EPF10K100EFI484-3N

The EPF10K100EFI484-3N is an Intel FLEX-10KE series field programmable gate array (FPGA) designed for high-density, embedded programmable logic applications. It combines a logic array with embedded array blocks (EABs) to support memory-intensive and specialized logic functions within a single device.

Targeted at industrial applications, this device delivers a large I/O count, substantial on-chip RAM, and a broad operating temperature range, enabling integration of complex control, interface, and signal-processing functions into compact, surface-mount packages.

Key Features

• Logic Capacity — 4,992 logic elements provide programmable resources for implementing complex combinational and sequential logic.
• On-Chip Memory — 49,152 total RAM bits across embedded array blocks, supporting dual-port configurations and up to 16-bit width per EAB for efficient memory and megafunction implementation.
• Gate Density — 257,000 gates (maximum system gates) for high-density designs that require significant logic and routing resources.
• I/O and Package — 338 user I/O pins in a 484-BBGA (484-FBGA, 23×23) surface-mount package, enabling high-pin-count interface designs in a compact form factor.
• Power and Voltage — Internal voltage supply range of 2.375 V to 2.625 V, suitable for systems that use a 2.5 V internal core supply.
• Industrial Temperature Grade — Rated for operation from −40 °C to 85 °C to meet industrial environment requirements.
• Reconfiguration and Test — In-circuit reconfigurability via external configuration devices or JTAG boundary-scan (IEEE 1149.1) circuitry, enabling flexible development and board-level testing without consuming device logic.
• Flexible I/O Features — MultiVolt I/O capability (per FLEX 10KE family), programmable output slew-rate control, individual tri-state enable, and open-drain options for adaptable interfacing and noise control.
• Routing and Arithmetic Support — Dedicated carry and cascade chains and a continuous FastTrack® interconnect structure to support arithmetic functions and predictable interconnect delays.
• Standards and Design Support — Family-level features include PCI Local Bus compliance options and broad software/design-tool support for HDL and megafunction integration (as described in FLEX 10KE documentation).
• Environmental — RoHS compliant.

Typical Applications

• Industrial Control and Automation — Use the device’s industrial temperature rating and large I/O count to implement motor control logic, sensor aggregation, and real-time control functions.
• Embedded System Integration — Leverage the embedded RAM and programmable logic to consolidate multiple functions (memory, interface logic, and glue logic) into a single programmable device.
• High-Density Interface Bridging — The 338 I/Os and flexible I/O features make the device suitable for bridging and translating between different voltage domains and peripheral interfaces.
• Prototyping and Custom Logic — Reconfigurability and JTAG support enable iterative development of custom logic blocks and megafunctions without redesigning hardware.

Unique Advantages

• High integration density: 4,992 logic elements and 49,152 bits of on-chip RAM allow consolidation of multiple functions, reducing board-level component count.
• Extensive I/O capability: 338 user I/O pins in a compact 484-BBGA package enable dense, multi-channel interfacing without large packages.
• Industrial robustness: −40 °C to 85 °C operating range supports deployment in demanding industrial environments.
• Flexible memory architecture: Embedded array blocks with dual-port capability and up to 16-bit widths per EAB facilitate efficient implementation of FIFOs, buffers, and on-chip storage.
• Development and test-friendly: In-circuit reconfigurability and JTAG boundary-scan support simplify development cycles, field updates, and board-level testing.
• Standards-aware feature set: Family-level support for multi-voltage I/O and PCI compliance options (as described in FLEX 10KE documentation) helps when integrating with mixed-voltage systems.

Why Choose EPF10K100EFI484-3N?

The EPF10K100EFI484-3N blends a high logic element count, substantial on-chip RAM, and a large number of user I/Os in a compact 484-BBGA surface-mount package, making it well suited to industrial and embedded designs that demand integration, I/O density, and reconfigurability. Its industrial temperature rating and RoHS compliance support reliable deployment in production environments.

This device is ideal for designers seeking to consolidate logic and memory functions, implement custom interfaces, or accelerate prototyping with a reprogrammable platform backed by the FLEX-10KE family feature set.

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