EPF10K100EFC256-2

The EPF10K100EFC256-2 is a FLEX-10KE family field programmable gate array (FPGA) in a 256-BGA package designed for commercial embedded logic applications. It provides a mid-density programmable fabric with 4992 logic elements and on-chip embedded memory, suitable for custom digital logic, interface bridging, and control functions.

Designed for board-level integration, this surface-mount device offers a large user I/O count and package density while operating within a commercial temperature range and a defined core supply window, making it appropriate for a wide range of non-automotive embedded designs.

Key Features

• Logic Capacity — 4992 logic elements, delivering substantial programmable logic resources for mid-density designs.
• Embedded Memory — 49152 bits of total RAM (approximately 48 Kbits) for on-chip data storage, FIFO buffers, and small lookup tables.
• User I/O — 191 user I/O pins to support multiple interfaces and peripheral connections on a single device.
• Gate Count — 257,000 gates that describe the overall device complexity for system-level planning.
• Package & Mounting — 256-ball BGA (supplier package: 256-FBGA, 17×17) in a surface-mount form factor for compact PCB implementations.
• Power — Defined supply window of 2.375 V to 2.625 V for core operation, enabling predictable power budgeting.
• Operating Conditions — Commercial grade operation with a specified ambient temperature range of 0 °C to 70 °C.
• Standards & Family Features — Part of the FLEX 10K family; family-level features documented in the FLEX 10K datasheet include JTAG boundary-scan (IEEE 1149.1) and family-specific interconnect and clocking capabilities.
• Compliance — RoHS compliant.

Typical Applications

• Embedded System Control — Implement custom state machines, protocol handling, and control logic using on-chip logic and RAM to consolidate functions and reduce external components.
• Interface Bridging — Use the device’s 191 I/Os to bridge between multiple parallel and serial interfaces or to implement custom peripheral interfaces.
• Prototyping and Development — Mid-density logic and embedded memory make this FPGA suitable for proof-of-concept designs and iterative hardware development.
• Custom Digital Peripherals — Implement application-specific accelerators, glue logic, and peripheral controllers within a compact BGA footprint.

Unique Advantages

• Mid-density programmable fabric — 4992 logic elements provide a balance between capability and cost for many embedded designs.
• On-chip RAM — Approximately 48 Kbits of embedded memory reduces external RAM needs for small buffers and state storage.
• High I/O count — 191 user I/Os allow flexible connectivity to sensors, peripherals, and host interfaces without additional I/O expanders.
• Compact BGA package — 256-FBGA (17×17) supports high pin density in a space-efficient surface-mount package.
• Clear power envelope — Specified supply range (2.375–2.625 V) simplifies power-supply design and verification.
• Commercial-grade suitability — Rated for 0 °C to 70 °C operation for typical commercial embedded product environments.

Why Choose EPF10K100EFC256-2?

The EPF10K100EFC256-2 positions as a capable mid-density FLEX-10KE FPGA option for commercial embedded projects that require a balance of logic resources, on-chip memory, and a high number of I/Os in a compact BGA footprint. Its defined supply range and commercial temperature rating make it appropriate for standard board-level products and development platforms.

Choosing this device delivers a modular, reprogrammable building block suitable for consolidating glue logic, implementing custom peripherals, and accelerating prototyping cycles while benefiting from the FLEX 10K family features documented in the series datasheet.

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