EPF10K100EBC356-1N

The EPF10K100EBC356-1N is a FLEX-10KE® field programmable gate array supplied in a 356-ball LGA package. It provides a balance of configurable logic, on-chip RAM and high I/O count suitable for commercial embedded and digital designs.

With 4,992 logic elements, 49,152 bits of embedded RAM and 274 I/O, this device targets mid-range FPGA applications that require flexible digital logic implementation in a compact surface-mount package.

Key Features

• Core Logic  4,992 logic elements and 624 logic blocks provide the programmable fabric for implementing custom digital functions.
• Embedded Memory  49,152 total RAM bits (approximately 0.049 Mbits) of on-chip memory for buffering, state storage and small lookup tables.
• I/O Capacity  274 general-purpose I/O pins enable broad interfacing to peripherals, sensors and external devices.
• Package  356-LBGA (356-BGA, 35×35) physical package optimized for surface-mount PCB assembly and compact board layouts.
• Power  Operates from a core supply range of 2.375 V to 2.625 V, suitable for standard low-voltage FPGA power domains.
• Operating Range  Commercial-grade device rated for 0 °C to 70 °C ambient operation.
• RoHS Compliance  Lead-free, RoHS-compliant manufacturing.

Typical Applications

• Embedded Digital Systems  Implement custom control logic and peripheral interfacing where a moderate number of logic elements and abundant I/O are required.
• Prototyping & Development  Use the programmable fabric and on-chip RAM to validate and iterate digital designs before final integration.
• Communication Interfaces  Provide protocol bridging, parallel/serial interfacing and glue-logic with the device’s high I/O count.

Unique Advantages

• Substantial Logic Capacity: 4,992 logic elements enable mid-range logic implementations without immediate need for larger, more complex devices.
• High I/O Count: 274 I/O pins simplify system integration by reducing the need for external I/O expanders.
• Compact BGA Package: 356-LBGA (35×35) package supports dense PCB layouts while maintaining a surface-mount form factor.
• Embedded Memory: 49,152 bits of on-chip RAM supply local buffering and small data storage to support control and data path functions.
• Commercial Temperature Rating: Specified for 0 °C to 70 °C operation for mainstream electronic products and environments.
• Regulatory Compliance: RoHS-compliant construction supports lead-free assembly and regulatory requirements for many commercial products.

Why Choose EPF10K100EBC356-1N?

The EPF10K100EBC356-1N positions itself as a practical, commercially graded FPGA solution for designers seeking a balance of logic capacity, memory and extensive I/O in a compact BGA package. Its combination of 4,992 logic elements, 49,152 bits of embedded RAM and 274 I/O makes it well suited for mid-range digital designs, prototyping and systems where board space and I/O density matter.

Specified for 2.375 V–2.625 V core operation and 0 °C–70 °C ambient temperature, this device offers predictable electrical and thermal characteristics for commercial applications, while RoHS compliance supports modern manufacturing requirements.

If you would like pricing, availability or a formal quote for EPF10K100EBC356-1N, submit a request to receive detailed lead-time and purchasing information.