EPF10K100EFI484-2

IC FPGA 338 I/O 484FBGA
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 338 49152 4992 484-BBGA

Quantity 1,560 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case484-BBGANumber of I/O338Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs624Number of Logic Elements/Cells4992
Number of Gates257000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits49152

Overview of EPF10K100EFI484-2 – FLEX-10KE® Field Programmable Gate Array (FPGA) IC

The EPF10K100EFI484-2 is a FLEX-10KE family field programmable gate array supplied in a 484-ball BGA package. It delivers a balanced combination of logic capacity, on-chip memory, and a high count of general-purpose I/O suitable for industrial embedded designs requiring reconfigurable logic and system-level integration.

Built for applications that need flexible digital logic, extensive I/O connectivity, and operation across an industrial temperature range, this device supports system designers who need compact, surface-mount FPGA capability with RoHS compliance.

Key Features

  • Logic Capacity — 4,992 logic elements provide the configurable combinational and sequential resources needed for custom digital logic and control functions.
  • Embedded Memory — 49,152 total RAM bits (approximately 48 Kbits) of on-chip memory for buffering, state storage, and small data tables.
  • I/O Density — 338 user I/O pins to support extensive external interfacing and parallel connectivity in compact board layouts.
  • Gate Count — 257,000 gates available for implementing complex logic and integration tasks as required by the design.
  • Package & Mounting — 484-BBGA (supplier package 484-FBGA, 23×23) in a surface-mount form factor to optimize PCB area and assembly.
  • Power Supply — Operates with a core supply in the 2.375 V to 2.625 V range, enabling integration into systems with specific low-voltage rails.
  • Industrial Temperature Range — Specified for operation from −40 °C to 85 °C, suitable for many industrial and commercial environments.
  • Manufacturing & Compliance — RoHS-compliant device with international-grade surface-mount packaging.
  • Family-Level Capabilities — As part of the FLEX 10K family, benefits include embedded arrays for megafunctions, flexible interconnect architecture, dedicated carry and cascade chains, low-skew clock distribution, and JTAG boundary-scan support as described in the FLEX 10K family documentation.

Typical Applications

  • Industrial Control — Implement custom control logic, motor-drive interfaces, and timing-critical state machines using the device’s logic elements and I/O density.
  • Interface Bridging — Bridge and adapt multiple parallel and serial interfaces with abundant user I/O and on-chip memory for buffering.
  • Embedded System Integration — Use the FPGA for system-level integration and custom peripherals where reconfigurable logic and embedded memory accelerate development.
  • Prototype and Proof-of-Concept — Rapidly iterate hardware functions and verify system behavior using a reprogrammable FPGA with significant gate and memory resources.

Unique Advantages

  • High Logic Density: 4,992 logic elements provide significant programmable capacity for complex logic and control functions.
  • Substantial I/O Resource: 338 I/O pins enable direct connection to a wide range of peripherals and external devices without extensive I/O expanders.
  • Embedded Memory On-Board: 49,152 bits of RAM allow local buffering and small lookup tables, reducing external memory dependencies.
  • Industrial Temperature Support: Rated from −40 °C to 85 °C for deployment in industrial environments requiring broader temperature tolerance.
  • Compact BGA Footprint: 484-ball BGA (23×23) minimizes PCB area while maintaining high pin count for dense designs.
  • Standards and Family-Level Design Support: FLEX 10K family features such as JTAG boundary-scan and dedicated arithmetic/cascade chains support efficient design and test strategies.

Why Choose EPF10K100EFI484-2?

The EPF10K100EFI484-2 combines multi-hundred-thousand gate capacity, approximately 49 Kbits of embedded RAM, and hundreds of user I/O pins in a compact 484-BBGA package designed for surface-mount assembly. Its industrial temperature rating and RoHS compliance make it a suitable option for engineers building reconfigurable logic into industrial and commercial systems that demand reliable operation and flexible integration.

Choose this FLEX-10KE family device when you need a balance of logic, memory, and connectivity in a reprogrammable FPGA backed by family-level features documented for the FLEX 10K series.

Request a quote or submit a pricing request to evaluate EPF10K100EFI484-2 for your next design.

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