EPF10K100EFI256-2

The EPF10K100EFI256-2 is an Intel FLEX-10KE family field programmable gate array (FPGA) in a 256-BGA package designed for industrial applications. It combines a dense logic array, embedded RAM, and a large I/O count to support custom digital functions and system integration on a single programmable device.

This device is targeted at embedded and industrial markets that require reconfigurable logic, significant on-chip memory, and a compact surface-mount package for space-constrained PCBs.

Key Features

• Logic Capacity — 4,992 logic elements and approximately 257,000 gates provide substantial programmable logic for medium-complexity designs.
• Embedded Memory — 49,152 total RAM bits of on-chip memory to support buffering, FIFOs, and small embedded data structures without external RAM.
• I/O Resources — 191 user I/O pins to interface with peripherals, sensors, and system buses in I/O-rich applications.
• Package and Mounting — 256-BGA (supplier device package: 256-FBGA, 17 × 17 mm) in a surface-mount form factor for compact board layouts and high-density designs.
• Power Supply — Specified operating supply range of 2.375 V to 2.625 V for core operation, enabling direct integration with matching system power rails.
• Industrial Temperature Range — Rated for −40 °C to +85 °C operation to meet the demands of industrial environments.
• Mounting & Compliance — Surface mount device with RoHS compliance for modern manufacturing and regulatory requirements.

Typical Applications

• Industrial Control — Implement custom control logic, motor control interfaces, and deterministic I/O handling in industrial automation systems.
• Communications & Networking — Use the device for protocol bridging, packet buffering, and custom packet-processing logic that benefits from on-chip RAM and flexible I/O.
• Instrumentation & Test Equipment — Create custom timing, signal-conditioning logic, and data acquisition front-ends that require reconfigurable logic and multiple I/O channels.
• Embedded Systems & Prototyping — Rapidly iterate hardware-accelerated functions, glue logic, and system integration tasks during product development and proof-of-concept builds.

Unique Advantages

• Balanced Logic and Memory: A combination of 4,992 logic elements and 49,152 RAM bits lets you place control logic and local buffering on-chip, reducing external component count.
• High I/O Count: With 191 I/O pins, the device supports rich peripheral connectivity without immediate need for external expanders.
• Compact BGA Package: The 256-FBGA (17 × 17) footprint provides high pin density in a space-efficient surface-mount package for modern PCB layouts.
• Industrial Temperature Rating: Specified −40 °C to +85 °C operation for reliable deployment in industrial environments.
• RoHS Compliant: Meets regulatory requirements for restricted hazardous substances in manufacturing.

Why Choose EPF10K100EFI256-2?

The EPF10K100EFI256-2 delivers a practical balance of programmable logic capacity, embedded RAM, and a high I/O count in a compact industrial-grade package. Its combination of 4,992 logic elements, 49,152 RAM bits, and 191 I/Os makes it well suited to mid-range embedded and industrial designs that require on-chip memory and flexible interfacing without extensive external components.

Engineers designing industrial control, communications, or instrumentation systems will find the device’s thermal range, RoHS compliance, and surface-mount 256-BGA package supportive of robust, production-ready hardware platforms that can evolve through reprogramming.

Request a quote or submit a pricing inquiry to receive availability and tailored purchasing information for the EPF10K100EFI256-2.