EPF10K100EFC484-1X

IC FPGA 338 I/O 484FBGA
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 338 49152 4992 484-BBGA

Quantity 371 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BBGANumber of I/O338Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs624Number of Logic Elements/Cells4992
Number of Gates257000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits49152

Overview of EPF10K100EFC484-1X – FLEX-10KE® Field Programmable Gate Array (FPGA) IC 338 49152 4992 484-BBGA

The EPF10K100EFC484-1X is a FLEX 10K family field programmable gate array designed for embedded programmable logic and system-level integration. It combines a high logic element count with embedded memory and a large I/O complement to address custom logic, memory-intensive functions, and configurable system interfaces.

This device targets commercial applications that require reconfigurable logic, significant on-chip RAM, and broad I/O capability, offering a balance of density, integration and reconfigurability for board-level FPGA solutions.

Key Features

  • Core Logic  4,992 logic elements and approximately 257,000 gates provide substantial combinational and sequential logic capacity for custom functions and control logic.
  • Embedded Memory  49,152 total RAM bits (approximately 48 Kbits) of on-chip memory for data buffering, small RAM tables, and scratch storage.
  • I/O and Interfaces  338 user I/O pins support extensive external connectivity and system interfacing needs.
  • Reconfigurability and Test  Supports in-circuit reconfigurability and includes JTAG boundary-scan test capabilities for device programming and board-level diagnostics (series feature).
  • Power and Supply  Specified core/voltage supply range of 2.375 V to 2.625 V to match system power design requirements.
  • Package and Mounting  Supplied in a 484-ball BGA package (484-FBGA, 23×23) optimized for compact board layouts; surface-mount mounting type.
  • Operating Range and Grade  Commercial grade device with an operating temperature range of 0 °C to 70 °C and RoHS compliance.
  • System-Level Features (Series)  FLEX 10K family features include embedded arrays for megafunctions, multi-volt I/O support, low-skew clock distribution, and software design support (series-level capabilities documented in the FLEX 10K family datasheet).

Typical Applications

  • System-on-a-Programmable-Chip (SOPC) integration  Embed custom logic and memory functions to consolidate system functions onto a single programmable device.
  • Custom bus and peripheral interfaces  High I/O count enables implementation of complex parallel interfaces, bus bridges, and protocol glue logic.
  • Memory-intensive logic  On-chip RAM supports buffering, look-up tables, and small data caches for data-path and control applications.
  • Adaptive and reconfigurable designs  In-circuit reconfigurability and JTAG support permit field updates and board-level testability for evolving designs.

Unique Advantages

  • High logic density: 4,992 logic elements and ~257,000 gates deliver the capacity to implement substantial custom logic without external ASICs.
  • Significant embedded memory: 49,152 bits of on-chip RAM reduce the need for external SRAM in many buffering and table applications.
  • Large I/O footprint: 338 user I/O pins enable rich peripheral and parallel interface support directly from the FPGA.
  • Reconfigurability and testability: Supports in-circuit reconfiguration and JTAG boundary-scan for flexible updates and streamlined board-level testing.
  • Compact assembly: 484-ball BGA package allows high-density board placement while maintaining robust connectivity for multi-pin designs.
  • Commercial-grade, RoHS-compliant: Commercial temperature rating (0 °C to 70 °C) and RoHS compliance support standard electronics production and environmental requirements.

Why Choose EPF10K100EFC484-1X?

EPF10K100EFC484-1X positions itself as a versatile, mid-to-high density programmable logic device for commercial embedded designs that demand a mix of logic capacity, embedded memory and extensive I/O. Its combination of nearly 5,000 logic elements, substantial on-chip RAM and hundreds of I/Os makes it suitable for consolidating glue logic, implementing memory-backed functions, and enabling configurable interfaces on compact PCBs.

Design teams benefit from the FLEX 10K family’s in-circuit reconfigurability, test support and documented software design tool compatibility, making this device a pragmatic choice for projects that require field updates, board-level testability, and established development flows.

Request a quote or submit a procurement request to evaluate EPF10K100EFC484-1X for your next programmable-logic design.

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