EPF10K100EBC356-2X

The EPF10K100EBC356-2X is a FLEX-10KE® Field Programmable Gate Array (FPGA) provided in a 356-LBGA package. It delivers a balance of on-chip logic, embedded RAM and high pin-count I/O for configurable digital designs.

This device is appropriate for designs that require up to 4,992 logic elements, approximately 49 kbits of embedded RAM, and up to 274 user I/O pins, while operating within a commercial temperature and specified core supply voltage range.

Key Features

• Core Logic  Approximately 4,992 logic elements supporting user-defined digital logic functions and design partitioning.
• Embedded Memory  Approximately 49 kbits of on-chip RAM (49,152 bits) to support data buffering, small FIFOs and state storage.
• I/O Capacity  Up to 274 I/O pins for extensive external connectivity and interfacing with peripherals and daughtercards.
• Design Density  Equivalent to roughly 257,000 gates for implementing medium-complexity digital systems.
• Power  Specified core voltage supply range of 2.375 V to 2.625 V for predictable power planning and regulation.
• Package & Mounting  356-LBGA (supplier package: 356-BGA, 35×35 mm) in a surface-mount format to support compact PCB layouts.
• Commercial Temperature Grade  Rated for 0 °C to 70 °C operation for standard commercial applications.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• Custom digital logic  Implement glue logic, protocol bridging and application-specific datapaths using the available logic elements and embedded RAM.
• I/O-rich systems  Interface numerous sensors, controllers or peripheral devices leveraging up to 274 dedicated I/O pins.
• Embedded buffering and control  Use on-chip RAM for small buffers, FIFOs, or control/state storage within embedded designs.

Unique Advantages

• Balanced logic and memory:  4,992 logic elements paired with approximately 49 kbits of embedded RAM enable compact implementations of medium-complexity functions without external memory.
• High I/O count:  274 I/O pins reduce the need for external I/O expanders and simplify board-level interfacing.
• Predictable power planning:  A clearly defined supply voltage range (2.375 V–2.625 V) aids regulator selection and power-budgeting during design.
• Compact BGA package:  356-LBGA (35×35 mm) surface-mount package supports space-constrained PCB designs while providing a high pin density.
• Commercial temperature rating:  Operation across 0 °C–70 °C fits a wide range of consumer and commercial electronics applications.
• RoHS compliant:  Supports environmentally regulated manufacturing requirements.

Why Choose EPF10K100EBC356-2X?

The EPF10K100EBC356-2X provides a pragmatic combination of logic density, embedded RAM and I/O capacity in a single FLEX-10KE® FPGA package. Its specifications make it well-suited for designers building medium-complexity, I/O-intensive digital systems that require on-chip memory and predictable power and thermal planning within a commercial temperature envelope.

Choose this part when you need a compact BGA solution with nearly 5,000 logic elements, substantial I/O capability and RoHS compliance for mainstream embedded and electronic product designs.

Request a quote or submit an inquiry to obtain pricing and availability for the EPF10K100EBC356-2X. Our team will assist with lead times and procurement details.