EPF10K100EFC256-1X

The EPF10K100EFC256-1X is a FLEX-10KE family field programmable gate array (FPGA) supplied in a 256-ball BGA package. It combines a dedicated logic array and embedded memory to implement a wide range of custom digital functions for commercial embedded designs.

With 4,992 logic elements, substantial on-chip RAM, and 191 general-purpose I/O pins, this device targets commercial applications that require medium-density programmable logic, compact board footprint, and RoHS-compliant components.

Key Features

• Logic Capacity — 4,992 logic elements providing approximately 257,000 gates of programmable logic capacity for combinational and sequential designs.
• Embedded Memory — 49,152 bits of on-chip RAM to support buffers, small data tables, and temporary storage within the FPGA fabric.
• Logic Array Blocks (LABs) — 624 LABs for organized routing and placement of logic functions across the device.
• I/O Density — 191 user I/O pins enabling connectivity to a wide range of peripherals and interfaces on a single device.
• Package & Mounting — 256-ball fine-pitch FBGA (17×17) in a surface-mount form factor that maximizes board space efficiency.
• Power — Device supply range specified at 2.375 V to 2.625 V for core or IO domain as provided in the product data.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 70 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Commercial Embedded Systems — Implement control logic, protocol handling, and glue logic in compact, board-level commercial products.
• Communications Equipment — Support medium-density packet processing, interface bridging, and custom timing/control functions using available logic and I/O resources.
• Test & Measurement — Provide flexible digital front-end processing, trigger logic, and data formatting on test instruments and lab equipment.
• Prototyping and Evaluation — Suitable for design validation and development of custom logic before scaling to higher-density devices within the FLEX family.

Unique Advantages

• Scalable logic capacity: 4,992 logic elements and roughly 257,000 gates allow designers to implement sizeable custom logic without external glue logic.
• Integrated embedded RAM: 49,152 bits of on-chip memory reduce dependence on external memory for small buffers and lookup tables, simplifying BOM and board routing.
• High I/O count: 191 I/O pins provide flexibility to interface with multiple peripherals, sensors, and external devices from a single package.
• Compact, board-friendly package: 256-FBGA (17×17) surface-mount package balances I/O density with minimal board area impact for space-constrained designs.
• Commercial operating range: 0 °C to 70 °C and commercial grade classification align the device with mainstream product development and production environments.
• Regulatory readiness: RoHS compliance supports environmental and manufacturing requirements for commercial electronics.

Why Choose EPF10K100EFC256-1X?

The EPF10K100EFC256-1X delivers a balanced combination of logic capacity, embedded memory, and I/O density in a compact 256-FBGA package for commercial embedded designs. It is well suited to developers who need medium-density programmable logic with integrated RAM and ample I/O while maintaining a small PCB footprint and RoHS-compliant component selection.

This FPGA is appropriate for teams building communications gear, lab equipment, or commercial embedded systems that require on-chip resources to lower board complexity, simplify routing, and accelerate time-to-market using a vendor-supported FPGA family.

Request a quote or submit an inquiry for pricing and availability for EPF10K100EFC256-1X.