Memory — 49,152 bits of on-chip RAM (approximately 0.049 Mbits) for data buffering, FIFOs, and small embedded storage.
  • I/O and Package — 147 user I/O pins in a 208-BFQFP (208-PQFP, 28×28) package; surface-mount mounting type for standard PCB assembly.
  • Gate Capacity — Functional capacity listed as 257,000 gates for system-level design planning.
  • Power — Specified operating supply range of 2.375 V to 2.625 V for core operation.
  • Temperature and Grade — Commercial grade device rated for 0 °C to 70 °C operation.
  • In-system Configuration and Test — Family-level features include in-circuit reconfigurability via external configuration device or JTAG, and built-in IEEE-1149.1 JTAG boundary-scan for board-level test.
  • High-speed Design Support — Series architecture includes dedicated carry and cascade chains plus low-skew clock distribution to support arithmetic and high-fan-in logic functions (series-level capability).
  • RoHS Compliant — Device conforms to RoHS environmental requirements.

Typical Applications

  • Custom Logic and Glue — Replace multiple discrete components with a single programmable device for glue logic, protocol translation, and interface conditioning in embedded systems.
  • Prototyping and Development — Use the device’s on-chip memory and programmable logic to validate designs and implement iterative hardware prototypes.
  • Peripheral and Interface Control — Implement custom peripheral controllers, data buffering, and timing-critical interface logic using dedicated carry/cascade chains and on-chip RAM.
  • Compact Board-level Integration — 208-pin BFQFP package and surface-mount mounting enable dense board layouts where space and pin count are constrained.

Unique Advantages

  • Balanced Logic and Memory — 4,992 LEs with 49,152 bits of embedded RAM provide a mid-density platform that supports both logic-intensive and memory-assisted functions.
  • Board Testability — Built-in JTAG boundary-scan simplifies board-level test and in-system debug without consuming user logic resources.
  • Compact Packaging — 208-BFQFP (28×28) package offers a high pin-count solution in a compact surface-mount form factor for space-constrained designs.
  • Defined Power Envelope — Clear supply range specification (2.375 V–2.625 V) supports predictable power budgeting during system design.
  • Series-proven Architecture — Family-level features such as dedicated carry/cascade chains and low-skew clock distribution support common high-speed arithmetic and timing requirements.

Why Choose EPF10K100EQC208-1N?

The EPF10K100EQC208-1N offers a practical mid-density FPGA option for designers who need a mix of programmable logic, embedded RAM, and robust board-level testability in a compact 208-pin package. Its 4,992 logic elements and 49,152 bits of on-chip RAM make it well-suited to applications that demand moderate gate count with embedded memory resources while maintaining a defined commercial operating range.

This device is appropriate for product development teams and procurement seeking a commercially graded FLEX-10KE FPGA that integrates configurable logic, embedded memory, and family-level architecture features to streamline design and reduce component count.

Request a quote or submit a parts inquiry to check availability and pricing for EPF10K100EQC208-1N.

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