EPF10K100EQC208-2X

IC FPGA 147 I/O 208QFP
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 147 49152 4992 208-BFQFP

Quantity 988 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O147Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs624Number of Logic Elements/Cells4992
Number of Gates257000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits49152

Overview of EPF10K100EQC208-2X – FLEX-10KE FPGA, 208-BFQFP, 4,992 Logic Elements

The EPF10K100EQC208-2X is a FLEX-10KE field programmable gate array (FPGA) IC from Intel, supplied in a 208-BFQFP surface-mount package. It combines a mid-range logic array with embedded on-chip memory and a substantial I/O count to address embedded designs, system integration, and I/O‑intensive applications where reconfigurable logic and board-level testability are required.

Key Features

  • Logic Capacity — 4,992 logic elements organized across 624 LABs provide programmable resources for custom digital logic implementations.
  • On-chip Memory — Total RAM bits: 49,152 bits of embedded memory to support buffering, state storage, and local data structures without immediate external RAM.
  • Gate Count — Device reports 257,000 gates of logic capacity for system-level integration of combinational and sequential functions.
  • I/O Resources — 147 user I/O pins support a wide range of external peripherals, sensors, and interface circuits.
  • Supply Voltage — Supports a supply range of 2.375 V to 2.625 V, enabling compatibility with designs operating within that voltage domain.
  • Package & Mounting — 208-BFQFP (208-PQFP, 28×28) surface-mount package for board-level assembly and routing density.
  • Operating and Grade — Commercial grade device with an operating temperature range of 0 °C to 70 °C and RoHS compliance.
  • Family-level Architecture — FLEX 10K family features including embedded arrays for megafunctions, dedicated carry and cascade chains, and flexible interconnect structures for predictable routing.
  • Design-for-Test & Reconfiguration — Built-in JTAG boundary-scan (IEEE 1149.1) and support for in-circuit reconfigurability via external configuration device or JTAG aid board-level testing and field updates.
  • Clocking & Interconnect — Family features such as low-skew clock distribution and options for reduced clock delay/skew (ClockLock/ClockBoost) support time-critical designs.

Typical Applications

  • Embedded Control — Implement custom control logic, state machines, and interface controllers using the device’s logic elements and embedded memory.
  • I/O Bridging and Protocol Handling — Use the 147 I/O pins to aggregate, translate, or buffer signals between sensors, peripherals, and host processors.
  • Prototyping and System Integration — Reconfigurable logic and JTAG-enabled in-circuit reconfiguration make the device suitable for iterative development and prototype validation.
  • On‑board Data Buffering — Embedded RAM supports local buffering and small data storage tasks within embedded or interface functions.

Unique Advantages

  • Balanced mid-range resources — 4,992 logic elements and 624 LABs offer a practical balance of logic and interconnect for mid-sized designs.
  • Substantial on‑chip memory — Nearly 49,152 bits of embedded RAM reduce reliance on external memory for many control and buffering tasks.
  • High I/O count — 147 user I/Os simplify board-level connectivity and reduce the need for additional interface components.
  • Robust test and reconfiguration support — Built-in JTAG boundary-scan and support for in-circuit reconfiguration streamline manufacturing test and field updates.
  • Commercial-grade reliability — 0 °C to 70 °C operating range and RoHS compliance meet common commercial application requirements.
  • Package suitable for assembly — 208‑pin BFQFP surface-mount package provides a combination of assembly convenience and PCB routing area.

Why Choose EPF10K100EQC208-2X?

EPF10K100EQC208-2X delivers a mid-range FLEX-10KE FPGA option with a practical mix of logic elements, embedded memory, and I/O for embedded systems and integration-focused designs. Its family-level capabilities—embedded arrays, dedicated arithmetic chains, flexible interconnect, and JTAG-based test/reconfiguration—support development workflows that require on-board reprogrammability and board-level diagnostics.

This device suits customers building commercial-grade embedded hardware that needs reconfigurable logic, significant I/O, and local memory without moving to larger device classes. Its package, power range, and RoHS compliance support standard commercial production and assembly processes.

Request a quote or submit an inquiry to obtain pricing and availability for EPF10K100EQC208-2X.

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