EPF10K100EFC256-3

The EPF10K100EFC256-3 is a FLEX 10K series embedded programmable logic device combining a logic array and embedded memory to implement megafunctions and general-purpose logic. Designed for commercial applications, it provides a mid-range integration point with 4,992 logic elements and on-chip RAM suitable for System-on-a-Programmable-Chip (SOPC) integration and a variety of I/O-rich designs.

This device targets designers who need reconfigurable logic with substantial embedded RAM, flexible I/O, and a compact 256-ball FBGA package for board-level space efficiency in commercial-temperature systems.

Key Features

• Logic Core — 4,992 logic elements providing programmable logic resources for implementing control, glue logic, and custom functions.
• Embedded Memory — 49,152 total RAM bits of on-chip memory to support FIFOs, buffers, and other megafunctions.
• I/O Capacity — 191 user I/O pins with programmable output slew-rate control and open-drain options for flexible interfacing.
• Gate Capacity — 257,000 gates (device-specific counting) to support complex logic and mixed-function designs.
• Package & Mounting — 256-ball Fine-pitch BGA (256-FBGA, 17×17) in a surface-mount package for compact board layouts.
• Power — Device supply specified at 2.375 V to 2.625 V.
• Operating Range & Grade — Commercial grade operation over 0 °C to 70 °C.
• Reconfigurability & Test — In-circuit reconfigurability via external configuration device, intelligent controller, or JTAG; built-in JTAG boundary-scan test (BST) circuitry.
• Series-Level Architecture Features — Embedded array blocks for megafunctions, dedicated carry and cascade chains for high-speed arithmetic and fan-in logic, FastTrack continuous routing, and options such as ClockLock and ClockBoost for clock distribution control.
• Manufacturing & Compliance — Surface-mount BGA package and RoHS compliant.
• Design Support — Software design support and automatic place-and-route provided by Altera development systems for common workstation platforms (series-level support).

Typical Applications

• Embedded Systems (SOPC integration) — Implement system-level functions and on-chip megafunctions for control and data-path tasks in compact embedded systems.
• High-density Logic with On-chip Memory — Use the on-chip RAM for buffering, lookup tables, and other memory-dependent functions within logic-intensive designs.
• I/O and Peripheral Bridging — Leverage 191 I/O pins and programmable I/O options for bridging peripherals, sensors, and external buses in commercial electronics.
• Prototyping and Commercial Electronics — Suitable for commercial-temperature prototypes and production boards where reconfigurability and compact packaging are required.
• PCI-capable Designs (series-level) — FLEX 10K series devices include series-level support for PCI Local Bus Specification, Revision 2.2, enabling integration with PCI-based systems when applicable.

Unique Advantages

• Substantial Logic Density: 4,992 logic elements and 257,000 gates provide the capacity to consolidate multiple discrete functions into a single device, reducing BOM complexity.
• Significant On-chip RAM: 49,152 bits of embedded memory allow designers to implement FIFOs, buffers, and other RAM-based megafunctions without external memory.
• Flexible, High-count I/O: 191 programmable I/O pins with slew-rate and open-drain options simplify interfacing to a wide range of peripherals and boards.
• Compact Board Footprint: 256-FBGA (17×17) packaging enables compact PCB layouts while maintaining robust connectivity for high-pin-count designs.
• Reconfigurability and Testability: In-circuit reconfigurable capability and built-in JTAG boundary-scan streamline development, programming, and board-level test.
• Design Tool Ecosystem: Series-level support from Altera development systems facilitates design entry, automatic place-and-route, and integration into established workflows.

Why Choose EPF10K100EFC256-3?

The EPF10K100EFC256-3 positions itself as a commercially graded, mid-range FLEX 10K device for designers needing a balance of logic resources, embedded memory, and high I/O count in a compact BGA package. Its series-level architecture features — including dedicated arithmetic chains, flexible interconnect, and megafunction-capable embedded arrays — support integration of system functions and reduce the need for additional components.

Backed by built-in JTAG testability, in-circuit reconfigurability, RoHS compliance, and design-tool support, this device is suited to commercial embedded designs, prototyping, and production where reprogrammability, on-chip RAM, and a dense I/O complement are key requirements.

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