EPF10K100EQC208-2X
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 147 49152 4992 208-BFQFP |
|---|---|
| Quantity | 988 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 147 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 624 | Number of Logic Elements/Cells | 4992 | ||
| Number of Gates | 257000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49152 |
Overview of EPF10K100EQC208-2X – FLEX-10KE FPGA, 208-BFQFP, 4,992 Logic Elements
The EPF10K100EQC208-2X is a FLEX-10KE field programmable gate array (FPGA) IC from Intel, supplied in a 208-BFQFP surface-mount package. It combines a mid-range logic array with embedded on-chip memory and a substantial I/O count to address embedded designs, system integration, and I/O‑intensive applications where reconfigurable logic and board-level testability are required.
Key Features
- Logic Capacity — 4,992 logic elements organized across 624 LABs provide programmable resources for custom digital logic implementations.
- On-chip Memory — Total RAM bits: 49,152 bits of embedded memory to support buffering, state storage, and local data structures without immediate external RAM.
- Gate Count — Device reports 257,000 gates of logic capacity for system-level integration of combinational and sequential functions.
- I/O Resources — 147 user I/O pins support a wide range of external peripherals, sensors, and interface circuits.
- Supply Voltage — Supports a supply range of 2.375 V to 2.625 V, enabling compatibility with designs operating within that voltage domain.
- Package & Mounting — 208-BFQFP (208-PQFP, 28×28) surface-mount package for board-level assembly and routing density.
- Operating and Grade — Commercial grade device with an operating temperature range of 0 °C to 70 °C and RoHS compliance.
- Family-level Architecture — FLEX 10K family features including embedded arrays for megafunctions, dedicated carry and cascade chains, and flexible interconnect structures for predictable routing.
- Design-for-Test & Reconfiguration — Built-in JTAG boundary-scan (IEEE 1149.1) and support for in-circuit reconfigurability via external configuration device or JTAG aid board-level testing and field updates.
- Clocking & Interconnect — Family features such as low-skew clock distribution and options for reduced clock delay/skew (ClockLock/ClockBoost) support time-critical designs.
Typical Applications
- Embedded Control — Implement custom control logic, state machines, and interface controllers using the device’s logic elements and embedded memory.
- I/O Bridging and Protocol Handling — Use the 147 I/O pins to aggregate, translate, or buffer signals between sensors, peripherals, and host processors.
- Prototyping and System Integration — Reconfigurable logic and JTAG-enabled in-circuit reconfiguration make the device suitable for iterative development and prototype validation.
- On‑board Data Buffering — Embedded RAM supports local buffering and small data storage tasks within embedded or interface functions.
Unique Advantages
- Balanced mid-range resources — 4,992 logic elements and 624 LABs offer a practical balance of logic and interconnect for mid-sized designs.
- Substantial on‑chip memory — Nearly 49,152 bits of embedded RAM reduce reliance on external memory for many control and buffering tasks.
- High I/O count — 147 user I/Os simplify board-level connectivity and reduce the need for additional interface components.
- Robust test and reconfiguration support — Built-in JTAG boundary-scan and support for in-circuit reconfiguration streamline manufacturing test and field updates.
- Commercial-grade reliability — 0 °C to 70 °C operating range and RoHS compliance meet common commercial application requirements.
- Package suitable for assembly — 208‑pin BFQFP surface-mount package provides a combination of assembly convenience and PCB routing area.
Why Choose EPF10K100EQC208-2X?
EPF10K100EQC208-2X delivers a mid-range FLEX-10KE FPGA option with a practical mix of logic elements, embedded memory, and I/O for embedded systems and integration-focused designs. Its family-level capabilities—embedded arrays, dedicated arithmetic chains, flexible interconnect, and JTAG-based test/reconfiguration—support development workflows that require on-board reprogrammability and board-level diagnostics.
This device suits customers building commercial-grade embedded hardware that needs reconfigurable logic, significant I/O, and local memory without moving to larger device classes. Its package, power range, and RoHS compliance support standard commercial production and assembly processes.
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