EPF10K100EFC484-2

The EPF10K100EFC484-2 is a FLEX-10KE family field programmable gate array (FPGA) from Intel designed for system-level programmable logic integration. As a FLEX 10K family device, it supports embedded-array and general-logic architectures suitable for implementing megafunctions, on-chip memory, and custom logic in embedded and system-on-a-programmable-chip (SOPC) designs.

This device targets designers who require substantial logic capacity, on-chip RAM, and a high I/O count in a compact surface-mount package for commercial-temperature applications.

Key Features

• Logic Capacity – 4,992 logic elements available to implement custom logic, supported by 624 logic array blocks (LABs) for structured resource allocation.
• On-chip Memory – Total embedded RAM: 49,152 bits (approximately 0.049 Mbits) for implementing FIFOs, small buffers, and megafunction memory.
• Gate Count – Specified device gate count: 257,000, reflecting the device's logic density for complex designs.
• I/O and Package – 338 user I/O pins in a 484-ball BGA package (supplier package: 484-FBGA, 23×23), surface-mount mounting for compact board designs.
• Power Supply – Single supply range documented: 2.375 V to 2.625 V.
• Operating Range & Grade – Commercial-grade device rated for 0 °C to 70 °C operation.
• Built-in Configuration & Test – FLEX 10K family features in-circuit reconfigurability via external configuration device, intelligent controller, or JTAG port, and includes JTAG boundary-scan test circuitry (IEEE 1149.1) without consuming device logic.
• Family-Level System Features – FLEX 10K family documentation describes low-skew clock distribution trees, dedicated carry and cascade chains for arithmetic and high-fan-in logic, and a flexible interconnect structure for predictable routing (family-level feature set).
• RoHS Compliant – Device meets RoHS environmental requirements.

Typical Applications

• Embedded Systems – Use the FPGA’s logic elements and on-chip RAM to implement control logic, protocol bridging, and custom peripheral interfaces in embedded platforms.
• SOPC and Megafunction Integration – Implement memory-intensive megafunctions and integrated system blocks as part of a system-on-a-programmable-chip architecture.
• Communications and Networking – High I/O count and logic density suit interface bridging, packet processing primitives, and protocol adaptation tasks.
• Prototyping and Custom Logic – Rapid hardware iteration for digital logic prototypes and custom accelerator blocks using the device’s reconfigurability and logic resources.

Unique Advantages

• Significant Logic Resource Density: 4,992 logic elements and a high gate count enable complex combinational and sequential functions within a single device.
• Substantial On-Chip Memory: 49,152 bits of embedded RAM reduce external memory dependencies for small buffers and state storage, simplifying board-level design.
• High I/O Count in a Compact Package: 338 I/O in a 484-BBGA (23×23) package supports multiple interfaces while conserving PCB area with surface-mount mounting.
• Flexible Configuration and Test: JTAG boundary-scan and in-circuit reconfiguration options ease bring-up, programming, and system test without consuming user logic.
• Commercial Temperature Rating: Rated for 0 °C to 70 °C operation, suitable for standard commercial electronic applications and environments.
• RoHS Compliance: Environmentally compliant sourcing and manufacturing support regulatory requirements.

Why Choose EPF10K100EFC484-2?

The EPF10K100EFC484-2 positions itself as a capable FLEX-10KE family FPGA for designers needing a balance of logic capacity, embedded memory, and a large number of I/Os in a compact BGA package. Its family-level features—such as in-circuit reconfigurability, JTAG boundary-scan, and dedicated arithmetic/cascade resources—support system integration, rapid prototyping, and medium-complexity digital designs.

This device is well suited for engineering teams and procurement seeking a commercial-grade FPGA for embedded, networking, and prototype applications where on-chip RAM and substantial I/O density help reduce board-level complexity and bill-of-materials.

Request a quote or submit a sales inquiry to receive pricing, lead-time information, and availability for the EPF10K100EFC484-2.