EPF10K10AQC208-2

IC FPGA 134 I/O 208QFP
Part Description

FLEX-10KA® Field Programmable Gate Array (FPGA) IC 134 6144 576 208-BFQFP

Quantity 654 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O134Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs72Number of Logic Elements/Cells576
Number of Gates31000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits6144

Overview of EPF10K10AQC208-2 – FLEX-10KA® FPGA, 208-BFQFP

The EPF10K10AQC208-2 is a FLEX 10KA family Field Programmable Gate Array (FPGA) offered in a 208-pin BFQFP package for surface-mount assembly. It combines a logic array and embedded array architecture to deliver on-chip programmable logic and embedded memory for system-level integration, enabling implementation of megafunctions, memory, and specialized logic functions.

Targeted at commercial embedded designs, this device provides a balance of logic resources, on-chip RAM, flexible I/O, and in-circuit reconfigurability to support system-on-a-programmable-chip (SOPC) integration and interface bridging in a compact package.

Key Features

  • Logic Capacity — 576 logic elements and 72 logic array blocks (LABs) provide programmable fabric for implementing custom digital logic and control functions.
  • Gate Count — Approximately 31,000 system gates for combined logic and RAM resources.
  • Embedded Memory — 6,144 total RAM bits that support on-chip data buffering and small memory megafunctions.
  • I/O — 134 user I/O pins offering flexible external interfacing within the 208-pin package.
  • Power — 3 V to 3.6 V supply range suitable for 3.3 V system domains.
  • Package & Mounting — 208-BFQFP (208-PQFP, 28×28) surface-mount package for board-level integration and compact footprints.
  • Operating Range & Grade — Commercial grade device with an operating temperature range of 0 °C to 70 °C.
  • Configuration & Test — Supports in-circuit reconfigurability and includes IEEE 1149.1 JTAG boundary-scan test circuitry (built-in), enabling configuration and board-level test without consuming core logic.
  • Family-Level Capabilities — FLEX 10KA family features such as embedded array for megafunctions, multi-volt I/O support, and low-skew clock distribution (as documented for the family).
  • Compliance — RoHS compliant material status.

Typical Applications

  • System Integration — Implement SOPC-style integration and on-chip megafunctions such as embedded memory and specialized logic to reduce external components.
  • Interface Bridging — Use available I/O and programmable logic to implement custom protocol adaptation and signal interfacing between subsystems.
  • Prototyping & Low- to Mid-density Designs — Leverage the device’s logic elements and embedded RAM for proof-of-concept designs and small production runs in commercial products.
  • Board-level Test & Configuration — Utilize the built-in JTAG boundary-scan for board test and in-circuit reconfiguration during development and manufacturing.

Unique Advantages

  • Integrated Logic and Memory: 576 logic elements combined with 6,144 RAM bits allow on-chip implementation of control, buffering, and small memory megafunctions to reduce external BOM.
  • Flexible I/O Count: 134 user I/O pins in a 208-pin BFQFP package provide broad external connectivity without requiring a larger package.
  • Commercial-ready Voltage Range: 3 V to 3.6 V supply compatibility for 3.3 V system domains simplifies power design for typical embedded applications.
  • In-circuit Reconfigurability and JTAG: On-board reconfiguration options plus IEEE 1149.1 boundary-scan support simplify development, debugging, and production test flows.
  • Compact Surface-mount Package: 208-PQFP (28×28) surface-mount footprint supports space-constrained PCBs while retaining substantial I/O and logic resources.
  • RoHS Compliant: Meets RoHS material requirements for environmentally conscious product designs.

Why Choose EPF10K10AQC208-2?

The EPF10K10AQC208-2 positions itself as a commercial-grade, mid-density FPGA option within the FLEX 10KA family, offering a practical balance of logic elements, embedded RAM, and I/O in a 208-pin BFQFP package. Its built-in configuration and boundary-scan features, along with family-level architectural benefits such as embedded arrays and multi-volt I/O support, make it suitable for designers implementing system-level integration and custom interface logic.

For teams developing commercial embedded products that require on-chip memory, flexible I/O, and board-level testability, the EPF10K10AQC208-2 provides a focused, verifiable platform with documented family capabilities and 100% functional testing at the device level as described in the FLEX 10K data materials.

Request a quote or submit an inquiry to receive pricing and availability information for the EPF10K10AQC208-2. Our team can provide lead-time and quotation details to support your procurement and design planning.

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