EPF10K10ATC100-1
| Part Description |
FLEX-10KA® Field Programmable Gate Array (FPGA) IC 66 6144 576 100-TQFP |
|---|---|
| Quantity | 915 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TQFP (14x14) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-TQFP | Number of I/O | 66 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 72 | Number of Logic Elements/Cells | 576 | ||
| Number of Gates | 31000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 6144 |
Overview of EPF10K10ATC100-1 – FLEX-10KA® Field Programmable Gate Array (FPGA) IC 66 I/O, 6,144-bit RAM, 576 Logic Elements, 100-TQFP
The EPF10K10ATC100-1 is a FLEX 10KA family embedded programmable logic device (FPGA/PLD) offered by Intel. It combines a logic array with embedded memory blocks for implementing specialized functions and efficient on-chip storage, enabling compact system-level integration.
Targeted at commercial-temperature applications, this device delivers moderate logic capacity with on-chip RAM and flexible I/O in a compact 100-TQFP (14×14) surface-mount package—suitable for designs that require reconfigurable logic, embedded memory, and straightforward board-level integration.
Key Features
- Logic Capacity — 576 logic elements (LEs) providing approximately 31,000 system gates for implementing control, glue logic, and mid-density digital functions.
- Embedded Memory — 6,144 bits of on-chip RAM, supported by embedded array blocks for efficient implementation of FIFOs, buffers, and small data stores.
- I/O and Package — 66 user I/O pins in a 100-TQFP (14×14) surface-mount package, balancing accessible signal count with a compact board footprint.
- Power and Voltage — Operates from 3.0 V to 3.6 V supply, compatible with common 3.3 V system domains.
- Configuration and Test — In-circuit reconfigurability via external configuration devices or JTAG; includes IEEE Std. 1149.1 boundary-scan test support without consuming device logic.
- Commercial Temperature Grade — Specified for 0 °C to 70 °C operation for standard commercial applications.
- Family-Level Capabilities — FLEX 10KA architecture supports features such as dedicated carry/cascade chains, flexible interconnect, and clock management options for predictable timing and arithmetic acceleration.
- RoHS Compliant — Device meets RoHS environmental compliance requirements.
Typical Applications
- Embedded Control — Implement control logic, state machines, and protocol handlers for consumer and commercial electronic systems using the device’s logic and embedded RAM.
- Memory and Buffering — Use the on-chip RAM for small buffering, FIFO queues, or lookup tables that reduce external memory requirements and simplify board design.
- I/O Bridging and Glue Logic — Route and condition signals between subsystems with configurable I/O and programmable logic to adapt interfaces without changing hardware.
- Prototyping and System Integration — Rapidly iterate hardware functions and integrate multiple functions into a single device to shorten development cycles.
Unique Advantages
- Balanced Logic and Memory — 576 logic elements combined with 6,144 bits of embedded RAM allow mixed logic-plus-storage functions within one device, reducing bill-of-materials and board complexity.
- Compact Surface-Mount Package — 100-TQFP (14×14) package delivers a practical pin count (66 I/O) and small footprint for space-constrained designs.
- 3.3 V System Compatibility — 3.0 V to 3.6 V operating range aligns with common 3.3 V system supplies for straightforward power integration.
- In-System Reconfigurability — Support for external configuration and JTAG enables iterative development, field updates, and boundary-scan testability without consuming logic resources.
- Commercial-Grade Reliability — Specified for 0 °C to 70 °C operation, making the device suitable for a wide range of commercial and consumer product environments.
- Standards-Based Test Support — Built-in IEEE 1149.1 JTAG boundary-scan facilitates manufacturing test and system diagnostics.
Why Choose EPF10K10ATC100-1?
The EPF10K10ATC100-1 is positioned for designs that need a moderate amount of programmable logic and embedded memory in a compact, surface-mount package. Its combination of 576 logic elements, 6,144 bits of on-chip RAM, and 66 I/O pins makes it well suited for glue logic, control tasks, small FIFOs, and incremental system consolidation in commercial-temperature applications.
Engineers seeking a reconfigurable solution with JTAG testability, 3.3 V operation, and a practical package will find the EPF10K10ATC100-1 delivers a balanced mix of integration and flexibility for iterative development and production designs.
If you would like pricing, availability, or to request a quote for EPF10K10ATC100-1, submit a quote request or contact sales to initiate procurement and technical support.

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