EPF10K100EQC208-3N

The EPF10K100EQC208-3N is a FLEX-10KE family field programmable gate array (FPGA) optimized for embedded programmable-logic integration. It combines a dedicated logic array with embedded memory resources suitable for implementing megafunctions, on-chip memory, and general-purpose logic in system-level designs.

Designed for commercial-temperature applications, this surface-mount device delivers a balance of logic density, on-chip RAM, and I/O capability for system-on-a-programmable-chip (SOPC) integration and other embedded applications.

Key Features

• Logic Capacity — 4,992 logic elements and 624 logic array blocks provide substantial programmable logic for glue logic, control, and custom accelerators.
• Embedded Memory — 49,152 bits of on-chip RAM to implement data buffers, small FIFOs, lookup tables, and other memory-backed logic functions.
• I/O Count — 147 user I/O pins to support diverse peripheral interfaces and board-level connectivity.
• Gate Equivalent — Approximately 257,000 gates of logic resources for complex combinational and sequential logic implementations.
• Power and Supply — Operates from a 2.375 V to 2.625 V supply range, enabling integration into multi-voltage platforms.
• Package and Mounting — 208-pin BFQFP package (208-PQFP, 28×28 mm footprint) with surface-mount mounting for standard PCB assembly.
• Commercial Temperature Grade — Rated for 0 °C to 70 °C operation for commercial embedded systems.
• Series-Level System Features — FLEX 10K family attributes such as embedded arrays for megafunctions, in-circuit reconfigurability via external configuration or JTAG, and options like ClockLock/ClockBoost are part of the family capability set.
• Standards and Compliance — RoHS compliant.

Typical Applications

• System-on-a-Programmable-Chip (SOPC) — Integrate custom logic and embedded memory to implement control and data-path functions within a single programmable device.
• Embedded Control — Use for finite-state machines, protocol handling, and peripheral interfacing where flexible I/O and medium logic density are required.
• Memory-backed Logic — Implement small FIFOs, buffers, and lookup tables using the device’s 49,152 bits of on-chip RAM.
• Board-Level Glue and Interface Logic — Replace multiple discrete components with programmable logic to simplify routing and reduce BOM in commercial electronic systems.

Unique Advantages

• Balanced Logic and Memory — 4,992 logic elements paired with 49,152 bits of RAM lets you implement both control logic and local data storage in a single device.
• High I/O Count — 147 user I/Os enable flexible interfacing to peripherals, sensors, and board-level buses without external expanders.
• Configurable Family Features — FLEX 10K family capabilities such as in-circuit reconfigurability and JTAG boundary-scan support simplify development and debugging workflows.
• RoHS Compliance — Meets RoHS requirements for lead-free assemblies and contemporary environmental standards.
• Surface-Mount Convenience — 208-BFQFP package supports standard assembly processes and compact board layouts.

Why Choose EPF10K100EQC208-3N?

The EPF10K100EQC208-3N positions itself as a practical choice for commercial embedded designs that require a mix of programmable logic, on-chip RAM, and substantial I/O capacity. Its FLEX-10KE family heritage brings series-level features—such as embedded arrays for megafunctions and in-circuit reconfigurability—that support iterative development and integration into SOPC architectures.

For engineering teams targeting commercial-temperature systems that need medium-to-high logic density in a 208-pin surface-mount package, this device offers a verifiable combination of logic resources, embedded memory, and connectivity while complying with RoHS requirements.

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