EPF10K100EFC256-2X

IC FPGA 191 I/O 256FBGA
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 191 49152 4992 256-BGA

Quantity 712 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 70°C
Package / Case256-BGANumber of I/O191Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs624Number of Logic Elements/Cells4992
Number of Gates257000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits49152

Overview of EPF10K100EFC256-2X – FLEX-10KE® Field Programmable Gate Array (FPGA) 256-BGA

The EPF10K100EFC256-2X is a FLEX-10KE family field programmable gate array (FPGA) IC designed for embedded programmable logic and system-on-a-programmable-chip integration. The device combines a dedicated logic array and embedded array resources to implement custom logic, megafunctions and on-chip memory for a wide range of embedded applications.

Built in a 256-FBGA (17×17) package, the device delivers 4,992 logic elements, 49,152 bits of total RAM, and 191 user I/O pins, making it suitable for designs that require mid-range logic density, significant embedded memory, and substantial I/O connectivity within a compact surface-mount package.

Key Features

  • Core Logic  4,992 logic elements provide the programmable fabric for implementing custom logic and control functions.
  • Embedded Memory  49,152 bits of total on-chip RAM to support buffers, FIFOs, and other memory-based megafunctions.
  • I/O and Connectivity  191 user I/O pins support broad external interfacing requirements in a compact 256-BGA package.
  • Package and Mounting  256-FBGA (17×17) surface-mount package balances board-space efficiency with thermal and routing considerations.
  • Electrical  Specified supply voltage range: 2.375 V to 2.625 V.
  • Operating Range and Grade  Commercial grade device rated for 0 °C to 70 °C operating temperature; RoHS compliant.
  • Reconfigurability and Test  Supports in-circuit reconfigurability and includes JTAG boundary-scan test circuitry for device programming and board-level test.
  • Series-Level System Features  FLEX 10K family capabilities include embedded arrays for megafunctions, programmable interconnect structures, and dedicated carry/cascade chains for arithmetic and high-fan-in logic (series-level features documented for the FLEX 10K family).
  • Design Tool Support (Series)  The FLEX 10K family is supported by vendor-provided development systems for place-and-route and design entry (series-level software support documented for the FLEX 10K family).

Typical Applications

  • System Integration / SOPC  Implement system-on-a-programmable-chip functions and megafunctions that combine memory and specialized logic in a single device.
  • Embedded Control and Interface  Use the device’s 191 I/O pins and on-chip memory for sensor interfacing, protocol bridging, and real-time control tasks.
  • Communication and Data Path  Deploy the FPGA for buffering, packet handling, or custom data-path logic where mid-range gate capacity and embedded RAM are required.
  • Prototyping and Development  Take advantage of in-circuit reconfigurability and JTAG support for iterative hardware development and board-level validation.

Unique Advantages

  • Balanced logic and memory resources: 4,992 logic elements combined with 49,152 bits of RAM supports a wide range of mid-density designs that need embedded storage.
  • High I/O count in a compact footprint: 191 user I/O pins in a 256-FBGA package simplify board-level connectivity while preserving PCB area.
  • Reconfigurable and testable: In-circuit reconfigurability plus built-in JTAG boundary-scan enable flexible field updates and streamlined board test.
  • Commercial temperature and RoHS compliance: Rated for 0 °C to 70 °C operation and RoHS compliant to meet standard commercial product requirements.
  • Series-proven features: FLEX 10K family characteristics—such as embedded arrays for megafunctions, dedicated carry/cascade chains, and vendor design-tool support—provide a familiar development flow for designers working within this product family.
  • Compact BGA mounting: 256-FBGA surface-mount package supports dense board layouts without sacrificing the device’s electrical connectivity.

Why Choose EPF10K100EFC256-2X?

The EPF10K100EFC256-2X positions itself as a mid-density, commercially graded FPGA option for projects that require a balance of programmable logic, embedded memory, and a high count of I/O in a compact BGA package. Its combination of 4,992 logic elements, 49,152 bits of RAM and 191 user I/Os enables integration of custom logic, buffering and interface functions while supporting iterative development through in-circuit reconfigurability and JTAG.

This device is well suited for engineering teams and OEMs building embedded systems, communication interfaces, and custom control logic that require predictable supply-voltage operation (2.375 V–2.625 V), standard commercial temperature range, and compliance with RoHS requirements. Series-level tool support and documented FLEX 10K family features help shorten development cycles and simplify migration within the family.

Request a quote or submit an inquiry to check availability and pricing for the EPF10K100EFC256-2X and to evaluate it for your next embedded FPGA design.

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