EPF10K100EFC484-3N

The EPF10K100EFC484-3N is a FLEX-10KE family field programmable gate array in a 484-BBGA package. It combines a logic array and embedded memory resources to implement custom digital functions for commercial embedded systems and prototype designs.

With 4,992 logic elements, 624 LABs, and 49,152 bits of on-chip RAM, this device targets applications that require moderate logic density, extensive I/O (338 pins), and flexible system-level integration while operating in commercial temperature ranges.

Key Features

• Core Logic  Approximately 4,992 logic elements organized across 624 LABs to implement custom combinational and sequential logic.
• Embedded Memory  49,152 total RAM bits of on-chip storage for FIFOs, buffers, and small data tables.
• I/O Count  338 user I/O pins suitable for broad interfacing to peripherals, buses, and external devices.
• Gate Capacity  Approximately 257,000 gates of implementation capacity for complex glue logic and system functions.
• Package & Mounting  484-ball BGA (supplier package listed as 484-FBGA, 23×23) in a surface-mount form factor to maximize board density.
• Power & Supply  Device supply range documented as 2.375 V to 2.625 V for core operation.
• Temperature & Grade  Commercial grade operation from 0 °C to 70 °C for general embedded applications.
• System and Design Features (FLEX 10K family)  Family-level capabilities include embedded arrays for megafunctions, in-circuit reconfigurability, JTAG boundary-scan support, low-skew clock distribution, dedicated carry and cascade chains, and FastTrack interconnect for predictable routing.
• Compliance  RoHS compliant.

Typical Applications

• Embedded Control  Implements custom control logic, state machines, and timing-critical glue logic for commercial embedded products.
• Protocol & Interface Bridging  Serves as an interface translator or bus bridge where high I/O count and flexible logic are required.
• Data Buffering and Packet Handling  On-chip RAM and dedicated arithmetic/carry features support small FIFO buffers and packet processing tasks.
• Prototyping & Development Platforms  Useful for hardware validation and system prototyping that need reprogrammable logic and extensive I/O.

Unique Advantages

• Moderate logic density with abundant I/O: 4,992 logic elements and 338 I/O pins enable complex interfacing without external glue logic.
• Embedded memory resources: 49,152 bits of on-chip RAM reduce the need for small external SRAMs for buffering and temporary storage.
• Compact BGA package: 484-ball BGA (23×23) offers high pin count in a space-efficient surface-mount form factor for dense board layouts.
• Family-level system features: FLEX 10K family capabilities such as FastTrack interconnect, carry chains, and JTAG simplify implementation of arithmetic, routing, and test functions.
• Commercial temperature and RoHS compliance: Designed for commercial applications with documented operating range and environmental compliance for many production environments.

Why Choose EPF10K100EFC484-3N?

The EPF10K100EFC484-3N delivers a balanced combination of logic resources, embedded RAM, and high I/O count in a compact BGA package, making it suitable for commercial embedded designs that require flexibility and board-area efficiency. Its family-level features support system integration tasks such as implementing megafunctions, low-skew clocking, and in-circuit reconfigurability.

This device is a fit for design teams needing a reprogrammable, mid-density FPGA with significant I/O and on-chip memory for prototyping, interface control, and embedded logic consolidation while operating within standard commercial temperature limits.

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