EPF10K10AQC208-1

The EPF10K10AQC208-1 is a member of the FLEX 10K embedded programmable logic device family, offering a moderate-density FPGA fabric with on-chip embedded memory and a rich I/O complement. It is designed for commercial embedded applications requiring system-level integration, configurable logic, and dedicated memory blocks for megafunctions.

Built for System-on-a-Programmable-Chip (SOPC) integration, this device targets embedded and interface-oriented designs where compact logic capacity, configurable I/O, and in-circuit reconfigurability are valuable.

Key Features

• Logic Capacity — 576 logic elements and 72 logic array blocks delivering approximately 31,000 maximum system gates for implementing control, glue logic, and mid-range combinational/sequential designs.
• Embedded Memory — 6,144 total RAM bits provided across 3 embedded array blocks (EABs) for on-chip buffering, FIFOs, and small memory structures.
• I/O and Packaging — 134 user I/O pins in a 208-BFQFP (208-PQFP, 28×28) surface-mount package suitable for compact board layouts and high-density connector interfacing.
• Power and Supply — Operates from a 3.0 V to 3.6 V supply range, matching 3.3 V system environments.
• Temperature and Grade — Commercial grade with an operating temperature range of 0 °C to 70 °C, intended for standard commercial applications.
• Built-in Test and Reconfiguration — Includes JTAG boundary-scan (IEEE 1149.1) circuitry and supports in-circuit reconfigurability via external configuration device, intelligent controller, or JTAG port.
• Family-Level System Features — FLEX 10K family capabilities such as FastTrack interconnect, dedicated carry and cascade chains, ClockLock/ClockBoost options, programmable slew-rate control, and peripheral integration features to support complex logic and timing requirements.
• Standards and Compliance — RoHS compliant and supports family-level features for PCI compatibility where applicable within the FLEX 10K family.

Typical Applications

• Embedded Control and Glue Logic — Implement state machines, protocol translation, and glue logic between processors and peripherals using the device’s logic elements and dedicated interconnect features.
• Memory and Buffering Functions — Use on-chip embedded RAM blocks for small FIFOs, buffering, and temporary storage in data-path and interface designs.
• Peripheral Interface and Bus Support — Integrate peripheral logic or implement bus interface functions leveraging the device’s flexible I/O and JTAG-based configuration.
• Prototyping and System Integration — Rapidly iterate custom logic and megafunction integration for SOPC use cases in commercial equipment development.

Unique Advantages

• Balanced Logic and Memory — A combination of 576 logic elements and 6,144 bits of embedded RAM enables mid-density designs that require both logic and on-chip storage without external memory for small datasets.
• Compact, Surface-Mount Package — 208-BFQFP (28×28) package offers a compact footprint for space-constrained commercial boards while providing ample I/O for peripheral connectivity.
• Flexible System Integration — Family-level features such as dedicated carry/cascade chains and FastTrack interconnect simplify implementation of arithmetic functions and predictable routing for reliable timing.
• In-Circuit Reconfigurability and Test — JTAG boundary-scan and multiple configuration options reduce development time and simplify board-level diagnostics and reprogramming.
• Designed for 3.3 V Environments — Specified 3.0 V to 3.6 V supply compatibility aligns the device with common 3.3 V commercial systems.
• Regulatory and Environmental — RoHS-compliant construction supports regulatory requirements for commercial electronic products.

Why Choose EPF10K10AQC208-1?

The EPF10K10AQC208-1 positions itself as a practical, commercially graded FPGA choice for designers needing a balance of configurable logic, embedded memory, and flexible I/O in a compact surface-mount package. Its combination of 576 logic elements, 6,144 bits of on-chip RAM, and family-level interconnect and timing features provides a capable platform for embedded control, interface bridging, and SOPC-style integration.

This device is well suited to development teams and product designers working on commercial equipment who require predictable routing, built-in testability, and multiple configuration options to shorten development cycles and simplify system integration.

Request a quote or submit an inquiry to obtain pricing and availability for the EPF10K10AQC208-1.