EPF10K100EQC208-1X

The EPF10K100EQC208-1X is a FLEX-10KE field programmable gate array (FPGA) optimized for commercial embedded and system applications. It combines a dedicated logic array and embedded memory resources to implement custom logic, on-chip memory, and peripheral functions in a single, reconfigurable device.

This device is supplied in a 208-BFQFP surface-mount package and offers a balance of I/O density, logic capacity, and embedded RAM suitable for glue logic, protocol bridging, custom peripherals, and system-level integration in commercial designs.

Key Features

• Logic Capacity — 4,992 logic elements across 624 LABs, providing substantial programmable logic for mid-density applications.
• Embedded Memory — 49,152 bits of on-chip RAM for local buffering, small FIFOs, and register-mapped storage.
• I/O and Pins — 147 user I/O pins for interfacing with external peripherals and buses.
• Gate Count — 257,000 gates (typical counted value reported in product data) to describe overall device complexity.
• Supply Voltage — Operates with a supply range of 2.375 V to 2.625 V as specified for this device variant.
• Temperature Range — Commercial operating range from 0 °C to 70 °C.
• Package & Mounting — 208-BFQFP (28×28) package, surface-mount mounting for standard PCB assembly.
• Reconfigurability & Test — Series documentation describes JTAG boundary-scan (IEEE 1149.1) for in-system test and device reconfiguration.
• Clock & Interconnect Features — Series-level FLEX 10K family features include low-skew clock distribution, dedicated carry and cascade chains, and a continuous routing interconnect architecture (referenced from family datasheet).
• RoHS Compliant — Complies with RoHS environmental requirements.

Typical Applications

• System Integration — Implement system-on-a-programmable-chip (SOPC) functions and custom glue logic to consolidate discrete components and simplify board-level design.
• On-Chip Memory and Buffers — Use embedded RAM for small buffers, FIFOs, and temporary storage in data-path and control applications.
• Peripheral and Bus Bridging — Implement custom interfaces and protocol translation between peripheral devices and host systems using the device's I/O resources.
• Prototyping and Reconfigurable Logic — Rapidly iterate hardware functions and prototype digital subsystems with in-circuit reconfigurability supported by the FLEX 10K family.

Unique Advantages

• Balanced Mid-Density Integration: Provides nearly 5,000 logic elements with substantial embedded RAM to handle both control logic and data buffering in a single chip.
• Flexible I/O Count: 147 user I/Os enable a wide range of external interfacing without immediate need for additional I/O expanders.
• Compact, Surface-Mount Package: The 208-BFQFP (28×28) package delivers a compact footprint suitable for space-constrained commercial PCBs.
• Design-for-Test and Reconfiguration: JTAG boundary-scan and series-level in-circuit reconfigurability simplify programming, firmware updates, and board-level diagnostics.
• Environmental Compliance: RoHS compliance supports modern manufacturing and regulatory requirements for commercial products.

Why Choose EPF10K100EQC208-1X?

The EPF10K100EQC208-1X delivers a practical combination of logic density, embedded memory, and I/O resources for commercial embedded systems. Its surface-mount 208-BFQFP package and specified supply and temperature ranges make it suitable for mainstream electronics applications where reconfigurable logic and on-chip memory reduce board complexity.

Engineers designing mid-density programmable solutions will find this device appropriate for consolidating custom logic, implementing interface bridges, and building prototypes that benefit from the FLEX 10K family’s architectural features and test capabilities.

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