EPF10K100EFI484-2N
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 338 49152 4992 484-BBGA |
|---|---|
| Quantity | 1,427 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 338 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 624 | Number of Logic Elements/Cells | 4992 | ||
| Number of Gates | 257000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49152 |
Overview of EPF10K100EFI484-2N – FLEX-10KE® Field Programmable Gate Array (FPGA) IC 338 49152 4992 484-BBGA
The EPF10K100EFI484-2N is an Intel FLEX-10KE family FPGA targeted at industrial embedded designs. It combines a logic array with embedded memory resources to support on-chip megafunctions, custom logic and system-level integration.
This device is specified for industrial operation and provides substantial I/O and logic capacity for applications that require configurable digital functions, embedded RAM and flexible I/O in a compact 484-ball BGA package.
Key Features
- Core Logic — 4,992 logic elements (LEs) supporting up to 257,000 gates of logic capacity for implementing custom digital functions.
- Embedded Memory — Total on-chip RAM of 49,152 bits to support embedded data storage and megafunction implementation.
- I/O Capacity — 338 user I/O pins to interface with peripherals, sensors and external logic.
- Packaging & Mounting — 484-BBGA package (supplier device package listed as 484-FBGA, 23 × 23) optimized for surface-mount PCB assembly and high pin-count connectivity.
- Power — Specified supply voltage range 2.375 V to 2.625 V for device core operation.
- Industrial Temperature Range — Rated for operation from −40 °C to 85 °C for deployment in industrial environments.
- Configuration & Test — Supports in-circuit reconfigurability and includes built-in JTAG boundary-scan circuitry for device programming and board-level test.
- High-performance Routing & Clocking (Series Features) — FLEX 10K family capabilities such as FastTrack interconnect, dedicated carry and cascade chains, and low-skew clock distribution help implement fast arithmetic, wide fan-in logic and predictable timing.
Typical Applications
- Industrial Control & Automation — Implement motor control, PLC interfaces and custom I/O conditioning using the device’s logic and dense I/O complement, with an industrial temperature rating for harsh environments.
- Embedded System Integration — Integrate on-chip megafunctions and embedded RAM to consolidate glue logic, protocol handling and data buffering in compact embedded platforms.
- Communications & Networking — Use the high I/O count and dedicated logic chains to implement interfaces, packet processing blocks or custom timing logic.
- Prototyping & Custom Logic — Rapidly iterate hardware designs with in-circuit reconfigurability and JTAG programming for development and validation cycles.
Unique Advantages
- Substantial Logic Density: 4,992 logic elements and 257,000 gates provide room for complex glue logic and custom processing blocks without cascading multiple devices.
- Ample On-chip RAM: 49,152 bits of embedded memory reduce external memory dependence for buffering and small data structures.
- Large I/O Count: 338 user I/O pins enable direct interfacing to a wide range of peripherals and buses, simplifying PCB routing and reducing external components.
- Industrial Reliability: Specified for −40 °C to 85 °C operation and supplied in a robust BGA package suitable for industrial deployments.
- Configurable & Testable: In-circuit reconfigurability plus built-in JTAG boundary-scan facilitate programming, debugging and board-level test workflows.
- Series-level Performance Features: FastTrack interconnect and dedicated carry/cascade chains in the FLEX 10K family yield predictable routing and efficient implementation of arithmetic and high-fan-in logic.
Why Choose EPF10K100EFI484-2N?
The EPF10K100EFI484-2N delivers a balance of logic capacity, embedded memory and high I/O count in a compact 484-ball BGA package designed for industrial applications. Its combination of 4,992 logic elements, substantial on-chip RAM and in-circuit reconfigurability makes it well suited for engineers consolidating logic, implementing custom interfaces or prototyping complex embedded systems.
Choose this FLEX-10KE device when you need a field-programmable solution that supports system-level integration, robust board-level testing via JTAG, and operation across industrial temperature ranges backed by the FLEX 10K family feature set.
Request a quote or submit a request for pricing and availability to move your design forward with the EPF10K100EFI484-2N.

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