EPF10K100EFC484-3

The EPF10K100EFC484-3 is a FLEX-10KE family FPGA from Intel designed as an embedded programmable logic device for system-level integration. It combines a dedicated logic array and embedded memory resources to implement megafunctions, custom logic and dense I/O interfacing.

With 4,992 logic elements, 49,152 bits of on-chip RAM and 338 I/O pins in a 484-ball BGA, this commercial-grade device targets embedded systems, interface bridging and mid-density programmable logic applications that require flexible I/O and on-chip memory.

Key Features

• Core Logic — 4,992 logic elements and 624 logic array blocks provide a predictable resource set for implementing custom logic functions.
• On‑Chip Memory — Total RAM bits: 49,152, enabling implementation of embedded FIFOs, small data buffers and memory-based megafunctions.
• I/O Density — 338 user I/O pins support extensive peripheral interfacing and board-level signal routing.
• Gate Capacity — 257,000 gates (as specified) for mapping a mix of logic and memory functions within the FLEX 10K architecture.
• Power Supply — Operating supply range 2.375 V to 2.625 V suitable for designs matching this voltage domain.
• Package & Mounting — 484-BBGA package (supplier package: 484-FBGA, 23×23) in a surface-mount form factor for compact PCB layouts.
• Temperature & Grade — Commercial grade with an operating range of 0 °C to 70 °C for standard embedded applications.
• Series-Level System Features — FLEX 10K family features include embedded array support for megafunctions, built-in JTAG boundary-scan (IEEE 1149.1), dedicated carry and cascade chains, and low-skew clock distribution to simplify high-speed logic implementation.
• Compliance — RoHS compliant.

Typical Applications

• Embedded Systems — Implement control logic, protocol handling and custom state machines using the device’s logic elements and embedded RAM.
• Interface Bridging — High I/O count (338 pins) enables board-level protocol conversion and glue-logic between multiple peripherals.
• Custom Memory Functions — On-chip RAM supports FIFOs, small buffers and other memory-based megafunctions directly inside the FPGA fabric.
• Prototyping & Development — Reconfigurable logic and JTAG boundary-scan support make the device suitable for evaluation and iterative design cycles.

Unique Advantages

• Balanced Logic and Memory — 4,992 logic elements combined with 49,152 bits of RAM allow mixed logic-plus-memory implementations without external memory for many use cases.
• High I/O Capability — 338 I/O pins provide flexibility for dense peripheral and interface requirements, reducing the need for external glue logic.
• Compact, Board-Friendly Package — 484-BBGA (23×23) surface-mount package offers a compact footprint for space-constrained PCBs.
• Series-Proven Architecture — FLEX 10K family features such as dedicated carry and cascade chains and low-skew clock trees simplify arithmetic functions and timing-critical designs.
• Design-for-Test Ready — Built-in JTAG boundary-scan (IEEE 1149.1) enables board-level test and debugging without consuming user logic.
• Regulatory & Environmental — RoHS compliance supports designs targeting regulated markets and environmentally conscious supply chains.

Why Choose EPF10K100EFC484-3?

The EPF10K100EFC484-3 positions itself as a mid-density, embedded-programmable solution that blends a sizeable logic element count with substantial on-chip RAM and a large I/O footprint. It is well suited for designers who need a reprogrammable platform with integrated memory and robust I/O for interface-intensive or system-on-chip style integration.

Backed by the FLEX 10K family architecture and Intel’s device ecosystem, this part offers predictable resource allocation, board-level testability and RoHS compliance, providing a reliable choice for commercial embedded applications that require flexibility and scalability in a compact BGA package.

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