EPF10K100EBC356-1X

The EPF10K100EBC356-1X is a FLEX-10KE family field programmable gate array (FPGA) from Intel designed for system-level programmable logic integration. This device combines an embedded array for implementing memory and specialized logic with a general-purpose logic array to address custom digital designs requiring moderate logic density and on-chip RAM.

With 4,992 logic elements, 624 LABs, approximately 49,152 bits of embedded RAM, and 274 I/O pins in a 356-ball BGA (35×35) package, the EPF10K100EBC356-1X is targeted at embedded systems, communications interfaces, and custom logic integration where board-level I/O and on-chip memory are important.

Key Features

• Core Logic  4,992 logic elements arranged across 624 LABs provide the device’s programmable logic capacity for implementing custom combinational and sequential logic.
• Embedded Memory  Approximately 49,152 bits of on-chip RAM support storage for buffering, FIFOs, and embedded megafunctions.
• I/O and Package  274 user I/O pins in a 356-LBGA (356-BGA, 35×35 mm) package with surface-mount mounting for dense board designs.
• Device Density  Specified at 257,000 gates, enabling multi-function integration combining logic and embedded memory on a single IC.
• Power Supply  Operates from a 2.375 V to 2.625 V supply range to match system power domains where this voltage is required.
• Operating Conditions  Commercial grade operation with a specified temperature range of 0 °C to 70 °C and RoHS compliance.
• System and Design Support (series-level)  FLEX 10K family features documented in the series include embedded-array megafunction support, JTAG boundary-scan, and software design tool support for automatic place-and-route and megafunction integration.

Typical Applications

• Embedded Systems  Use the EPF10K100EBC356-1X for SOPC-style integration where on-chip RAM and programmable logic implement control, glue logic, and subsystem functions.
• Interface and I/O Bridging  The device’s 274 I/O pins and flexible logic make it suitable for protocol bridging, signal conditioning, and custom peripheral interfacing.
• Communications & Networking  Implement packet processing, buffering, and custom framing logic using the logic array and embedded RAM.
• Prototyping and Custom Logic  Rapidly iterate hardware designs that require reconfigurable logic and embedded memory without changing PCB hardware.

Unique Advantages

• Balanced Logic and Memory Integration: 4,992 logic elements paired with ~49,152 bits of embedded RAM lets you implement both control logic and local data buffering on a single device, reducing external memory dependency.
• High I/O Count: 274 user I/Os in a compact 356-BGA package support complex board-level connectivity and high-pin-count interfaces.
• Compact Surface-Mount Packaging: The 356-LBGA (35×35) surface-mount package provides high pin density for space-constrained PCBs.
• Defined Commercial Operating Range: Commercial grade specification and 0 °C to 70 °C operating temperature simplify deployment in controlled-environment embedded applications.
• Design Ecosystem (Series Features): FLEX 10K family documentation includes support for embedded megafunctions, JTAG boundary-scan, and automated place-and-route tools to accelerate development.

Why Choose EPF10K100EBC356-1X?

The EPF10K100EBC356-1X positions itself as a versatile, commercially graded FPGA for engineers who need a balance of programmable logic, embedded RAM, and extensive I/O in a compact BGA package. Its combination of 4,992 logic elements, 624 LABs, and ~49 kbits of on-chip RAM enables consolidation of custom logic and local memory, lowering system complexity and BOM count.

This device is well suited to teams developing embedded platforms, interface bridges, and communications subsystems that rely on reconfigurable logic. Series-level design support and built-in test features streamline development and help shorten time to prototype and production.

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