EPF10K100EFC484-2X

The EPF10K100EFC484-2X is a FLEX 10KE family field programmable gate array (FPGA) from Intel, delivered in a 484-ball BGA surface-mount package. It provides a balance of logic capacity, on-chip memory and I/O density for commercial embedded and system-level applications.

Designed for System-on-a-Programmable-Chip (SOPC) integration and custom logic implementation, this device targets applications that require moderate logic resources, significant I/O throughput and on-chip RAM for megafunctions and specialized logic blocks.

Key Features

• Logic Capacity — 4,992 logic elements to implement combinational and sequential logic functions for custom digital designs.
• Embedded Memory — 49,152 total RAM bits (approximately 49 Kbits) for on-chip buffering, FIFOs and small data tables.
• I/O Density — 338 user I/O pins to support multiple parallel interfaces and board-level connectivity.
• Gate Count — Approximately 257,000 gates for overall design scaling and integration.
• Power Supply — Specified supply range of 2.375 V to 2.625 V for device core power.
• Package & Mounting — 484-ball BGA (484-FBGA, 23×23) in a surface-mount form factor for compact board integration.
• Commercial Temperature Grade — Rated for 0 °C to 70 °C operation for commercial applications.
• Series-Level System Features — FLEX 10K family features such as in-circuit reconfigurability, JTAG boundary-scan, low-skew clock distribution, dedicated carry and cascade chains, and clock management options support complex design requirements and system-level integration.

Typical Applications

• Embedded Control — Implement custom control logic, state machines and peripheral interfaces where moderate logic capacity and on-chip RAM are required.
• Interface Bridging — Use the device’s 338 I/O pins to bridge multiple parallel and serial interfaces or aggregate signals between subsystems.
• Prototyping & Development — Rapidly prototype digital functions and megafunctions leveraging the FLEX 10K family’s in-circuit reconfigurability and JTAG support.
• Custom Processing Blocks — Build specialized arithmetic, buffering and timing logic using the available logic elements and embedded RAM.

Unique Advantages

• Balanced integration: Combines nearly 5,000 logic elements with approximately 49 Kbits of embedded RAM for compact, self-contained logic and memory implementations.
• High I/O count: 338 I/O pins enable broad connectivity options without external multiplexers, simplifying board-level design.
• Compact BGA package: 484-ball BGA (23×23) surface-mount package optimizes board space while providing robust signal density.
• Family-level system support: FLEX 10K family features such as JTAG boundary-scan and in-circuit reconfigurability ease development, testing and field updates.
• Commercial-ready specification: Rated for 0 °C to 70 °C operation with RoHS compliance for standard commercial product deployments.

Why Choose EPF10K100EFC484-2X?

The EPF10K100EFC484-2X delivers a practical blend of logic resources, on-chip RAM and I/O density in a compact BGA package, making it well suited for commercial embedded systems, interface-rich designs and prototype platforms. Its FLEX 10K family capabilities support system-level features such as in-circuit reconfigurability and JTAG boundary-scan to accelerate development and testing.

This device is a sound choice for engineering teams that need a commercially graded FPGA with a proven feature set for integrating custom logic, buffering and interface functions while maintaining a compact board footprint and straightforward power requirements.

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