EPF10K10ATC100-3N
| Part Description |
FLEX-10KA® Field Programmable Gate Array (FPGA) IC 66 6144 576 100-TQFP |
|---|---|
| Quantity | 362 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TQFP (14x14) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-TQFP | Number of I/O | 66 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 72 | Number of Logic Elements/Cells | 576 | ||
| Number of Gates | 31000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 6144 |
Overview of EPF10K10ATC100-3N – FLEX-10KA Field Programmable Gate Array, 100‑TQFP
The EPF10K10ATC100-3N is a FLEX-10KA family field programmable gate array (FPGA) offered by Intel. It combines an embedded array and a general-purpose logic array to support integration of megafunctions and custom logic in a single programmable device.
Designed for commercial applications that require medium-density programmable logic, this device provides 576 logic elements, 6,144 bits of embedded RAM, and 66 user I/O pins in a 100‑pin TQFP package, supporting a 3.0 V to 3.6 V supply and 0 °C to 70 °C operating range.
Key Features
- Core Logic 576 logic elements providing medium-density programmable logic capacity; maximum system gate capacity up to 31,000 gates as specified for the device family.
- Embedded Memory 6,144 total RAM bits of on-chip embedded memory for implementing small data buffers and megafunctions without external SRAM.
- I/O and Interface Support 66 user I/O pins with per-pin programmability for output enable and slew-rate control; supports MultiVolt I/O interface options described for the FLEX 10K family.
- Configuration and Test In-circuit reconfigurability via external configuration devices or JTAG; built-in IEEE 1149.1 JTAG boundary-scan circuitry available without consuming device logic.
- Power and Voltage Supports a supply voltage range of 3.0 V to 3.6 V for core/IO operation relevant to 3.3 V system designs.
- Package and Mounting 100‑TQFP (14 mm × 14 mm) surface-mount package suitable for compact PCB layouts in commercial applications.
- Environmental Compliance RoHS compliant.
Typical Applications
- Embedded System Integration Implement custom control logic and peripheral interfacing where on-chip RAM and reconfigurable logic simplify board-level design.
- Communications and Protocol Bridging Use programmable I/O and logic resources to implement protocol converters, interface glue, and custom timing logic.
- Prototyping and Development Medium-density FPGA resource set makes this device suitable for proof-of-concept designs and iterative firmware/hardware co-development.
- Custom Peripheral Control Manage sensor interfaces, small state machines, and glue logic for devices requiring flexible I/O and in-field configurability.
Unique Advantages
- Balanced Integration: Offers a combination of embedded memory and logic elements that reduces the need for external components in many designs.
- Reconfigurability: Support for in-circuit reconfiguration and JTAG boundary-scan enables iterative development and field updates without redesigning hardware.
- Commercial‑grade Compatibility: Specified for 0 °C to 70 °C operation and a 3.0–3.6 V supply, aligning with common commercial system requirements.
- Compact Packaging: 100‑pin TQFP package provides a compact footprint for space-constrained PCBs while offering a generous number of I/O pins.
- Standby Power Characteristics: Family-level documentation indicates low standby power behavior for FLEX 10K devices, aiding low-power design considerations.
Why Choose EPF10K10ATC100-3N?
The EPF10K10ATC100-3N delivers medium-density programmable logic, embedded memory, and flexible I/O in a compact 100‑TQFP package, making it suitable for commercial embedded designs that require on-chip integration of logic and small data buffers. Its support for in-circuit reconfiguration and built-in JTAG boundary-scan simplifies development, testing, and field updates.
Choose this device when you need a commercially graded, reconfigurable solution with 576 logic elements, 6,144 bits of embedded RAM, and 66 user I/Os for scalable prototyping and deployed applications that match the listed electrical and thermal specifications.
Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the EPF10K10ATC100-3N.

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