EPF10K100EBC356-3

The EPF10K100EBC356-3 is a FLEX-10KE family field programmable gate array offering 4,992 logic elements and approximately 49,152 bits of embedded RAM in a 356-LBGA (35×35) surface-mount package. Designed for commercial-temperature applications, the device provides a high I/O count (274 pins) and a core supply voltage range of 2.375 V to 2.625 V.

As part of the FLEX 10K embedded programmable logic family, this device is suited for designs requiring on-chip memory, reconfigurable logic and robust on-board I/O in a compact BGA footprint.

Key Features

• Logic Capacity — 4,992 logic elements distributed across 624 logic array blocks, enabling mid-range programmable logic integration.
• Embedded Memory — Approximately 49,152 bits of on-chip RAM available for data buffering, state storage and small embedded memories.
• I/O and Package — 274 user I/O pins in a 356-LBGA (356-BGA, 35×35) surface-mount package suitable for dense board layouts.
• Power and Temperature — Core supply voltage range of 2.375 V to 2.625 V and commercial operating temperature range of 0 °C to 70 °C; RoHS compliant.
• Reconfigurability & Test — FLEX 10K family supports in-circuit reconfigurability via external configuration device, intelligent controller, or JTAG; includes built-in JTAG boundary-scan test circuitry (IEEE 1149.1) as a family feature.
• Dedicated Interconnect — Family-level features include FastTrack continuous routing and dedicated carry/cascade chains for arithmetic and high-fan-in logic (refer to FLEX 10K family documentation for details).
• Clocking Options — FLEX 10K family provides low-skew clock distribution and options such as ClockLock and ClockBoost for clock delay/skew and clock multiplication (family feature).
• Package & Mounting — Surface-mount 356-LBGA package (356-BGA, 35×35) for compact board integration and high-pin-count routing.

Typical Applications

• Embedded System Integration — Implement system-on-a-programmable-chip (SOPC) functions that combine logic and embedded memory for control and glue logic tasks.
• Interface and Peripheral Control — Use the high I/O count for bridging peripherals, implementing protocol interfaces and custom I/O adaptation.
• Prototyping and Development — Mid-density logic and on-chip RAM make this device suitable for prototyping custom logic and validating system interfaces.
• Data Buffering and Small Memories — Approximately 49,152 bits of embedded RAM supports buffering, FIFOs and small embedded storage blocks within logic designs.

Unique Advantages

• Balanced Logic and Memory — 4,992 logic elements paired with ~49,152 bits of RAM provide a practical balance for designs that need both combinational/sequential logic and embedded storage.
• High I/O Density in a Compact BGA — 274 I/Os in a 356-LBGA package allow dense external connectivity while conserving PCB space.
• In-System Reconfigurability — FLEX 10K family support for in-circuit reconfiguration and JTAG boundary-scan enables flexible deployment and board-level testability.
• Commercial Temperature and RoHS Compliance — Rated for 0 °C to 70 °C operation and RoHS compliant to meet common commercial product requirements.
• Family-Level Design Features — FastTrack interconnect, dedicated carry/cascade chains and advanced clocking features available in the FLEX 10K family help streamline implementation of arithmetic and timing-critical functions.
• Surface-Mount BGA Form Factor — The 356-BGA (35×35) package facilitates scalable designs and pin-compatibility within FLEX 10K family package options.

Why Choose EPF10K100EBC356-3?

The EPF10K100EBC356-3 positions itself as a mid-density, reconfigurable logic device within the FLEX 10K family, offering a practical mix of logic elements, embedded RAM and a high number of I/Os in a compact 356-LBGA package. It is suited for embedded systems engineers and designers who need on-chip memory, flexible I/O routing and in-system configurability in commercial-temperature products.

Choosing this device provides a balance of integration and flexibility for applications that require mid-range programmable logic, board-level testability, and a compact BGA package, backed by the FLEX 10K family design features and tooling support referenced in the family documentation.

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