EPF10K100EFC484-1

The EPF10K100EFC484-1 from Intel is a FLEX-10KE family field programmable gate array supplied in a 484-FBGA (23×23) surface-mount package. It combines a sizable logic fabric with embedded memory and extensive I/O to support system-on-a-programmable-chip (SOPC) integration and complex glue logic on commercial-grade designs.

Designed for applications that require on-chip RAM, broad I/O connectivity and reconfigurable logic, this device delivers a balance of integration and board-space efficiency while operating within a commercial temperature range and a defined core voltage supply.

Key Features

• Core logic  4,992 logic elements implemented across 624 LABs, providing a large programmable fabric for general-purpose and specialized logic functions.
• Logic capacity  Approximately 257,000 gates of logic capacity for implementing combinational and sequential designs.
• Embedded memory  49,152 bits of on-chip RAM (embedded memory) to support buffering, FIFOs, and other data-storage megafunctions.
• I/O connectivity  338 user I/O pins to support a wide range of external peripherals and interfaces on a single device.
• Package and mounting  484-BBGA package (484-FBGA, 23×23) in a surface-mount form factor for compact board-level integration.
• Power and thermal  Core voltage supply specified at 2.375 V to 2.625 V; commercial operating temperature range 0 °C to 70 °C.
• Series-level system features  FLEX 10K family characteristics include embedded arrays for implementing megafunctions, in-circuit reconfigurability options and built-in JTAG boundary-scan test circuitry (series documented features).

Typical Applications

• Embedded systems and SOPC integration  Use the device’s embedded memory and logic fabric to implement integrated system functions and custom megafunctions.
• I/O-dense interface logic  Implement protocol bridging, bus glue logic and custom peripheral interfaces using the device’s 338 I/O pins.
• Memory-rich buffering and data paths  On-chip RAM provides local storage for buffering, FIFOs and temporary data staging in signal and data-processing pipelines.
• Compact board-level solutions  The 484-FBGA surface-mount package enables dense PCB layouts where board space is constrained.

Unique Advantages

• Substantial logic resources: 4,992 logic elements and approximately 257,000 gates give designers headroom for moderate-complexity designs without external glue logic.
• On-chip memory availability: 49,152 bits of embedded RAM reduce the need for external memory in many buffering and data-path applications.
• High I/O count: 338 user I/O pins support multiple peripherals and parallel interfaces directly from the FPGA.
• Compact package delivery: The 484-FBGA (23×23) BGA package and surface-mount mounting type deliver board-space efficiency for dense system designs.
• Commercial-grade operational range: Specified core voltage and 0 °C to 70 °C operating temperature align the device for standard commercial electronics applications.
• Series-level integration features: FLEX 10K family capabilities such as embedded arrays, JTAG boundary-scan and in-circuit reconfigurability support system-level integration and testability.

Why Choose EPF10K100EFC484-1?

The EPF10K100EFC484-1 offers a balanced combination of logic density, embedded RAM and I/O capacity in a compact 484-FBGA package for commercial electronic designs. Its feature set supports on-chip megafunctions and board-level integration where mid-range programmable logic and significant I/O are required.

This device is well suited to engineering teams building embedded systems, interface logic, memory-buffered pipelines and other applications that benefit from integrated programmable logic, on-chip memory and a high pin count in a surface-mount BGA footprint.

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