EPF10K100EFI484-2N

IC FPGA 338 I/O 484FBGA
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 338 49152 4992 484-BBGA

Quantity 1,427 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case484-BBGANumber of I/O338Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs624Number of Logic Elements/Cells4992
Number of Gates257000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits49152

Overview of EPF10K100EFI484-2N – FLEX-10KE® Field Programmable Gate Array (FPGA) IC 338 49152 4992 484-BBGA

The EPF10K100EFI484-2N is an Intel FLEX-10KE family FPGA targeted at industrial embedded designs. It combines a logic array with embedded memory resources to support on-chip megafunctions, custom logic and system-level integration.

This device is specified for industrial operation and provides substantial I/O and logic capacity for applications that require configurable digital functions, embedded RAM and flexible I/O in a compact 484-ball BGA package.

Key Features

  • Core Logic — 4,992 logic elements (LEs) supporting up to 257,000 gates of logic capacity for implementing custom digital functions.
  • Embedded Memory — Total on-chip RAM of 49,152 bits to support embedded data storage and megafunction implementation.
  • I/O Capacity — 338 user I/O pins to interface with peripherals, sensors and external logic.
  • Packaging & Mounting — 484-BBGA package (supplier device package listed as 484-FBGA, 23 × 23) optimized for surface-mount PCB assembly and high pin-count connectivity.
  • Power — Specified supply voltage range 2.375 V to 2.625 V for device core operation.
  • Industrial Temperature Range — Rated for operation from −40 °C to 85 °C for deployment in industrial environments.
  • Configuration & Test — Supports in-circuit reconfigurability and includes built-in JTAG boundary-scan circuitry for device programming and board-level test.
  • High-performance Routing & Clocking (Series Features) — FLEX 10K family capabilities such as FastTrack interconnect, dedicated carry and cascade chains, and low-skew clock distribution help implement fast arithmetic, wide fan-in logic and predictable timing.

Typical Applications

  • Industrial Control & Automation — Implement motor control, PLC interfaces and custom I/O conditioning using the device’s logic and dense I/O complement, with an industrial temperature rating for harsh environments.
  • Embedded System Integration — Integrate on-chip megafunctions and embedded RAM to consolidate glue logic, protocol handling and data buffering in compact embedded platforms.
  • Communications & Networking — Use the high I/O count and dedicated logic chains to implement interfaces, packet processing blocks or custom timing logic.
  • Prototyping & Custom Logic — Rapidly iterate hardware designs with in-circuit reconfigurability and JTAG programming for development and validation cycles.

Unique Advantages

  • Substantial Logic Density: 4,992 logic elements and 257,000 gates provide room for complex glue logic and custom processing blocks without cascading multiple devices.
  • Ample On-chip RAM: 49,152 bits of embedded memory reduce external memory dependence for buffering and small data structures.
  • Large I/O Count: 338 user I/O pins enable direct interfacing to a wide range of peripherals and buses, simplifying PCB routing and reducing external components.
  • Industrial Reliability: Specified for −40 °C to 85 °C operation and supplied in a robust BGA package suitable for industrial deployments.
  • Configurable & Testable: In-circuit reconfigurability plus built-in JTAG boundary-scan facilitate programming, debugging and board-level test workflows.
  • Series-level Performance Features: FastTrack interconnect and dedicated carry/cascade chains in the FLEX 10K family yield predictable routing and efficient implementation of arithmetic and high-fan-in logic.

Why Choose EPF10K100EFI484-2N?

The EPF10K100EFI484-2N delivers a balance of logic capacity, embedded memory and high I/O count in a compact 484-ball BGA package designed for industrial applications. Its combination of 4,992 logic elements, substantial on-chip RAM and in-circuit reconfigurability makes it well suited for engineers consolidating logic, implementing custom interfaces or prototyping complex embedded systems.

Choose this FLEX-10KE device when you need a field-programmable solution that supports system-level integration, robust board-level testing via JTAG, and operation across industrial temperature ranges backed by the FLEX 10K family feature set.

Request a quote or submit a request for pricing and availability to move your design forward with the EPF10K100EFI484-2N.

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