EPF81188GM232-3

The EPF81188GM232-3 is a FLEX 8000 Field Programmable Gate Array from Altera in a 232-pin CPGA through-hole package. It provides a compact programmable-logic solution with 1,008 logic elements and approximately 12,000 gates, alongside 180 user I/O pins.

Designed for applications that require a robust voltage supply range (4.5 V to 5.5 V) and extended operating temperature, this military-grade device supports deployment in environments specified from -55 °C to 125 °C while maintaining a through-hole footprint for legacy and custom board designs.

Key Features

• Core / Architecture  FLEX 8000 family FPGA packaged as EPF81188GM232-3, suitable for reconfigurable digital logic implementations.
• Logic Capacity  1,008 logic elements providing approximately 12,000 gates for implementing moderate-complexity custom logic.
• I/O Density  180 user I/O pins to support multiple parallel interfaces, peripheral control, and board-level interconnect requirements.
• Power  Supports a standard supply range of 4.5 V to 5.5 V for compatibility with common system rails.
• Packaging & Mounting  232-pin ceramic CPGA in a through-hole mounting format for robust mechanical retention and ease of replacement on legacy or rugged boards.
• Temperature & Grade  Military grade device rated for operation from -55 °C to 125 °C for use in demanding thermal environments.
• Compliance  RoHS-compliant.

Typical Applications

• Military and Defense Systems  Implement custom control and interface logic where military-grade temperature range and rugged packaging are required.
• Industrial Control and Instrumentation  Provide programmable I/O aggregation and control functions on boards that use 5 V rails and require through-hole mounting.
• Communications and Protocol Bridging  Use the device’s 180 I/O pins and reprogrammable logic to implement protocol conversion, parallel interfaces, or glue logic between subsystems.
• Prototyping and Legacy Upgrades  Through-hole 232-CPGA package simplifies integration into existing board designs and allows field-replaceable FPGA implementations.

Unique Advantages

• Military-grade temperature tolerance: Engineered for operation from -55 °C to 125 °C to meet demanding environmental requirements.
• Substantial I/O capacity: 180 user I/O pins enable dense peripheral and interface connectivity without external I/O expanders.
• Balanced logic density: 1,008 logic elements and ~12,000 gates provide a focused solution for moderate-complexity custom logic implementations.
• Robust through-hole package: 232-CPGA mounting offers mechanical durability and straightforward replacement on legacy and ruggedized PCBs.
• Standard 5 V supply compatibility: Operates from 4.5 V to 5.5 V, simplifying integration with common system power rails.
• RoHS compliant: Meets current lead-free and environmental requirements for many global applications.

Why Choose EPF81188GM232-3?

The EPF81188GM232-3 delivers a practical mix of reprogrammable logic, extensive I/O, and rugged packaging in a military-grade FPGA. Its electrical and environmental specifications make it well suited for systems that require dependable operation across wide temperature ranges while using standard 5 V power rails.

This device is ideal for designers and procurement teams building moderate-complexity embedded systems, field-replaceable modules, or legacy board upgrades where through-hole mounting, high I/O count, and proven logic capacity are priorities. Choosing this EPF81188GM232-3 supports scalable, reconfigurable designs with long-term deployment stability.

Request a quote or submit a purchase inquiry to receive pricing and availability information for the EPF81188GM232-3. Our team will process your request and provide the details you need to move your design forward.