EPF10K10ATC100-3N

IC FPGA 66 I/O 100TQFP
Part Description

FLEX-10KA® Field Programmable Gate Array (FPGA) IC 66 6144 576 100-TQFP

Quantity 362 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 70°C
Package / Case100-TQFPNumber of I/O66Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs72Number of Logic Elements/Cells576
Number of Gates31000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits6144

Overview of EPF10K10ATC100-3N – FLEX-10KA Field Programmable Gate Array, 100‑TQFP

The EPF10K10ATC100-3N is a FLEX-10KA family field programmable gate array (FPGA) offered by Intel. It combines an embedded array and a general-purpose logic array to support integration of megafunctions and custom logic in a single programmable device.

Designed for commercial applications that require medium-density programmable logic, this device provides 576 logic elements, 6,144 bits of embedded RAM, and 66 user I/O pins in a 100‑pin TQFP package, supporting a 3.0 V to 3.6 V supply and 0 °C to 70 °C operating range.

Key Features

  • Core Logic 576 logic elements providing medium-density programmable logic capacity; maximum system gate capacity up to 31,000 gates as specified for the device family.
  • Embedded Memory 6,144 total RAM bits of on-chip embedded memory for implementing small data buffers and megafunctions without external SRAM.
  • I/O and Interface Support 66 user I/O pins with per-pin programmability for output enable and slew-rate control; supports MultiVolt I/O interface options described for the FLEX 10K family.
  • Configuration and Test In-circuit reconfigurability via external configuration devices or JTAG; built-in IEEE 1149.1 JTAG boundary-scan circuitry available without consuming device logic.
  • Power and Voltage Supports a supply voltage range of 3.0 V to 3.6 V for core/IO operation relevant to 3.3 V system designs.
  • Package and Mounting 100‑TQFP (14 mm × 14 mm) surface-mount package suitable for compact PCB layouts in commercial applications.
  • Environmental Compliance RoHS compliant.

Typical Applications

  • Embedded System Integration Implement custom control logic and peripheral interfacing where on-chip RAM and reconfigurable logic simplify board-level design.
  • Communications and Protocol Bridging Use programmable I/O and logic resources to implement protocol converters, interface glue, and custom timing logic.
  • Prototyping and Development Medium-density FPGA resource set makes this device suitable for proof-of-concept designs and iterative firmware/hardware co-development.
  • Custom Peripheral Control Manage sensor interfaces, small state machines, and glue logic for devices requiring flexible I/O and in-field configurability.

Unique Advantages

  • Balanced Integration: Offers a combination of embedded memory and logic elements that reduces the need for external components in many designs.
  • Reconfigurability: Support for in-circuit reconfiguration and JTAG boundary-scan enables iterative development and field updates without redesigning hardware.
  • Commercial‑grade Compatibility: Specified for 0 °C to 70 °C operation and a 3.0–3.6 V supply, aligning with common commercial system requirements.
  • Compact Packaging: 100‑pin TQFP package provides a compact footprint for space-constrained PCBs while offering a generous number of I/O pins.
  • Standby Power Characteristics: Family-level documentation indicates low standby power behavior for FLEX 10K devices, aiding low-power design considerations.

Why Choose EPF10K10ATC100-3N?

The EPF10K10ATC100-3N delivers medium-density programmable logic, embedded memory, and flexible I/O in a compact 100‑TQFP package, making it suitable for commercial embedded designs that require on-chip integration of logic and small data buffers. Its support for in-circuit reconfiguration and built-in JTAG boundary-scan simplifies development, testing, and field updates.

Choose this device when you need a commercially graded, reconfigurable solution with 576 logic elements, 6,144 bits of embedded RAM, and 66 user I/Os for scalable prototyping and deployed applications that match the listed electrical and thermal specifications.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the EPF10K10ATC100-3N.

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