EPF10K100EQC240-2

The EPF10K100EQC240-2 is an Intel FLEX-10KE® family field programmable gate array (FPGA) supplied in a 240-pin BFQFP package. It combines a logic array and embedded memory resources to implement megafunctions and general logic, enabling system-on-a-programmable-chip integration for reconfigurable designs.

Designed for applications that need substantial on-chip logic and I/O, this device provides a balance of logic density, embedded RAM, and a broad I/O count in a surface-mount 240-BFQFP footprint.

Key Features

• Logic Capacity — 4,992 logic elements (LEs) and approximately 257,000 gates provide significant on-chip programmable logic for complex designs.
• Embedded Memory — Total on-chip RAM of 49,152 bits for implementing buffers, FIFOs, and other memory-based megafunctions.
• I/O and Interface — 189 user I/O pins enable extensive external connectivity and interface options.
• Power Supply — Operates from a supply voltage range of 2.375 V to 2.625 V to match specific low-voltage system requirements.
• Package & Mounting — 240-BFQFP (supplier device package: 240-PQFP 32×32) in a surface-mount form factor for standard PCB assembly.
• Operating Range — Commercial temperature grade with an operating temperature range of 0 °C to 70 °C.
• Series-Level Capabilities — Family features include embedded array support for megafunctions, in-circuit reconfigurability (ICR), built-in JTAG boundary-scan, and flexible interconnect structures such as dedicated carry and cascade chains (series-level information).
• Standards & Compliance — RoHS compliant.

Typical Applications

• System-on-a-Programmable-Chip (SOPC) — Integrate embedded memory blocks and specialized logic to consolidate multiple functions into a single programmable device.
• Protocol and Interface Bridging — Use the wide I/O count and reconfigurable logic to implement custom interface logic and bus bridging functions.
• Memory and Buffering Megafunctions — Leverage on-chip RAM to implement efficient FIFOs, buffers, and other memory-centric functions without external RAM.
• In-Circuit Reconfigurable Designs — Support design updates and field reconfiguration via in-circuit reconfigurability and JTAG boundary-scan capabilities.

Unique Advantages

• Significant Logic Density: 4,992 logic elements and ~257,000 gates enable implementation of substantial custom logic within a single device.
• On-Chip Memory Integration: 49,152 bits of embedded RAM reduce the need for external memory in many buffering and state-storage applications.
• High I/O Count: 189 I/O pins provide flexibility for multi-channel interfaces and broad peripheral connectivity.
• Surface-Mount 240-BFQFP Package: Compact package choice suitable for standard PCB assembly processes while offering ample pinout for complex designs.
• Reconfigurability and Testability: Family-level support for in-circuit reconfigurability and built-in JTAG boundary-scan simplifies development, validation, and field updates.
• Regulatory Compliance: RoHS compliance supports designs targeting markets with environmental substance restrictions.

Why Choose EPF10K100EQC240-2?

The EPF10K100EQC240-2 positions itself as a versatile FLEX-10KE® FPGA option for designs that require a mix of substantial programmable logic, embedded RAM, and a high I/O count in a 240-pin surface-mount package. Its combination of 4,992 logic elements, approximately 49 kbits of on-chip RAM, and 189 user I/Os makes it well suited to consolidate multiple functions and implement megafunctions within a single device.

Customers developing reconfigurable systems, embedded logic subsystems, or interface-rich applications will find this device provides a practical balance of integration and flexibility, backed by family-level features such as in-circuit reconfigurability and boundary-scan test support.

Request a quote or submit a quote to obtain pricing and availability for the EPF10K100EQC240-2.