EPF10K100EFC256-1

The EPF10K100EFC256-1 is a FLEX-10KE family FPGA from Intel, delivered in a 256-LBGA surface-mount package. It integrates 4,992 logic elements and approximately 49 kbits of on-chip RAM with 191 user I/Os to support complex embedded logic and system integration tasks.

Designed for commercial-grade applications, this device combines high logic density and significant on-chip memory capacity to enable custom logic, peripheral interfacing, and system-on-programmable-chip (SOPC) style integration.

Key Features

• Core Logic  4,992 logic elements and 624 logic array blocks (LABs) provide programmable fabric for implementing custom logic functions and state machines.
• On-chip Memory  Total RAM: 49,152 bits (approximately 49 kbits) of embedded memory for FIFOs, buffers, and small data stores without external RAM.
• Logic Capacity  Approximately 257,000 gates for system-level logic integration and mid-range FPGA designs.
• I/O Resources  191 user I/Os to support dense peripheral connectivity and interface bridging directly on-chip.
• System & Configuration  Built-in JTAG boundary-scan (IEEE 1149.1) and support for in-circuit reconfigurability enable development visibility and field updates without consuming user logic.
• Power & Supply  Specified supply range: 2.375 V to 2.625 V, allowing predictable power budgeting for the device core.
• Package & Mounting  256-LBGA (256-BGA, 27 × 27 mm) surface-mount package for compact board integration and reliable assembly.
• Commercial Grade & Environmental  Operating temperature: 0 °C to 70 °C; RoHS compliant.

Typical Applications

• Embedded Systems  Implement custom control logic, glue logic, and SOPC-style integration using on-chip RAM and abundant logic elements.
• Interface Bridging  Use the 191 I/Os to implement protocol conversion, bus bridging, and multi-peripheral interfaces on a single device.
• Prototyping & Development  Leverage JTAG boundary-scan and in-circuit reconfiguration to iterate designs and validate hardware/software integration.
• On-board Peripheral Integration  Embed FIFOs, small buffers, and peripheral controllers using the device’s embedded RAM and logic resources to reduce external component count.

Unique Advantages

• High Logic Density: 4,992 logic elements and ~257,000 gates provide the capacity to consolidate multiple discrete functions into a single FPGA.
• Substantial On-chip Memory: Approximately 49 kbits of embedded RAM enables local buffering and small data structures without external memory.
• Rich I/O Availability: With 191 user I/Os, the device supports complex routing to peripherals and multi-channel interfaces directly from the FPGA.
• Production-friendly Package: 256-LBGA surface-mount package balances board space efficiency with robust assembly characteristics.
• Development & Test Support: Integrated JTAG boundary-scan and in-circuit reconfigurability simplify testing, debug, and firmware updates in the field.
• Commercial-grade Reliability: Specified operating range (0 °C to 70 °C) and RoHS compliance align with standard commercial product requirements.

Why Choose EPF10K100EFC256-1?

The EPF10K100EFC256-1 positions itself as a capable mid-range FLEX-10KE FPGA that balances logic density, on-chip memory, and extensive I/O in a compact 256-LBGA package. It is well-suited for designers who need to consolidate peripheral functions, implement custom hardware accelerators, or build SOPC-style embedded systems while maintaining commercial-grade operating conditions.

For teams focused on reducing BOM count and accelerating system integration, this device provides the programmable fabric, embedded memory, and test/configuration features to support iterative development, in-field updates, and robust board-level implementation.

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