EPF10K100EQC240-3N
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 189 49152 4992 240-BFQFP |
|---|---|
| Quantity | 345 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP | Number of I/O | 189 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 624 | Number of Logic Elements/Cells | 4992 | ||
| Number of Gates | 257000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49152 |
Overview of EPF10K100EQC240-3N – FLEX-10KE® Field Programmable Gate Array (FPGA) IC 189 49152 4992 240-BFQFP
The EPF10K100EQC240-3N from Intel is a FLEX-10KE family field programmable gate array (FPGA) optimized for system-level programmable logic integration. It provides a balance of logic capacity, embedded memory, and I/O density for designs that require on-chip configurable logic and memory resources.
This device is suited for applications that need reconfigurable logic, embedded memory blocks and a substantial number of user I/Os, offering in-circuit reconfigurability and built-in test capabilities to support development and production workflows.
Key Features
- Logic Capacity 4,992 logic elements and approximately 257,000 gates provide programmable logic resources for implementing custom combinational and sequential functions.
- Embedded Memory Total on-chip RAM of 49,152 bits supports local data storage and buffering for state machines, FIFOs and small data caches.
- I/O Density 189 user I/O pins allow broad external interfacing for control signals, buses and peripheral connectivity.
- Reconfigurability & Test In-circuit reconfigurability and built-in JTAG boundary-scan test circuitry (per family datasheet) enable iterative development and board-level test without consuming device logic.
- Clocking Family-level features include low-skew clock distribution and options such as ClockLock and ClockBoost for reduced clock delay and clock multiplication (as described in the family datasheet).
- Power Supply Specified supply range of 2.375 V to 2.625 V for the device core.
- Package & Mounting 240-BFQFP surface-mount package (supplier device package: 240-PQFP, 32×32) for PCB assembly.
- Operating Range & Grade Commercial-grade operation from 0 °C to 70 °C.
- Regulatory Status RoHS compliant.
Typical Applications
- System-on-Programmable-Chip (SOPC) integration Use embedded logic and memory to implement megafunctions and integrate controllers and glue logic on a single programmable device.
- Embedded control and interface logic Leverage the device’s I/O count and logic elements for control planes, protocol bridges and peripheral interfaces.
- Memory-centric functions Employ on-chip RAM for small buffers, lookup tables or state storage within data-path or control subsystems.
- Prototyping and development In-circuit reconfigurability and JTAG support facilitate iterative design, validation and board bring-up.
Unique Advantages
- Balanced logic and memory resources: 4,992 logic elements combined with 49,152 bits of on-chip RAM allow mixed compute-and-storage designs without immediate external memory dependence.
- High I/O count: 189 user I/Os enable flexible external connectivity, reducing the need for additional interface components.
- Reconfigurable development cycle: In-circuit reconfigurability and built-in JTAG test support speed up iteration, programming and board-level diagnostics.
- Deterministic clocking options: Low-skew clock distribution and family clocking features help maintain timing integrity for synchronous designs.
- Surface-mount package for compact boards: 240-pin BFQFP package (32×32 PQFP footprint) supports dense PCB layouts while remaining surface-mount assembly friendly.
- Compliance and supply compatibility: RoHS compliance and a defined core supply range simplify selection for commercial designs and manufacturing.
Why Choose EPF10K100EQC240-3N?
The EPF10K100EQC240-3N delivers a practical mix of logic elements, embedded memory and I/O capacity in a commercial-grade FLEX-10KE device from Intel. It is well suited to designers needing configurable on-chip resources for SOPC-style integration, embedded control, interface bridging and prototyping.
For teams focused on iterative development and board-level testability, the device’s in-circuit reconfigurability and JTAG boundary-scan support help reduce development time and simplify production diagnostics. Its package and supply specifications make it straightforward to integrate into compact, surface-mount PCB designs targeted at commercial applications.
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