EPF10K10AQC208-3

The EPF10K10AQC208-3 is a FLEX 10KA family field-programmable gate array delivering embedded programmable logic and dedicated memory resources in a 208‑pin BFQFP package. Designed for system-level integration, the device combines a logic array with embedded array blocks to implement megafunctions such as efficient on-chip memory and specialized logic functions.

This commercial-grade, surface-mount FPGA targets embedded and system designers who need moderate logic capacity, embedded RAM, and flexible I/O in a compact package, with support for in-circuit reconfigurability and JTAG boundary-scan for development and test.

Key Features

• Logic Capacity — 576 logic elements across 72 logic array blocks, providing up to approximately 31,000 system gates for implementing combinational and sequential logic.
• Embedded Memory — Total RAM of 6,144 bits implemented in the device’s embedded array blocks, enabling on‑chip storage for buffers, FIFOs, and small lookup tables.
• I/O and Interconnect — 134 user I/O pins with flexible I/O options; family-level features include MultiVolt I/O support and 5.0‑V tolerant input pins in FLEX 10KA devices, enabling mixed-voltage interfacing where applicable.
• System and Test — In-circuit reconfigurability (ICR) via external configuration device or JTAG; built-in JTAG boundary-scan test circuitry compliant with IEEE Std. 1149.1‑1990.
• Clocking and Performance — Family-level features include low‑skew clock distribution, ClockLock and ClockBoost options for reduced clock delay/skew and clock multiplication, and dedicated carry/cascade chains for arithmetic and high‑fan‑in logic.
• Package, Supply and Temperature — Surface-mount 208‑BFQFP (supplier package 208‑PQFP, 28×28 mm); supply voltage 3.0 V to 3.6 V; commercial operating range 0 °C to 70 °C.
• Compliance — RoHS compliant.

Typical Applications

• System-on-a-Programmable-Chip (SOPC) integration — Implement on-chip megafunctions and combine logic and embedded memory to consolidate board-level functions.
• Embedded control and glue logic — Replace discrete glue logic and implement custom peripheral interfaces and control logic using the device’s logic elements and I/O.
• Memory-backed functions — Use the 6,144 bits of embedded RAM for small buffers, FIFOs, and lookup tables that support data-path and control operations.
• Development, prototyping and test — In-circuit reconfigurability and IEEE‑1149.1 JTAG support simplify development cycles, programming, and boundary-scan test.
• PCI and bus peripherals — Family-level support for PCI Local Bus (as described for FLEX 10K/10KA devices) enables implementation of bus-aware peripherals where applicable.

Unique Advantages

• Balanced logic and memory in a compact package: 576 logic elements and 6,144 bits of embedded RAM provide a useful mix of resources for mid-density designs without large-package complexity.
• Flexible I/O for mixed-voltage systems: MultiVolt I/O support and 5.0‑V tolerant inputs (FLEX 10KA family) help interface with a range of board-level voltage domains.
• Development and test friendliness: Built-in JTAG boundary-scan and in-circuit reconfigurability simplify programming, debugging, and manufacturing test flows.
• Deterministic clock distribution: Low-skew clock trees plus ClockLock/ClockBoost options (family features) support reliable timing for synchronous designs.
• RoHS and surface-mount readiness: RoHS compliance and a 208‑pin BFQFP surface-mount package support modern manufacturing and environmental requirements.

Why Choose EPF10K10AQC208-3?

The EPF10K10AQC208-3 positions itself as a practical mid-density FLEX 10KA FPGA for embedded applications that require a combination of programmable logic, embedded RAM, and flexible I/O in a compact, commercial-grade package. Its balance of 576 logic elements, 72 logic array blocks, and 6,144 bits of embedded memory makes it suitable for designers implementing SOPC-style integration, peripheral logic, and on-chip memory-backed functions.

With in-circuit reconfigurability, IEEE‑1149.1 JTAG support, and family-level features such as MultiVolt I/O and dedicated arithmetic/cascade chains, this device offers a development- and production-friendly platform that scales with common embedded design needs while remaining within commercial temperature and supply ranges.

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