EPF10K100EFI484-2
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 338 49152 4992 484-BBGA |
|---|---|
| Quantity | 1,560 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 338 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 624 | Number of Logic Elements/Cells | 4992 | ||
| Number of Gates | 257000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49152 |
Overview of EPF10K100EFI484-2 – FLEX-10KE® Field Programmable Gate Array (FPGA) IC
The EPF10K100EFI484-2 is a FLEX-10KE family field programmable gate array supplied in a 484-ball BGA package. It delivers a balanced combination of logic capacity, on-chip memory, and a high count of general-purpose I/O suitable for industrial embedded designs requiring reconfigurable logic and system-level integration.
Built for applications that need flexible digital logic, extensive I/O connectivity, and operation across an industrial temperature range, this device supports system designers who need compact, surface-mount FPGA capability with RoHS compliance.
Key Features
- Logic Capacity — 4,992 logic elements provide the configurable combinational and sequential resources needed for custom digital logic and control functions.
- Embedded Memory — 49,152 total RAM bits (approximately 48 Kbits) of on-chip memory for buffering, state storage, and small data tables.
- I/O Density — 338 user I/O pins to support extensive external interfacing and parallel connectivity in compact board layouts.
- Gate Count — 257,000 gates available for implementing complex logic and integration tasks as required by the design.
- Package & Mounting — 484-BBGA (supplier package 484-FBGA, 23×23) in a surface-mount form factor to optimize PCB area and assembly.
- Power Supply — Operates with a core supply in the 2.375 V to 2.625 V range, enabling integration into systems with specific low-voltage rails.
- Industrial Temperature Range — Specified for operation from −40 °C to 85 °C, suitable for many industrial and commercial environments.
- Manufacturing & Compliance — RoHS-compliant device with international-grade surface-mount packaging.
- Family-Level Capabilities — As part of the FLEX 10K family, benefits include embedded arrays for megafunctions, flexible interconnect architecture, dedicated carry and cascade chains, low-skew clock distribution, and JTAG boundary-scan support as described in the FLEX 10K family documentation.
Typical Applications
- Industrial Control — Implement custom control logic, motor-drive interfaces, and timing-critical state machines using the device’s logic elements and I/O density.
- Interface Bridging — Bridge and adapt multiple parallel and serial interfaces with abundant user I/O and on-chip memory for buffering.
- Embedded System Integration — Use the FPGA for system-level integration and custom peripherals where reconfigurable logic and embedded memory accelerate development.
- Prototype and Proof-of-Concept — Rapidly iterate hardware functions and verify system behavior using a reprogrammable FPGA with significant gate and memory resources.
Unique Advantages
- High Logic Density: 4,992 logic elements provide significant programmable capacity for complex logic and control functions.
- Substantial I/O Resource: 338 I/O pins enable direct connection to a wide range of peripherals and external devices without extensive I/O expanders.
- Embedded Memory On-Board: 49,152 bits of RAM allow local buffering and small lookup tables, reducing external memory dependencies.
- Industrial Temperature Support: Rated from −40 °C to 85 °C for deployment in industrial environments requiring broader temperature tolerance.
- Compact BGA Footprint: 484-ball BGA (23×23) minimizes PCB area while maintaining high pin count for dense designs.
- Standards and Family-Level Design Support: FLEX 10K family features such as JTAG boundary-scan and dedicated arithmetic/cascade chains support efficient design and test strategies.
Why Choose EPF10K100EFI484-2?
The EPF10K100EFI484-2 combines multi-hundred-thousand gate capacity, approximately 49 Kbits of embedded RAM, and hundreds of user I/O pins in a compact 484-BBGA package designed for surface-mount assembly. Its industrial temperature rating and RoHS compliance make it a suitable option for engineers building reconfigurable logic into industrial and commercial systems that demand reliable operation and flexible integration.
Choose this FLEX-10KE family device when you need a balance of logic, memory, and connectivity in a reprogrammable FPGA backed by family-level features documented for the FLEX 10K series.
Request a quote or submit a pricing request to evaluate EPF10K100EFI484-2 for your next design.

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