EPF10K100EFC256-2X
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 191 49152 4992 256-BGA |
|---|---|
| Quantity | 712 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 191 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 624 | Number of Logic Elements/Cells | 4992 | ||
| Number of Gates | 257000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49152 |
Overview of EPF10K100EFC256-2X – FLEX-10KE® Field Programmable Gate Array (FPGA) 256-BGA
The EPF10K100EFC256-2X is a FLEX-10KE family field programmable gate array (FPGA) IC designed for embedded programmable logic and system-on-a-programmable-chip integration. The device combines a dedicated logic array and embedded array resources to implement custom logic, megafunctions and on-chip memory for a wide range of embedded applications.
Built in a 256-FBGA (17×17) package, the device delivers 4,992 logic elements, 49,152 bits of total RAM, and 191 user I/O pins, making it suitable for designs that require mid-range logic density, significant embedded memory, and substantial I/O connectivity within a compact surface-mount package.
Key Features
- Core Logic 4,992 logic elements provide the programmable fabric for implementing custom logic and control functions.
- Embedded Memory 49,152 bits of total on-chip RAM to support buffers, FIFOs, and other memory-based megafunctions.
- I/O and Connectivity 191 user I/O pins support broad external interfacing requirements in a compact 256-BGA package.
- Package and Mounting 256-FBGA (17×17) surface-mount package balances board-space efficiency with thermal and routing considerations.
- Electrical Specified supply voltage range: 2.375 V to 2.625 V.
- Operating Range and Grade Commercial grade device rated for 0 °C to 70 °C operating temperature; RoHS compliant.
- Reconfigurability and Test Supports in-circuit reconfigurability and includes JTAG boundary-scan test circuitry for device programming and board-level test.
- Series-Level System Features FLEX 10K family capabilities include embedded arrays for megafunctions, programmable interconnect structures, and dedicated carry/cascade chains for arithmetic and high-fan-in logic (series-level features documented for the FLEX 10K family).
- Design Tool Support (Series) The FLEX 10K family is supported by vendor-provided development systems for place-and-route and design entry (series-level software support documented for the FLEX 10K family).
Typical Applications
- System Integration / SOPC Implement system-on-a-programmable-chip functions and megafunctions that combine memory and specialized logic in a single device.
- Embedded Control and Interface Use the device’s 191 I/O pins and on-chip memory for sensor interfacing, protocol bridging, and real-time control tasks.
- Communication and Data Path Deploy the FPGA for buffering, packet handling, or custom data-path logic where mid-range gate capacity and embedded RAM are required.
- Prototyping and Development Take advantage of in-circuit reconfigurability and JTAG support for iterative hardware development and board-level validation.
Unique Advantages
- Balanced logic and memory resources: 4,992 logic elements combined with 49,152 bits of RAM supports a wide range of mid-density designs that need embedded storage.
- High I/O count in a compact footprint: 191 user I/O pins in a 256-FBGA package simplify board-level connectivity while preserving PCB area.
- Reconfigurable and testable: In-circuit reconfigurability plus built-in JTAG boundary-scan enable flexible field updates and streamlined board test.
- Commercial temperature and RoHS compliance: Rated for 0 °C to 70 °C operation and RoHS compliant to meet standard commercial product requirements.
- Series-proven features: FLEX 10K family characteristics—such as embedded arrays for megafunctions, dedicated carry/cascade chains, and vendor design-tool support—provide a familiar development flow for designers working within this product family.
- Compact BGA mounting: 256-FBGA surface-mount package supports dense board layouts without sacrificing the device’s electrical connectivity.
Why Choose EPF10K100EFC256-2X?
The EPF10K100EFC256-2X positions itself as a mid-density, commercially graded FPGA option for projects that require a balance of programmable logic, embedded memory, and a high count of I/O in a compact BGA package. Its combination of 4,992 logic elements, 49,152 bits of RAM and 191 user I/Os enables integration of custom logic, buffering and interface functions while supporting iterative development through in-circuit reconfigurability and JTAG.
This device is well suited for engineering teams and OEMs building embedded systems, communication interfaces, and custom control logic that require predictable supply-voltage operation (2.375 V–2.625 V), standard commercial temperature range, and compliance with RoHS requirements. Series-level tool support and documented FLEX 10K family features help shorten development cycles and simplify migration within the family.
Request a quote or submit an inquiry to check availability and pricing for the EPF10K100EFC256-2X and to evaluate it for your next embedded FPGA design.

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