EPF10K100EBC356-1

The EPF10K100EBC356-1 is a FLEX-10KE family Field Programmable Gate Array (FPGA) from Intel, delivered in a 356-LBGA surface-mount package. It combines a mid-density logic array with embedded memory and extensive I/O to support commercial embedded designs requiring on-chip RAM, configurable logic, and flexible interfacing.

With 4,992 logic elements, 624 logic array blocks, and 49,152 bits of on-chip RAM, this device targets system integration, protocol bridging, and control applications where a balance of logic capacity, memory, and I/O count is required.

Key Features

• Core Logic Density — 4,992 logic elements and 624 logic array blocks (LABs) provide substantial programmable logic resources for mid-range designs.
• Embedded Memory — 49,152 total RAM bits of on-chip memory to support FIFOs, buffering, and small embedded data structures without external RAM.
• I/O Count and Flexibility — 274 user I/O pins for broad peripheral and interface connectivity in a single device.
• Logic Capacity — Documented 257,000 gates (device specification) to quantify overall integration potential for combined logic and memory functions.
• Power and Voltage — Specified supply voltage range of 2.375 V to 2.625 V to match board-level power constraints and system rails.
• Package and Mounting — 356-LBGA (356-BGA, 35 × 35) surface-mount package that maximizes board-space efficiency while supporting high I/O count.
• Commercial Temperature Grade — Rated for 0 °C to 70 °C operation for commercial embedded and consumer applications.
• RoHS Compliance — Device is RoHS compliant for environmental and regulatory alignment in commercial products.

Typical Applications

• Embedded Control — Implement control logic, state machines, and glue logic where on-chip RAM and mid-range logic density reduce external component count.
• Protocol Bridging & Interface Conversion — Use the high I/O count to bridge between multiple serial or parallel interfaces and implement custom protocol logic.
• Prototyping and System Integration — Rapidly prototype system functions or consolidate multiple discrete functions into a single programmable device.
• Signal Processing Support — Deploy embedded RAM and logic resources for packet buffering, simple DSP blocks, or data-path control in commercial systems.

Unique Advantages

• Balanced Logic and Memory — 4,992 logic elements paired with 49,152 bits of embedded RAM lets designers implement both control logic and local data storage on-chip.
• High I/O Density — 274 user I/O pins enable multi-interface designs and reduce the need for external multiplexers or I/O expanders.
• Compact, High-Pin Package — The 356-LBGA package offers a high pin-count footprint in a compact surface-mount form factor for space-constrained boards.
• Commercial-Grade Suitability — 0 °C to 70 °C operating range aligns with a wide range of commercial and consumer product applications.
• Regulatory Readiness — RoHS compliance supports environmental requirements in modern electronic products.

Why Choose EPF10K100EBC356-1?

The EPF10K100EBC356-1 delivers a practical combination of programmable logic, embedded memory, and substantial I/O in a compact 356-LBGA package. It is suited for commercial embedded systems that require consolidating multiple discrete functions into a single, reconfigurable device while keeping board area and BOM under control.

Designed for engineers who need predictable logic and memory resources with a clear supply voltage and operating-temperature envelope, this FLEX-10KE device offers a straightforward migration path for mid-range programmable designs backed by Intel's FLEX-10K family documentation.

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