EPF10K100EFC256-2AA

The EPF10K100EFC256-2AA is a FLEX-10KE field programmable gate array (FPGA) offering embedded programmable logic and memory resources for commercial embedded designs. Built as part of the FLEX 10KE family, it combines an array of logic elements with dedicated embedded array blocks (EABs) to enable system-on-a-programmable-chip (SOPC) integration and megafunction implementation.

Designed for surface-mount applications, the device provides 4,992 logic elements, 49,152 total RAM bits, and 191 I/O pins in a 256-ball BGA package, delivering a balance of logic density, on-chip memory, and I/O capacity for commercial electronic products and embedded systems.

Key Features

• Logic Capacity  4,992 logic elements and a listed system gates figure of 257,000 provide programmable fabric for combinational and sequential logic implementations.
• Embedded Memory (EABs)  12 embedded array blocks (EABs) with dual-port capability and up to 16-bit width per EAB enable efficient on-chip data storage and shared-memory megafunctions. Total RAM: 49,152 bits.
• I/O and Voltage Support  191 user I/O pins with MultiVolt I/O support for interfacing to multiple voltage domains; device internal supply operates in the 2.375 V to 2.625 V range.
• Clocking and Timing Features  Built-in low-skew clock distribution trees and ClockLock/ClockBoost options support reduced clock delay and clock multiplication for synchronous designs.
• Interconnect and Arithmetic Support  FastTrack interconnect architecture plus dedicated carry and cascade chains accelerate arithmetic, adders, counters, and high-fan-in logic without consuming extra general logic resources.
• Configuration and Test  In-circuit reconfigurability via external configuration devices, intelligent controllers, or the JTAG port; integrated IEEE Std. 1149.1 boundary-scan test (BST) circuitry is available without consuming additional device logic.
• Package and Mounting  256-BGA (supplier package: 256-FBGA 17×17) optimized for surface-mount assembly in compact commercial designs.
• Commercial Temperature Grade  Rated for operation from 0 °C to 70 °C and specified as commercial grade for non-industrial applications.
• Environmental Compliance  RoHS compliant.

Typical Applications

• System-on-a-Programmable-Chip (SOPC) Integration  Combine logic, embedded memory, and I/O to implement custom SOPC functions and megafunctions within a single programmable device.
• Embedded Control and Glue Logic  Implement control engines, protocol adapters, and interface glue logic using the device’s abundant logic elements and configurable I/O.
• Memory-Intensive Logic  Use the 12 EABs and dual-port memory capability for small data buffers, FIFOs, and shared-memory architectures in commercial embedded products.
• High-Fan-In and Arithmetic Functions  Leverage dedicated carry and cascade chains to accelerate adders, comparators, and arithmetic datapaths without excessive general logic use.

Unique Advantages

• Balanced Logic and Memory: 4,992 logic elements paired with 49,152 RAM bits and 12 EABs let you partition logic and storage efficiently for mixed-function designs.
• Flexible I/O Voltage Options: MultiVolt I/O capability supports interfacing to different voltage domains while the device operates from a 2.375 V–2.625 V internal supply.
• Integrated Test and Configuration: Built-in JTAG boundary-scan and in-circuit reconfigurability simplify board-level testing and field updates without consuming logic resources.
• Performance-Focused Routing: FastTrack interconnect and dedicated arithmetic chains reduce routing overhead and improve timing predictability for critical paths.
• Compact Surface-Mount Package: 256-FBGA (17×17) package enables dense PCB integration for space-constrained commercial applications.
• Regulatory Compliance: RoHS compliance supports environmentally conscious product designs.

Why Choose EPF10K100EFC256-2AA?

The EPF10K100EFC256-2AA positions itself as a versatile commercial-grade FPGA within the FLEX 10KE family, offering a practical combination of logic density, embedded memory, and I/O capacity in a compact BGA package. Its architecture—featuring EABs with dual-port capability, dedicated arithmetic chains, and FastTrack interconnect—helps reduce implementation complexity for SOPC, control logic, and memory-centric functions.

This device is well suited to design teams building commercial embedded systems that require on-chip memory resources, configurable I/O, and field reconfigurability. Backed by the FLEX 10KE family feature set, it provides a scalable option for projects that need reliable programmable logic with standard commercial temperature and RoHS compliance.

Request a quote or submit an inquiry to receive pricing and availability for the EPF10K100EFC256-2AA.