EPF10K100EQC240-2X

The EPF10K100EQC240-2X is a FLEX‑10K series Field Programmable Gate Array from Intel. It combines a dedicated logic array with embedded memory blocks to implement both general logic and megafunctions on a single device.

With 4,992 logic elements, 49,152 bits of on‑chip RAM, and 189 user I/O pins in a 240‑pin BFQFP package, this device targets high‑density embedded designs that require significant on‑chip logic, memory, and flexible I/O connections.

Key Features

• Logic Capacity — 4,992 logic elements and 624 LABs provide the fabric for complex combinational and sequential logic implementation.
• Embedded Memory — 49,152 total RAM bits for on‑chip data buffering, FIFOs, and small memory structures.
• I/O Density — 189 user I/O pins to support multiple peripherals and high‑pin count interfacing in embedded systems.
• Gate Count — 257,000 gates for measuring overall device complexity and system integration capability.
• Package & Mounting — 240‑BFQFP (supplier package listed as 240‑PQFP, 32×32) in a surface‑mount format for standard PCB assembly.
• Power Supply — Specified operating core/supply range of 2.375 V to 2.625 V.
• Operating Range — Commercial temperature grade rated from 0 °C to 70 °C.
• Series Features — FLEX‑10K family capabilities such as embedded array for megafunctions, logic array for general logic, FastTrack continuous routing, dedicated carry and cascade chains, JTAG boundary‑scan, and low‑skew clock distribution (series‑level features documented in the FLEX‑10K datasheet).
• Environmental — RoHS compliant.

Typical Applications

• Embedded Control Systems — Implement control logic, state machines and peripheral interfaces using the device’s abundant logic elements and I/O resources.
• On‑board Memory and Buffers — Use the 49,152 bits of on‑chip RAM for data buffering, packet FIFOs or temporary storage to reduce external memory dependency.
• High‑I/O Interfaces — 189 I/O pins accommodate multi‑channel sensor interfaces, parallel buses, or mixed peripheral connectivity on a single FPGA.
• System Integration / SOPC — Combine logic, embedded memory, and I/O to consolidate functions normally handled by multiple discrete components into a single programmable device.

Unique Advantages

• Significant On‑chip Logic Density: 4,992 logic elements and 257,000 gates enable complex logic integration without excessive external components.
• On‑device Embedded Memory: 49,152 RAM bits let you implement buffers and small data structures on‑chip, improving latency and reducing BOM.
• High Pin Count for Connectivity: 189 user I/Os provide flexibility for multi‑device interfacing and parallel data paths.
• Series Proven Architecture: FLEX‑10K family features such as dedicated carry/cascade chains and low‑skew clock trees support efficient implementation of arithmetic and timing‑sensitive functions.
• Standard Surface Mount Package: 240‑pin BFQFP (surface mount) eases PCB assembly within common commercial production flows.
• RoHS Compliant: Environmentally compliant manufacturing and assembly considerations are supported.

Why Choose EPF10K100EQC240-2X?

The EPF10K100EQC240-2X offers a balanced combination of logic capacity, embedded memory, and I/O density in a commercial‑grade FLEX‑10K FPGA package. It is well suited for designers seeking to consolidate functionality, implement on‑chip buffering, and handle multiple external interfaces within a single programmable device.

Its series‑level architectural features and on‑chip resources make it a practical choice for embedded applications, system integration projects, and OEM designs that benefit from programmable logic paired with embedded memory and high I/O count.

Request a quote or submit a purchase inquiry for EPF10K100EQC240-2X to receive pricing and availability information from authorized distributors or contact points.