EPF10K100EFC484-1X
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 338 49152 4992 484-BBGA |
|---|---|
| Quantity | 371 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 338 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 624 | Number of Logic Elements/Cells | 4992 | ||
| Number of Gates | 257000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49152 |
Overview of EPF10K100EFC484-1X – FLEX-10KE® Field Programmable Gate Array (FPGA) IC 338 49152 4992 484-BBGA
The EPF10K100EFC484-1X is a FLEX 10K family field programmable gate array designed for embedded programmable logic and system-level integration. It combines a high logic element count with embedded memory and a large I/O complement to address custom logic, memory-intensive functions, and configurable system interfaces.
This device targets commercial applications that require reconfigurable logic, significant on-chip RAM, and broad I/O capability, offering a balance of density, integration and reconfigurability for board-level FPGA solutions.
Key Features
- Core Logic 4,992 logic elements and approximately 257,000 gates provide substantial combinational and sequential logic capacity for custom functions and control logic.
- Embedded Memory 49,152 total RAM bits (approximately 48 Kbits) of on-chip memory for data buffering, small RAM tables, and scratch storage.
- I/O and Interfaces 338 user I/O pins support extensive external connectivity and system interfacing needs.
- Reconfigurability and Test Supports in-circuit reconfigurability and includes JTAG boundary-scan test capabilities for device programming and board-level diagnostics (series feature).
- Power and Supply Specified core/voltage supply range of 2.375 V to 2.625 V to match system power design requirements.
- Package and Mounting Supplied in a 484-ball BGA package (484-FBGA, 23×23) optimized for compact board layouts; surface-mount mounting type.
- Operating Range and Grade Commercial grade device with an operating temperature range of 0 °C to 70 °C and RoHS compliance.
- System-Level Features (Series) FLEX 10K family features include embedded arrays for megafunctions, multi-volt I/O support, low-skew clock distribution, and software design support (series-level capabilities documented in the FLEX 10K family datasheet).
Typical Applications
- System-on-a-Programmable-Chip (SOPC) integration Embed custom logic and memory functions to consolidate system functions onto a single programmable device.
- Custom bus and peripheral interfaces High I/O count enables implementation of complex parallel interfaces, bus bridges, and protocol glue logic.
- Memory-intensive logic On-chip RAM supports buffering, look-up tables, and small data caches for data-path and control applications.
- Adaptive and reconfigurable designs In-circuit reconfigurability and JTAG support permit field updates and board-level testability for evolving designs.
Unique Advantages
- High logic density: 4,992 logic elements and ~257,000 gates deliver the capacity to implement substantial custom logic without external ASICs.
- Significant embedded memory: 49,152 bits of on-chip RAM reduce the need for external SRAM in many buffering and table applications.
- Large I/O footprint: 338 user I/O pins enable rich peripheral and parallel interface support directly from the FPGA.
- Reconfigurability and testability: Supports in-circuit reconfiguration and JTAG boundary-scan for flexible updates and streamlined board-level testing.
- Compact assembly: 484-ball BGA package allows high-density board placement while maintaining robust connectivity for multi-pin designs.
- Commercial-grade, RoHS-compliant: Commercial temperature rating (0 °C to 70 °C) and RoHS compliance support standard electronics production and environmental requirements.
Why Choose EPF10K100EFC484-1X?
EPF10K100EFC484-1X positions itself as a versatile, mid-to-high density programmable logic device for commercial embedded designs that demand a mix of logic capacity, embedded memory and extensive I/O. Its combination of nearly 5,000 logic elements, substantial on-chip RAM and hundreds of I/Os makes it suitable for consolidating glue logic, implementing memory-backed functions, and enabling configurable interfaces on compact PCBs.
Design teams benefit from the FLEX 10K family’s in-circuit reconfigurability, test support and documented software design tool compatibility, making this device a pragmatic choice for projects that require field updates, board-level testability, and established development flows.
Request a quote or submit a procurement request to evaluate EPF10K100EFC484-1X for your next programmable-logic design.

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