EPF10K100EQI240-3

IC FPGA 189 I/O 240QFP
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 189 49152 4992 240-BFQFP

Quantity 1,349 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case240-BFQFPNumber of I/O189Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs624Number of Logic Elements/Cells4992
Number of Gates257000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits49152

Overview of EPF10K100EQI240-3 – FLEX-10KE FPGA IC, 4,992 Logic Elements, 240-BFQFP

The EPF10K100EQI240-3 is a FLEX-10KE family field programmable gate array (FPGA) designed for embedded, system-level integration. It combines a logic array with embedded array blocks (EABs) to implement memory and specialized logic functions within a single surface-mount device.

Targeted at industrial applications, this device provides 4,992 logic elements, 49,152 bits of on-chip RAM, and 189 I/O pins in a 240-pin BFQFP package, offering a balance of integration, I/O capacity, and operating robustness for mid-density FPGA designs.

Key Features

  • Core Logic 4,992 logic elements (LEs) supporting a wide range of combinational and sequential logic functions for mid-density designs.
  • Embedded Memory 49,152 bits of embedded RAM (EABs) enabling efficient implementation of on-chip data storage and dual-port memory structures.
  • I/O Capacity 189 user I/O pins for flexible interfacing to external devices and peripherals on a single package.
  • System Gates Maximum system gate count of 257,000, providing headroom for larger logic implementations within the FLEX-10KE architecture.
  • Power and Supply Operates from an internal supply range of 2.375 V to 2.625 V consistent with the FLEX-10KE family’s 2.5-V core operation.
  • Package and Mounting 240-pin BFQFP (supplier package: 240-PQFP, 32×32) in a surface-mount form factor suitable for compact PCB layouts.
  • Industrial Temperature Grade Rated for operation from −40 °C to 85 °C to meet industrial temperature requirements.
  • Standards and Compliance RoHS-compliant manufacturing.
  • Family-Level Architecture FLEX-10KE family features such as embedded array blocks (EAB) with dual-port capability and dedicated fast carry/cascade chains, enabling efficient implementation of memory and arithmetic functions.
  • Design Ecosystem Supported by FLEX-10KE family development tools and megafunction libraries for HDL-based design entry and automatic place-and-route workflows.

Typical Applications

  • Embedded Control and Processing Integration of control logic, state machines, and custom processing functions where mid-density logic and on-chip RAM simplify system design.
  • Interface Bridging and Protocol Conversion Implement protocol translation, glue logic, and parallel-to-serial conversion using available I/O and dedicated arithmetic/cascade resources.
  • Memory and Buffering Functions On-chip EAB RAM and dual-port capability support packet buffering, FIFOs, and small shared-memory implementations.
  • Industrial Automation and Instrumentation Industrial temperature rating and surface-mount packaging make the device suitable for sensor interfacing, motor control logic, and other factory-floor applications.

Unique Advantages

  • Balanced Logic and Memory: 4,992 logic elements paired with 49,152 bits of embedded RAM provide a practical mix for designs that require both logic density and on-chip storage without external memory.
  • Compact, High-I/O Package: 189 I/O pins in a 240-pin BFQFP package enable rich external connectivity while maintaining a compact PCB footprint.
  • Industrial Robustness: −40 °C to 85 °C operating range supports deployment in industrial environments.
  • Family-Level Performance Features: FLEX-10KE architecture includes dual-port EABs and dedicated carry/cascade chains that simplify implementation of arithmetic and high-speed logic functions.
  • Surface-Mount Convenience: Standard surface-mount BFQFP package supports automated assembly and typical PCB manufacturing flows.
  • RoHS Compliance: Environmentally compliant manufacturing supports global electronic product requirements.

Why Choose EPF10K100EQI240-3?

The EPF10K100EQI240-3 positions itself as a mid-density, industrial-grade FPGA suitable for embedded system integration where a combination of logic capacity, on-chip RAM, and substantial I/O are required. Its FLEX-10KE family architecture brings embedded array blocks and dedicated interconnect resources that streamline implementation of memory-intensive and arithmetic-heavy functions.

This device is a practical choice for engineers building industrial control, interface bridging, and embedded processing solutions that demand a balance of integration, robustness, and established design tool support.

Request a quote or submit a pricing inquiry to get lead-time and availability information for the EPF10K100EQI240-3.

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